MX2020010339A - Material para terminal de cobre recubierta con estaño y método de fabricación del mismo. - Google Patents

Material para terminal de cobre recubierta con estaño y método de fabricación del mismo.

Info

Publication number
MX2020010339A
MX2020010339A MX2020010339A MX2020010339A MX2020010339A MX 2020010339 A MX2020010339 A MX 2020010339A MX 2020010339 A MX2020010339 A MX 2020010339A MX 2020010339 A MX2020010339 A MX 2020010339A MX 2020010339 A MX2020010339 A MX 2020010339A
Authority
MX
Mexico
Prior art keywords
tin
sub
copper
layer
alloy layer
Prior art date
Application number
MX2020010339A
Other languages
English (en)
Inventor
Kazunari Maki
Yuki Inoue
Kiyotaka Nakaya
Shinichi Funaki
Fuyumi Mawatari
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of MX2020010339A publication Critical patent/MX2020010339A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

Sobre el sustrato hecho de cobre o de una aleación de cobre de un material para terminal de cobre recubierta con estaño, son laminadas, en este orden, una capa de níquel o de una aleación de níquel, una capa de una aleación de cobre-estaño, y una capa de estaño; en este material, la capa de estaño tiene un grosor promedio que va desde 0.2 µm hasta 1.2 µm inclusive; la capa de la aleación de cobre-estaño es una capa de un compuesto de aleación en la que el Cu6Sn5 es el ingrediente principal en donde parte del cobre en ese Cu6Sn5 es sustituido con níquel, y el tamaño promedio del grano de cristal va de 0.2 µm a 1.5 µm inclusive; parte de la capa de aleación de cobre-estaño aparece en una superficie de la capa de estaño donde se pueden observar partes de solidificación de dicho estaño asemejando a islotes; y en donde las partes de solidificación de estaño tienen un diámetro promedio que va desde 10 µm hasta 1000 µm inclusive en una dirección a lo largo de la superficie de la capa de estaño y en una relación de área con respecto a la superficie de la capa de estaño que va desde el 1% hasta el 90% inclusive.
MX2020010339A 2018-03-30 2019-03-29 Material para terminal de cobre recubierta con estaño y método de fabricación del mismo. MX2020010339A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018067620A JP7040224B2 (ja) 2018-03-30 2018-03-30 錫めっき付銅端子材及びその製造方法
PCT/JP2019/014111 WO2019189799A1 (ja) 2018-03-30 2019-03-29 錫めっき付銅端子材及びその製造方法

Publications (1)

Publication Number Publication Date
MX2020010339A true MX2020010339A (es) 2021-01-08

Family

ID=68060633

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2020010339A MX2020010339A (es) 2018-03-30 2019-03-29 Material para terminal de cobre recubierta con estaño y método de fabricación del mismo.

Country Status (8)

Country Link
US (1) US11572633B2 (es)
EP (1) EP3778995A4 (es)
JP (1) JP7040224B2 (es)
KR (1) KR20200136938A (es)
CN (1) CN111819309B (es)
MX (1) MX2020010339A (es)
TW (1) TWI783137B (es)
WO (1) WO2019189799A1 (es)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02173275A (ja) * 1988-12-26 1990-07-04 Nippon Mining Co Ltd リフローめっき材の製造方法
JPH02173279A (ja) 1988-12-26 1990-07-04 Aichi Steel Works Ltd ステンレス鋼製の線材の伸線加工における前処理方法
JPH11350188A (ja) * 1998-06-03 1999-12-21 Furukawa Electric Co Ltd:The 電気・電子部品用材料とその製造方法、およびその材料を用いた電気・電子部品
JP2002069688A (ja) * 2000-09-04 2002-03-08 Nikko Techno Service:Kk 端子・コネクター用錫合金めっき材
JP5025387B2 (ja) * 2007-08-24 2012-09-12 株式会社神戸製鋼所 接続部品用導電材料及びその製造方法
US8698002B2 (en) * 2009-01-20 2014-04-15 Mitsubishi Shindoh Co., Ltd. Conductive member and method for producing the same
JP4319247B1 (ja) * 2009-01-20 2009-08-26 三菱伸銅株式会社 導電部材及びその製造方法
JP5442316B2 (ja) 2009-05-12 2014-03-12 三菱伸銅株式会社 導電部材の製造方法
JP5385683B2 (ja) * 2009-05-22 2014-01-08 矢崎総業株式会社 コネクタ端子
EP2620275B1 (en) * 2012-01-26 2019-10-02 Mitsubishi Materials Corporation Tin-plated copper-alloy material for terminal and method for producing the same
JP5522300B1 (ja) 2012-07-02 2014-06-18 三菱マテリアル株式会社 挿抜性に優れた錫めっき銅合金端子材及びその製造方法
TW201413068A (zh) 2012-07-02 2014-04-01 Mitsubishi Materials Corp 插拔性優良之鍍錫銅合金端子材料及其製造方法
JP6221695B2 (ja) * 2013-03-25 2017-11-01 三菱マテリアル株式会社 挿抜性に優れた錫めっき銅合金端子材
JP5897084B1 (ja) 2014-08-27 2016-03-30 株式会社神戸製鋼所 耐微摺動摩耗性に優れる接続部品用導電材料
KR102113988B1 (ko) 2014-08-25 2020-05-22 가부시키가이샤 고베 세이코쇼 내미세접동마모성이 우수한 접속 부품용 도전 재료
JP6160582B2 (ja) * 2014-09-11 2017-07-12 三菱マテリアル株式会社 錫めっき銅合金端子材及びその製造方法
JP5984981B2 (ja) 2015-02-24 2016-09-06 Ｊｘ金属株式会社 電子部品用Ｓｎめっき材
KR102355341B1 (ko) * 2016-05-10 2022-01-24 미쓰비시 마테리알 가부시키가이샤 주석 도금 형성 구리 단자재 및 단자 그리고 전선 단말부 구조
JP2018067620A (ja) 2016-10-19 2018-04-26 日立化成株式会社 電気二重層キャパシタ用添加剤及び電気二重層キャパシタ
JP6423025B2 (ja) * 2017-01-17 2018-11-14 三菱伸銅株式会社 挿抜性に優れた錫めっき付銅端子材及びその製造方法

Also Published As

Publication number Publication date
TWI783137B (zh) 2022-11-11
US11572633B2 (en) 2023-02-07
KR20200136938A (ko) 2020-12-08
EP3778995A4 (en) 2021-12-22
CN111819309A (zh) 2020-10-23
WO2019189799A1 (ja) 2019-10-03
JP2019178365A (ja) 2019-10-17
TW201942421A (zh) 2019-11-01
JP7040224B2 (ja) 2022-03-23
US20210108325A1 (en) 2021-04-15
CN111819309B (zh) 2023-10-20
EP3778995A1 (en) 2021-02-17

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