JPS6481866A - Composition for forming electrically conductive coating film - Google Patents

Composition for forming electrically conductive coating film

Info

Publication number
JPS6481866A
JPS6481866A JP23848087A JP23848087A JPS6481866A JP S6481866 A JPS6481866 A JP S6481866A JP 23848087 A JP23848087 A JP 23848087A JP 23848087 A JP23848087 A JP 23848087A JP S6481866 A JPS6481866 A JP S6481866A
Authority
JP
Japan
Prior art keywords
powder
composition
electrically conductive
coating film
conductive coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23848087A
Other languages
Japanese (ja)
Inventor
Yasuto Kudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP23848087A priority Critical patent/JPS6481866A/en
Publication of JPS6481866A publication Critical patent/JPS6481866A/en
Pending legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)

Abstract

PURPOSE:To obtain the titled composition containing an organic vehicle and a solid component consisting of glass powder having a specific softening point, palladium powder and copper powder at specific ratios, having excellent wettability with solder and exhibiting high adhesive strength and aging strength. CONSTITUTION:The objective composition contains (A) a solid component composed of (i) 1-10wt.% of glass powder having a softening point of 400-700 deg.C (e.g. borosilicate flint glass), (ii) 0.03-0.5wt.% of palladium powder and (iii) remaining part of copper powder (the sum is 100wt.%; the powder preferably has an average particle diameter of <=2mum and is almost free from particles of >=10mum in diameter) and (B) an organic vehicle (e.g. methacrylate polymer, etc., dissolved in a solvent such as terpineol, butyl carbitol or toluene).
JP23848087A 1987-09-22 1987-09-22 Composition for forming electrically conductive coating film Pending JPS6481866A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23848087A JPS6481866A (en) 1987-09-22 1987-09-22 Composition for forming electrically conductive coating film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23848087A JPS6481866A (en) 1987-09-22 1987-09-22 Composition for forming electrically conductive coating film

Publications (1)

Publication Number Publication Date
JPS6481866A true JPS6481866A (en) 1989-03-28

Family

ID=17030869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23848087A Pending JPS6481866A (en) 1987-09-22 1987-09-22 Composition for forming electrically conductive coating film

Country Status (1)

Country Link
JP (1) JPS6481866A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5329087A (en) * 1993-06-07 1994-07-12 Brad A. Kohl Syringe needle destruction method and apparatus
US5336301A (en) * 1992-02-20 1994-08-09 Murata Manufacturing Co., Ltd. Conductive copper paste
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5336301A (en) * 1992-02-20 1994-08-09 Murata Manufacturing Co., Ltd. Conductive copper paste
US5329087A (en) * 1993-06-07 1994-07-12 Brad A. Kohl Syringe needle destruction method and apparatus

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