JP5912278B2 - 電磁干渉抑制体 - Google Patents
電磁干渉抑制体 Download PDFInfo
- Publication number
- JP5912278B2 JP5912278B2 JP2011084509A JP2011084509A JP5912278B2 JP 5912278 B2 JP5912278 B2 JP 5912278B2 JP 2011084509 A JP2011084509 A JP 2011084509A JP 2011084509 A JP2011084509 A JP 2011084509A JP 5912278 B2 JP5912278 B2 JP 5912278B2
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- Prior art keywords
- soft magnetic
- electromagnetic interference
- powder
- magnetic powder
- interference suppressor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000006247 magnetic powder Substances 0.000 claims description 70
- 239000000843 powder Substances 0.000 claims description 55
- 229910002796 Si–Al Inorganic materials 0.000 claims description 17
- 229910045601 alloy Inorganic materials 0.000 claims description 17
- 239000000956 alloy Substances 0.000 claims description 17
- 239000011230 binding agent Substances 0.000 claims description 17
- 239000002245 particle Substances 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 3
- 230000001629 suppression Effects 0.000 description 27
- 230000035699 permeability Effects 0.000 description 26
- 230000000052 comparative effect Effects 0.000 description 21
- 230000005540 biological transmission Effects 0.000 description 12
- 238000005259 measurement Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000000696 magnetic material Substances 0.000 description 4
- 229920000800 acrylic rubber Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920000058 polyacrylate Polymers 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 208000032365 Electromagnetic interference Diseases 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 230000036039 immunity Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
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- Hard Magnetic Materials (AREA)
- Soft Magnetic Materials (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
12 酸化物粉末
13 有機結合剤
41 ネットワークアナライザ
42、43 ポート
44 マイクロストリップライン
45 電磁干渉抑制体
Claims (3)
- Fe−Si−Al合金からなる扁平状の第1の軟磁性粉末と酸化物粉末とが有機結合剤中に分散されて構成された電磁干渉抑制体であって、前記酸化物粉末は、Fe−Si−Al合金からなる扁平状の第2の軟磁性粉末の中心部以外が酸化されている酸化物粉末であり、前記第1の軟磁性粉末の平均粒径に対する前記第2の軟磁性粉末の平均粒径の比が0.2〜1であり、前記第1の軟磁性粉末と前記酸化物粉末とからなる粉末全体に対して、前記酸化物粉末が占める重量比率が、1〜10%であることを特徴とする電磁干渉抑制体。
- 前記第1の軟磁性粉末と前記第2の軟磁性粉末とが同一組成のFe−Si−Al合金からなることを特徴とする請求項1に記載の電磁干渉抑制体。
- 前記第2の軟磁性粉末の酸化は、前記第2の軟磁性粉末を大気雰囲気下で熱処理することにより行うことを特徴とする請求項1または2に記載の電磁干渉抑制体の製造方法。
Priority Applications (1)
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---|---|---|---|
JP2011084509A JP5912278B2 (ja) | 2011-04-06 | 2011-04-06 | 電磁干渉抑制体 |
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---|---|---|---|
JP2011084509A JP5912278B2 (ja) | 2011-04-06 | 2011-04-06 | 電磁干渉抑制体 |
Publications (2)
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---|---|
JP2012222076A JP2012222076A (ja) | 2012-11-12 |
JP5912278B2 true JP5912278B2 (ja) | 2016-04-27 |
Family
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JP2011084509A Active JP5912278B2 (ja) | 2011-04-06 | 2011-04-06 | 電磁干渉抑制体 |
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JP (1) | JP5912278B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7063641B2 (ja) | 2018-01-31 | 2022-05-09 | 日立グローバルライフソリューションズ株式会社 | 冷蔵庫 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6778991B2 (ja) * | 2014-05-29 | 2020-11-04 | 日東電工株式会社 | 軟磁性熱硬化性フィルムおよび軟磁性フィルム |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0935927A (ja) * | 1995-07-20 | 1997-02-07 | Tokin Corp | 複合磁性体及びそれを用いた電磁干渉抑制体 |
JPH1097913A (ja) * | 1996-09-24 | 1998-04-14 | Tokin Corp | 複合磁性体及びその製造方法ならびに電磁干渉抑制体 |
JP4036300B2 (ja) * | 2002-08-30 | 2008-01-23 | Necトーキン株式会社 | 磁気損失体及びその製造方法 |
JP2007281074A (ja) * | 2006-04-04 | 2007-10-25 | Hitachi Metals Ltd | ノイズ抑制シート |
JP2010103313A (ja) * | 2008-10-23 | 2010-05-06 | Alps Electric Co Ltd | Rfid用磁気シート及びその製造方法、ならびに前記rfid用磁気シートを用いたrfidデバイス及びその製造方法 |
-
2011
- 2011-04-06 JP JP2011084509A patent/JP5912278B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7063641B2 (ja) | 2018-01-31 | 2022-05-09 | 日立グローバルライフソリューションズ株式会社 | 冷蔵庫 |
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