WO2009050878A1 - 金属条、コネクタ、および金属条の製造方法 - Google Patents

金属条、コネクタ、および金属条の製造方法 Download PDF

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Publication number
WO2009050878A1
WO2009050878A1 PCT/JP2008/002900 JP2008002900W WO2009050878A1 WO 2009050878 A1 WO2009050878 A1 WO 2009050878A1 JP 2008002900 W JP2008002900 W JP 2008002900W WO 2009050878 A1 WO2009050878 A1 WO 2009050878A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal strip
plating
connector
layer
compound layer
Prior art date
Application number
PCT/JP2008/002900
Other languages
English (en)
French (fr)
Inventor
Masahide Okamoto
Osamu Ikeda
Original Assignee
Hitachi, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi, Ltd. filed Critical Hitachi, Ltd.
Priority to US12/602,385 priority Critical patent/US8389854B2/en
Publication of WO2009050878A1 publication Critical patent/WO2009050878A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12639—Adjacent, identical composition, components
    • Y10T428/12646—Group VIII or IB metal-base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12722—Next to Group VIII metal-base component

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

　金属条の母材金属上にNiめっきを施し、その上に光沢剤を含まないSn-(1～4mass%)Cuめっきを施す。この金属条をSn-(1～4mass%)Cu合金の融点（固相線）以上の温度で熱処理することにより、Niめっき層の上にCu-Sn化合物層もしくはCu-Ni-Sn化合物層、Cu-Sn化合物層もしくはCu-Ni-Sn化合物層の上にSn層もしくはSn-Cu合金層を形成する。さらに、この金属条を加工してコネクタを形成する。これによって、基板へのはんだ付け性が良好で、保管時およびFPCまたはFFCへのかん合時に、端子部にウィスカが発生しない、鉛フリ-のコネクタに必要な金属条を実現することが出来る。  
PCT/JP2008/002900 2007-10-19 2008-10-14 金属条、コネクタ、および金属条の製造方法 WO2009050878A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/602,385 US8389854B2 (en) 2007-10-19 2008-10-14 Metal strip, connector, and method of manufacturing metal strip

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-271947 2007-10-19
JP2007271947A JP2009097053A (ja) 2007-10-19 2007-10-19 金属条、コネクタ、および金属条の製造方法

Publications (1)

Publication Number Publication Date
WO2009050878A1 true WO2009050878A1 (ja) 2009-04-23

Family

ID=40567165

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002900 WO2009050878A1 (ja) 2007-10-19 2008-10-14 金属条、コネクタ、および金属条の製造方法

Country Status (3)

Country Link
US (1) US8389854B2 (ja)
JP (1) JP2009097053A (ja)
WO (1) WO2009050878A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010262861A (ja) * 2009-05-08 2010-11-18 Kobe Steel Ltd プレスフィット端子
JP2016069659A (ja) * 2014-09-26 2016-05-09 株式会社オートネットワーク技術研究所 コネクタ用電気接点材料及びその製造方法
CN109309289A (zh) * 2017-07-27 2019-02-05 矢崎总业株式会社 带端子的电线

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5384382B2 (ja) * 2009-03-26 2014-01-08 株式会社神戸製鋼所 耐熱性に優れるＳｎめっき付き銅又は銅合金及びその製造方法
US8574722B2 (en) * 2011-05-09 2013-11-05 Tyco Electronics Corporation Corrosion resistant electrical conductor
US9224550B2 (en) 2012-12-26 2015-12-29 Tyco Electronics Corporation Corrosion resistant barrier formed by vapor phase tin reflow

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08176775A (ja) * 1994-12-28 1996-07-09 Furukawa Electric Co Ltd:The Ｓｎ合金めっき材
JPH11350188A (ja) * 1998-06-03 1999-12-21 Furukawa Electric Co Ltd:The 電気・電子部品用材料とその製造方法、およびその材料を用いた電気・電子部品
JP2006196323A (ja) * 2005-01-14 2006-07-27 Takamatsu Mekki:Kk 接続端子およびその製造方法
WO2008075723A1 (ja) * 2006-12-20 2008-06-26 Hitachi, Ltd. 金属条、コネクタ、および金属条の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5780172A (en) * 1995-12-18 1998-07-14 Olin Corporation Tin coated electrical connector
US5916695A (en) * 1995-12-18 1999-06-29 Olin Corporation Tin coated electrical connector
JPH10134869A (ja) * 1996-10-30 1998-05-22 Yazaki Corp 端子材料および端子
US6083633A (en) * 1997-06-16 2000-07-04 Olin Corporation Multi-layer diffusion barrier for a tin coated electrical connector
AUPQ653700A0 (en) * 2000-03-28 2000-04-20 Ceramic Fuel Cells Limited Surface treated electrically conductive metal element and method of forming same
JP3621365B2 (ja) 2000-09-18 2005-02-16 第一電子工業株式会社 電気コネクタ
US20020185716A1 (en) * 2001-05-11 2002-12-12 Abys Joseph Anthony Metal article coated with multilayer finish inhibiting whisker growth
JP4090302B2 (ja) * 2001-07-31 2008-05-28 株式会社神戸製鋼所 接続部品成形加工用導電材料板
US6759142B2 (en) 2001-07-31 2004-07-06 Kobe Steel Ltd. Plated copper alloy material and process for production thereof
JP3880877B2 (ja) 2002-03-29 2007-02-14 Ｄｏｗａホールディングス株式会社 めっきを施した銅または銅合金およびその製造方法
JP4302392B2 (ja) * 2002-11-28 2009-07-22 三菱伸銅株式会社 コネクタ端子、コネクタおよびコネクタ端子の製造方法、並びに、コネクタ用条
JP2005056605A (ja) 2003-08-06 2005-03-03 Molex Japan Co Ltd コネクタ、コネクタと接続されるケーブル又は配線基板
JP4320623B2 (ja) 2004-08-04 2009-08-26 オムロン株式会社 コネクタ端子
JP4506818B2 (ja) * 2007-11-15 2010-07-21 住友電気工業株式会社 シールドフラットケーブルの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08176775A (ja) * 1994-12-28 1996-07-09 Furukawa Electric Co Ltd:The Ｓｎ合金めっき材
JPH11350188A (ja) * 1998-06-03 1999-12-21 Furukawa Electric Co Ltd:The 電気・電子部品用材料とその製造方法、およびその材料を用いた電気・電子部品
JP2006196323A (ja) * 2005-01-14 2006-07-27 Takamatsu Mekki:Kk 接続端子およびその製造方法
WO2008075723A1 (ja) * 2006-12-20 2008-06-26 Hitachi, Ltd. 金属条、コネクタ、および金属条の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010262861A (ja) * 2009-05-08 2010-11-18 Kobe Steel Ltd プレスフィット端子
JP2016069659A (ja) * 2014-09-26 2016-05-09 株式会社オートネットワーク技術研究所 コネクタ用電気接点材料及びその製造方法
CN109309289A (zh) * 2017-07-27 2019-02-05 矢崎总业株式会社 带端子的电线

Also Published As

Publication number Publication date
US20100175908A1 (en) 2010-07-15
JP2009097053A (ja) 2009-05-07
US8389854B2 (en) 2013-03-05

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