JP6934660B2 - 電磁波抑制シート - Google Patents
電磁波抑制シート Download PDFInfo
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- JP6934660B2 JP6934660B2 JP2017147964A JP2017147964A JP6934660B2 JP 6934660 B2 JP6934660 B2 JP 6934660B2 JP 2017147964 A JP2017147964 A JP 2017147964A JP 2017147964 A JP2017147964 A JP 2017147964A JP 6934660 B2 JP6934660 B2 JP 6934660B2
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- 230000001629 suppression Effects 0.000 title claims description 26
- 239000006247 magnetic powder Substances 0.000 claims description 48
- 239000002184 metal Substances 0.000 claims description 30
- 239000004709 Chlorinated polyethylene Substances 0.000 claims description 27
- 239000002738 chelating agent Substances 0.000 claims description 25
- 230000035699 permeability Effects 0.000 claims description 23
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- 229910052698 phosphorus Inorganic materials 0.000 claims description 15
- 239000011574 phosphorus Substances 0.000 claims description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 14
- 229910052760 oxygen Inorganic materials 0.000 claims description 14
- 239000001301 oxygen Substances 0.000 claims description 14
- 230000003712 anti-aging effect Effects 0.000 claims description 13
- 230000000052 comparative effect Effects 0.000 description 23
- 238000002156 mixing Methods 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 229910002796 Si–Al Inorganic materials 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 5
- 229910000702 sendust Inorganic materials 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 230000001186 cumulative effect Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000008961 swelling Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 1
- 229910002060 Fe-Cr-Al alloy Inorganic materials 0.000 description 1
- 229910017082 Fe-Si Inorganic materials 0.000 description 1
- 229910017133 Fe—Si Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/10—Reinforcing macromolecular compounds with loose or coherent fibrous material characterised by the additives used in the polymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/11—Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
- C08L23/28—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment by reaction with halogens or compounds containing halogen
- C08L23/286—Chlorinated polyethylene
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/28—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder dispersed or suspended in a bonding agent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/26—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers modified by chemical after-treatment
- C08J2323/28—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers modified by chemical after-treatment by reaction with halogens or halogen-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Soft Magnetic Materials (AREA)
- Hard Magnetic Materials (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Description
金属磁性粉 500重量部
リン系老化防止剤 1〜10重量部
なお、本願発明においては、酸素含有量(酸化皮膜の厚さ)が大きくなれば、耐熱性を示す試験前後の厚みの変化率は小さくなるが(後述の表3参照)、キレート剤が1重量部未満であって、酸素含有量が0.7重量%程度を下回る場合、酸素含有量(酸化皮膜の厚さ)が大きくなる程、耐熱性を示す試験前後の厚みの変化率とは小さくなる傾向があることが確認された。
金属磁性粉 500重量部
リン系老化防止剤 1〜10重量部
リン系キレート剤 12重量部
金属磁性粉 350〜650重量部
リン系老化防止剤 1〜10重量部
リン系キレート剤 0.8〜15.5重量部
Claims (3)
- (A)塩素化ポリエチレン100重量部と、
(B)表面に酸化被膜が形成された金属磁性粉400〜600重量部と、
(C)リン系キレート剤1〜15重量部と、
を含有し、前記金属磁性粉の酸素含有量が0.4〜1.1重量%であり、
厚み0.5mmのシート状に成形した状態において、105度で1000時間加熱したときの前記厚みの変化率が4.8%以下である電磁波抑制シート。 - さらにリン系老化防止剤を1〜10重量部含んでいる請求項1に記載の電磁波抑制シート。
- 前記電磁波抑制シートは、105度で1000時間加熱したときのシート厚みの変化率が+0.6%から+4.8%の範囲であり、1MHzにおける透磁率が75以上である、請求項1または2に記載の電磁波抑制シート。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017147964A JP6934660B2 (ja) | 2017-07-31 | 2017-07-31 | 電磁波抑制シート |
PCT/JP2018/025889 WO2019026555A1 (ja) | 2017-07-31 | 2018-07-09 | 電磁波抑制シート |
CN201880050234.3A CN110999564B (zh) | 2017-07-31 | 2018-07-09 | 电磁波抑制片 |
US16/635,984 US11161947B2 (en) | 2017-07-31 | 2018-07-09 | Electromagnetic wave suppression sheet |
EP18840226.7A EP3664589B1 (en) | 2017-07-31 | 2018-07-09 | Electromagnetic wave suppression sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017147964A JP6934660B2 (ja) | 2017-07-31 | 2017-07-31 | 電磁波抑制シート |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019029523A JP2019029523A (ja) | 2019-02-21 |
JP2019029523A5 JP2019029523A5 (ja) | 2021-04-08 |
JP6934660B2 true JP6934660B2 (ja) | 2021-09-15 |
Family
ID=65233776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017147964A Active JP6934660B2 (ja) | 2017-07-31 | 2017-07-31 | 電磁波抑制シート |
Country Status (5)
Country | Link |
---|---|
US (1) | US11161947B2 (ja) |
EP (1) | EP3664589B1 (ja) |
JP (1) | JP6934660B2 (ja) |
CN (1) | CN110999564B (ja) |
WO (1) | WO2019026555A1 (ja) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3872041A (en) * | 1973-05-31 | 1975-03-18 | Automation Ind Inc | Thermoplastic film |
JPH098490A (ja) * | 1995-06-21 | 1997-01-10 | Nippon Paint Co Ltd | 電子機器筐体及び不要輻射波低減方法 |
US6972097B2 (en) * | 1995-07-20 | 2005-12-06 | Nec Tokin Corporation | Composite magnetic material and electromagnetic interference suppressor member using the same |
JPH0935927A (ja) * | 1995-07-20 | 1997-02-07 | Tokin Corp | 複合磁性体及びそれを用いた電磁干渉抑制体 |
JP3404618B2 (ja) * | 1996-09-02 | 2003-05-12 | エヌイーシートーキン株式会社 | 電磁干渉抑制体 |
JP2003332113A (ja) | 2002-05-08 | 2003-11-21 | Daido Steel Co Ltd | 偏平状軟磁性粉末およびそれを用いた複合磁性シート |
JP2005183864A (ja) | 2003-12-24 | 2005-07-07 | Daido Steel Co Ltd | 磁性シート |
JP5036342B2 (ja) * | 2007-02-09 | 2012-09-26 | ニッタ株式会社 | トランスポンダ、通信装置、情報管理システムおよびトランスポンダが設けられる容器 |
JP5469956B2 (ja) * | 2008-08-27 | 2014-04-16 | デクセリアルズ株式会社 | 磁性シート組成物、磁性シート、及び磁性シートの製造方法 |
JP2013093463A (ja) * | 2011-10-26 | 2013-05-16 | Nitto Denko Corp | 電磁波吸収体及び電磁波吸収体の製造方法 |
-
2017
- 2017-07-31 JP JP2017147964A patent/JP6934660B2/ja active Active
-
2018
- 2018-07-09 EP EP18840226.7A patent/EP3664589B1/en active Active
- 2018-07-09 US US16/635,984 patent/US11161947B2/en active Active
- 2018-07-09 CN CN201880050234.3A patent/CN110999564B/zh active Active
- 2018-07-09 WO PCT/JP2018/025889 patent/WO2019026555A1/ja unknown
Also Published As
Publication number | Publication date |
---|---|
WO2019026555A1 (ja) | 2019-02-07 |
EP3664589A1 (en) | 2020-06-10 |
US20210147644A1 (en) | 2021-05-20 |
US11161947B2 (en) | 2021-11-02 |
CN110999564B (zh) | 2021-07-20 |
EP3664589B1 (en) | 2023-06-28 |
JP2019029523A (ja) | 2019-02-21 |
CN110999564A (zh) | 2020-04-10 |
EP3664589A4 (en) | 2021-05-05 |
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