KR970706588A - 복합 자성재료와 이 복합 자성재료를 이용한 전자파 간섭억제체(composite magnetic meterial and product for eliminating electromagnetic interference) - Google Patents

복합 자성재료와 이 복합 자성재료를 이용한 전자파 간섭억제체(composite magnetic meterial and product for eliminating electromagnetic interference)

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KR970706588A
KR970706588A KR1019970701959A KR19970701959A KR970706588A KR 970706588 A KR970706588 A KR 970706588A KR 1019970701959 A KR1019970701959 A KR 1019970701959A KR 19970701959 A KR19970701959 A KR 19970701959A KR 970706588 A KR970706588 A KR 970706588A
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magnetic material
magnetic
composite
anisotropic
soft magnetic
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KR1019970701959A
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KR100267358B1 (ko
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시게요시 요시다
미쯔하루 사또
에이슈 스가와라
유타카 시마다
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마쯔무라 토미히로
가부시끼가이샤 토킨
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
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    • H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
    • H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
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    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
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    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
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    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
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    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
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Abstract

고주파전자장치, 특히, 이동통신장치의 내부에서 전자간섭억제에 효과적인 전자파간섭억제체에 이용되는 복합자성재료를 제공하기 위해, 복합자성재료는, 연자성체분말과 유기결합제로 실질적으로 이루어지는 전기적으로 비양도성이고, 2개 이상의 이방성자계(Hk)에 의해 초래되는 자기공명을 2개 이상 가진다.
또한, 상기 복합자성재료에 있어서, 상기 이방성자계(Hk)는 서로 다른 크기를 가진다.

Description

복합 자성재료와 이 복합 자성재료를 이용한 전자파 간섭억제체(COMPOSITE MAGNETIC METERIAL AND PRODUCT FOR ELIMINATING ELECTROMAGNETIC INTERFERENCE)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제5도는 본 발명에 의한 전자간섭억제체의 특성평가에 사용하는 평가계의 개략도, 제6도는 본 발명에 의한 평가시료 1의 복합자성재료의 m-f 특성곡선을 도시한 그래프.

Claims (22)

  1. 연자성체분말과 유기결합제로 이루어지는 전기적으로 비양소성인 자성재료이며, 상기 자성재료는 서로 다른 주파수영역에 출현하는 복수의 자기공명을 가지는 것을 특징으로 하는 복합자성재료.
  2. 제1항에 있어서, 상기 서로 다른 주파수 영역에 출현하는 복수의 자기공명은 서로 다른 크기를 가지는 복수의 이방성자계(Hk)에 의해 초래되는 것을 특징으로 하는 복합자성재료.
  3. 전기적으로 비양도성을 가지며 연자성체 분말과 유기결합제로 이루어지는 복합자성재료로 이루어지며, 2개의 이상의 이방성자게(Hk)에 의해 발생하는 마이크로파 주파수영역에 출현하는 복수의 자기공명중 2개 이상의 자기공명을 가지며, 상기 이방성자계는 서로 다른 크기를 구비하고 있는 것을 특징으로 하는 전자간섭억제체.
  4. 제3항에 있어서, 상기 복합자성재료는 복수의 자기공명을 구비하고, 상기 복수의 자기공명은 각각 다른 크기의 이방성자계에 대응하여 서로 다른 주파수영역에 출현하고, 상기 복수의 자기공명중 가장 낮은 것은 상기 복합자성재료층에 의해 발생하는 전자간섭억제주파수대역의 하한보다도 낮은 주파수영역에 있는 것을 특징으로 하는 전자간섭억제체.
  5. 제4항에 있어서, 상기 연자성체분말은 서로다른 크기의 자기이방성을 가지는 적어도 2종의 연자성체분말의 혼합체인 것을 특징으로 하는 전자간섭억제체.
  6. 제4항에 있어서, 상기 연자성체분말은 표면에 산화물층을 구비하고 있는 것을 특징으로 하는 전자간섭억제체.
  7. 적어도 2종의 서로 다른 크기의 자기이방성을 가지는 연자성체분말과 유기결합제를 혼합하여 성형함으로써, 전기적으로 비양도성이며 서로 다른 크기의 이방성 자계(Hk)에 의해서 초래되는 자기공명을 적어도 두개를 가지는 복합자성체를 얻는 것을 특징으로 하는 복합자성체의 제조방법.
  8. 제7항에 있어서, 상기 연자성체분말은 표면에 산화물층을 구비하고 있는 것을 특징으로 하는 복합자성체의 제조방법.
  9. 제7항에 있어서, 상기 연자성체분말은 상기 유기결합제와 혼합하기 전단계에 또는 혼합과정중에 기상서산법 또는 액상서산법을 이용하여 산소함유혼합가스에 의해 그 표면이 산화되는 것을 특징으로 하는 복합자성체의 제조방법.
  10. 인쇄배선기판의 단면 또는 양면에 도체배선을 가지고, 도전성지지체와 상기 도전성지지체의 양면에 설비된 복합자성재료층을 가지며, 상기 복합자성재료층이 절연성을 가지는 안쇄배선기판에 있어서, 상기 복합자성 재료층은 연자성체분말과 유기결합제로 이루어지는 전기적으로 비양도성이고 2개 이상의 이방성자계(Hk)에 의해 초래되는 자기공명을 적어도 두개 가지는 복합자성재료로 이루어지며, 상기 이방성자계(Hk)는 서로 다른 크기를 가지는 것을 특징으로 하는 인쇄배선기판.
  11. 제10항에 있어서, 상기 각층중 적어도 하나는 표면에 유전체층을 구비하고 있는 것을 특징으로 하는 인쇄배선기판.
  12. 제10항에 있어서, 상기 각 층중 적어도 하나는 유전체분말을 함유하고 있는 것을 특징으로 하는 인쇄배선기판.
  13. 제10항에 있어서, 상기 복합자성재료는 복수의 자기공명을 구비하고, 상기 복수의 자기공명내의 각각 다른 크기의 이방성자계에 대응하는 서로 다른 주파수영역에서 출현하고, 상기 복수의 자기공명내에서 가장 낮은 것은 상기 복합자성재료층에 의해 발생하는 전자간섭억제주파수대역의 하한보다도 낮은 주파수 영역에 있는 것을 특징으로 하는 인쇄배선기판.
  14. 제13항에 있어서, 상기 연자성체분말은 다른 크기의 자기이방성을 가지는 적어도 2종의 연자성체분말의 혼합체인 것을 특징으로 하는 인쇄배선기판.
  15. 제14항에 있어서, 상기 연자성체분말은 센더스트, 철-니켈합금, 스피넬형페라이트, 플래너형페라이트 중 적어도 1종인 것을 특징으로 하는 인쇄배선기판.
  16. 인쇄배선기판과 상기 인쇄배선기판에 탑재된 능동소자를 가지고, 상기 능동소자가 방사유도노이즈를 발생하는 전자장치에 있어서, 상기 능동소자의 주변에 형성된 복합자성재료층을 가지며, 상기 복합자성재료층은 연자성체분말과 유기결합제로 실질적으로 이루어지는 전기적으로 비양도성이며 2개 이상의 이방성자계(Hk)에 의해 초래되는 자기공명을 적어도 두 개 가지며, 상기 이방성자계(Hk)는 서로 다른 크기를 가지는 것을 특징으로 하는 전자장치.
  17. 제16항에 있어서, 상기 복합자성재료는 복수의 자기공명을 구비하고, 상기 복수의 자기공명내의 각각 다른 크기의 이방성자계에 대응하여 서로 다른 주파수영역에서 출현하며, 상기 복수의 자기공명중 가장 낮은 것은 상기 복합자성재료층에 의해 발생하는 전자간섭억제주파수대역의 하한보다도 낮은 주파수영역에 있는 것을 특징으로 하는 전자장치.
  18. 제17항에 있어서, 상기 연자성체분말은 다른 크기의 자기이방성을 가지는 적어도 2종의 연자성체분말의 혼합체인 것을 특징으로 하는 전자장치.
  19. 제18항에 있어서, 상기 연자성체분말은 센더스트, 철-니켈합급, 스피넬형페라이트, 및 플레너형페라이트 중 적어도 1종이상인 것을 특징으로 하는 전자장치.
  20. 제16항에 있어서, 상기 복합자성재료층은 상기 인쇄배선기판과 상기 능동소자간에 형성되어 있는 것을 특징으로 하는 전자장치.
  21. 제16항에 있어서, 상기 인쇄배선기판은 복수의 도전성패턴을 표면에 구비하고, 상기 복합자성재료층은 상기 도전성패턴간에 형성되어 있는 것을 특징으로 하는 전자장치.
  22. 제16항에 있어서, 상기 복합자성재료층은 상기 능동소자를 상기 인쇄기판과 함께 덮는 커버의 안쪽에 형성되어 있는 것을 특징으로 하는 전자장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970701959A 1995-07-20 1996-07-22 복합자성체,이복합자성체를이용하는전자파간섭억제체,인쇄배선기판및전자장치와복합자성체를제조하기위한방법 KR100267358B1 (ko)

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JP7183911A JPH0935927A (ja) 1995-07-20 1995-07-20 複合磁性体及びそれを用いた電磁干渉抑制体
PCT/JP1996/002040 WO1997004469A1 (fr) 1995-07-20 1996-07-22 Materiau magnetique composite et produit pour eliminer les interferences electromagnetiques

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Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3404618B2 (ja) * 1996-09-02 2003-05-12 エヌイーシートーキン株式会社 電磁干渉抑制体
JP3475386B2 (ja) * 1997-09-01 2003-12-08 Ｎｅｃトーキン株式会社 電磁干渉抑制体
US6284363B1 (en) 1998-03-23 2001-09-04 Fuji Polymer Industries Co., Ltd. Electromagnetic wave absorbing thermoconductive silicone gel molded sheet and method for producing the same
DK1097463T3 (da) 1998-07-10 2003-02-17 Epcos Ag Magnetiserbart produkt, brugen af samme såvel som en fremgangsmåde til fremstilling af samme
JP2000058691A (ja) * 1998-08-07 2000-02-25 Sharp Corp ミリ波半導体装置
JP2000133986A (ja) * 1998-10-27 2000-05-12 Murata Mfg Co Ltd 放射ノイズ抑制部品の取付構造
US6103134A (en) * 1998-12-31 2000-08-15 Motorola, Inc. Circuit board features with reduced parasitic capacitance and method therefor
WO2001024205A1 (en) 1999-09-28 2001-04-05 Tokin Corporation Composite magnetic sheet and method of producing the same
DE19947130C1 (de) * 1999-09-30 2000-11-02 Siemens Ag Elektrisches Gerät mit in einem Gehäuse angeordneten und nach außen elektromagnetisch abgeschirmten Komponenten
JP2001126910A (ja) * 1999-10-25 2001-05-11 Tokin Corp 複合磁性体、複合磁性体シートおよびそれらの製造方法
DE10000523A1 (de) * 2000-01-08 2001-07-26 Inst Maschinen Antriebe Und El Ferrit-Compound-Material mit hoher elektromagnetischer Absorption im Frequenzbereich von 20 MHz bis 40 GHz
DE10016380C2 (de) * 2000-03-29 2002-01-24 Infineon Technologies Ag Gehäuse für ein elektrisches Bauteil
US7075163B2 (en) 2000-04-04 2006-07-11 Nec Tokin Corporation Electromagnetic noise suppressor, semiconductor device using the same, and method of manufacturing the same
JP4623244B2 (ja) 2000-04-11 2011-02-02 信越化学工業株式会社 電磁波吸収性熱伝導性シリコーンゴム組成物
DE10024439A1 (de) * 2000-05-19 2001-12-06 Koppe Franz Verguss- oder Einbettmasse mit elektromagnetischen Abschirmeigenschaften zur Herstellung elektronischer Bauteile
JP3723927B2 (ja) * 2000-07-11 2005-12-07 日本ライナー株式会社 エポキシ樹脂を短時間で硬化する方法及び、該硬化方法によって得られたエポキシ樹脂硬化物による電磁波吸収方法
JP2002064189A (ja) 2000-08-21 2002-02-28 Tokin Corp マグネティック・ランダム・アクセス・メモリ
JP3865601B2 (ja) 2001-06-12 2007-01-10 日東電工株式会社 電磁波抑制体シート
JP2002374092A (ja) * 2001-06-15 2002-12-26 Polymatech Co Ltd 放熱性電波吸収体
JP3864773B2 (ja) * 2001-12-10 2007-01-10 三菱マテリアル株式会社 広い周波数帯域の高周波に対して優れた電波吸収特性を示す電波吸収体用混合粉末および電波吸収体
DE10162637C1 (de) * 2001-12-20 2003-08-21 Eupec Gmbh & Co Kg Schaltungsanordnung mit elektronischen Bauelementen auf einem isolierenden Trägersubstrat
DE10229542B4 (de) 2002-07-01 2004-05-19 Infineon Technologies Ag Elektronisches Bauteil mit mehrschichtiger Umverdrahtungsplatte und Verfahren zur Herstellung desselben
KR100651037B1 (ko) * 2002-12-27 2006-12-01 티디케이가부시기가이샤 그래뉼러 물질, 자성박막, 자기소자
JP2004266784A (ja) * 2003-01-10 2004-09-24 Murata Mfg Co Ltd ノイズフィルタ
US7625633B2 (en) 2003-03-25 2009-12-01 Shin-Etsu Polymer., Ltd. Electromagnetic noise suppressor, article with electromagnetic noise suppressing function, and their manufacturing methods
JP4417377B2 (ja) 2004-02-24 2010-02-17 信越ポリマー株式会社 電磁波ノイズ抑制体、電磁波ノイズ抑制機能付構造体、およびそれらの製造方法
US7561114B2 (en) * 2004-12-03 2009-07-14 Nitta Corporation Electromagnetic interference suppressor, antenna device and electronic information transmitting apparatus
DE102005022473B4 (de) * 2005-05-14 2007-05-24 Forschungszentrum Karlsruhe Gmbh Vorrichtung zur Dämpfung von Reflexionen elektromagnetischer Wellen, Verfahren zu ihrer Herstellung und ihre Verwendung
KR100716679B1 (ko) * 2005-10-27 2007-05-09 한국과학기술연구원 노이즈 감쇄층, 노이즈 감쇄 회로기판 및 이들의 제조방법
KR100712836B1 (ko) * 2005-11-02 2007-05-04 한국과학기술연구원 전자기파 간섭 차폐용 다층 필름 및 이를 포함하는회로기판
US8466764B2 (en) 2006-09-12 2013-06-18 Cooper Technologies Company Low profile layered coil and cores for magnetic components
US8378777B2 (en) 2008-07-29 2013-02-19 Cooper Technologies Company Magnetic electrical device
US8941457B2 (en) 2006-09-12 2015-01-27 Cooper Technologies Company Miniature power inductor and methods of manufacture
US9589716B2 (en) 2006-09-12 2017-03-07 Cooper Technologies Company Laminated magnetic component and manufacture with soft magnetic powder polymer composite sheets
KR20110015693A (ko) * 2008-07-10 2011-02-16 알프스 덴키 가부시키가이샤 열전도성 노이즈 억제 시트
US8659379B2 (en) 2008-07-11 2014-02-25 Cooper Technologies Company Magnetic components and methods of manufacturing the same
US9859043B2 (en) 2008-07-11 2018-01-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same
JP5161813B2 (ja) * 2008-10-10 2013-03-13 Ｄｏｗａエレクトロニクス株式会社 混合フェライト粉およびその製造方法、並びに、電波吸収体
JP5912278B2 (ja) * 2011-04-06 2016-04-27 Ｎｅｃトーキン株式会社 電磁干渉抑制体
KR101209979B1 (ko) 2011-10-24 2012-12-07 엘지이노텍 주식회사 차폐장치 및 무선전력 송신장치
DE102011087263A1 (de) * 2011-11-28 2013-05-29 Lenze Drives Gmbh Abschirmvorrichtung für elektrische Einheiten
CN103377787B (zh) * 2012-04-25 2016-06-01 比亚迪股份有限公司 一种nfc磁片用浆料及其制备方法和一种nfc磁片
CN102892279B (zh) * 2012-09-06 2015-09-02 刘伟德 一种电磁屏蔽材料、应用及其制造方法
US9418780B2 (en) 2012-12-06 2016-08-16 Samsung Electronics Co., Ltd. Magnetic composite material
CN104134513A (zh) * 2013-05-02 2014-11-05 杨立章 软磁复合薄膜和制造方法及其在电子设备中的应用
WO2015173196A1 (en) * 2014-05-14 2015-11-19 Dsm Ip Assets B.V. Soft magnetic material composition and component made from the material
WO2017070843A1 (en) 2015-10-27 2017-05-04 Henkel Ag & Co. Kgaa A conductive composition for low frequency emi shielding
WO2017078404A1 (ko) * 2015-11-02 2017-05-11 주식회사 아모그린텍 형상 이방성 자성 입자, 이를 포함하는 전자파 흡수시트 및 이를 포함하는 안테나 모듈
JP6407186B2 (ja) 2016-03-23 2018-10-17 Tdk株式会社 電子回路パッケージ
CN106229104A (zh) * 2016-08-31 2016-12-14 北京康普锡威科技有限公司 一种软磁复合粉末及其磁粉芯制备方法
JP6934660B2 (ja) * 2017-07-31 2021-09-15 北川工業株式会社 電磁波抑制シート
EP3439438B1 (en) 2017-08-02 2024-10-09 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Non-uniform magnetic foil embedded in component carrier
KR102451386B1 (ko) 2018-03-30 2022-10-07 다이킨 고교 가부시키가이샤 전파 흡수 재료 및 전파 흡수 시트
WO2019235539A1 (ja) * 2018-06-08 2019-12-12 マクセルホールディングス株式会社 電磁波吸収体、および、電磁波吸収体用組成物
CN109411887B (zh) * 2018-12-07 2024-04-05 厦门大学嘉庚学院 三维镜像工型缝隙分形偶极子超宽频带天线及终端
CN114451075B (zh) * 2019-09-30 2024-03-15 京瓷株式会社 电子装置用盖体、封装件、电子装置以及电子模块

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2873225A (en) * 1957-05-20 1959-02-10 Adams Edmond Magnetic flake core
CA2005198A1 (en) * 1989-01-26 1990-07-26 Charles E. Boyer, Iii Microwave absorber employing acicular magnetic metallic filaments
JPH04108666A (ja) * 1990-08-30 1992-04-09 Tokin Corp 複合型フェライト材料及びその製造方法
JPH04352498A (ja) * 1991-05-30 1992-12-07 Mitsui Toatsu Chem Inc 高透磁率を有する電磁シールド用絶縁ペースト
JPH0595197A (ja) * 1991-10-01 1993-04-16 Mitsui Toatsu Chem Inc プリント配線板およびそれに用いる基板
JPH06251928A (ja) * 1992-12-29 1994-09-09 Sony Corp フェライト樹脂
FI117224B (fi) * 1994-01-20 2006-07-31 Nec Tokin Corp Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti
JPH0818271A (ja) * 1994-06-27 1996-01-19 Tokin Corp 電子装置およびそのノイズ抑制方法
JP3401650B2 (ja) * 1994-01-20 2003-04-28 エヌイーシートーキン株式会社 電磁波干渉抑制体
JPH0993034A (ja) * 1995-09-22 1997-04-04 Tokin Corp 複合磁性体及びその製造方法ならびに電磁干渉抑制体

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DE69604771T2 (de) 2000-03-09
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