KR970702582A - 반도체 집적회로장치 및 그 제조방법과 제조장치(semiconductor integrated circuit device, and method and apparatus for manufacturingit) - Google Patents
반도체 집적회로장치 및 그 제조방법과 제조장치(semiconductor integrated circuit device, and method and apparatus for manufacturingit)Info
- Publication number
- KR970702582A KR970702582A KR1019960705924A KR19960705924A KR970702582A KR 970702582 A KR970702582 A KR 970702582A KR 1019960705924 A KR1019960705924 A KR 1019960705924A KR 19960705924 A KR19960705924 A KR 19960705924A KR 970702582 A KR970702582 A KR 970702582A
- Authority
- KR
- South Korea
- Prior art keywords
- lead
- integrated circuit
- circuit device
- semiconductor integrated
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H10W70/415—
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- H10W74/016—
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- H10W90/00—
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- H10W90/811—
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- H10W70/40—
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- H10W70/682—
-
- H10W72/01—
-
- H10W72/5449—
-
- H10W72/5522—
-
- H10W72/59—
-
- H10W72/834—
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- H10W72/865—
-
- H10W72/932—
-
- H10W72/9445—
-
- H10W74/00—
-
- H10W74/10—
-
- H10W90/288—
-
- H10W90/291—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Dram (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP94-88973 | 1994-04-16 | ||
| JP8897394 | 1994-04-26 | ||
| JP21781494 | 1994-08-20 | ||
| JP94-217814 | 1994-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970702582A true KR970702582A (ko) | 1997-05-13 |
Family
ID=26430291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960705924A Withdrawn KR970702582A (ko) | 1994-04-16 | 1995-04-05 | 반도체 집적회로장치 및 그 제조방법과 제조장치(semiconductor integrated circuit device, and method and apparatus for manufacturingit) |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5910010A (cg-RX-API-DMAC10.html) |
| JP (1) | JP3694729B2 (cg-RX-API-DMAC10.html) |
| KR (1) | KR970702582A (cg-RX-API-DMAC10.html) |
| TW (1) | TW282566B (cg-RX-API-DMAC10.html) |
| WO (1) | WO1995029506A1 (cg-RX-API-DMAC10.html) |
Families Citing this family (71)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3341581B2 (ja) | 1996-06-12 | 2002-11-05 | 日立電線株式会社 | 半導体装置用リードフレーム |
| AU6541996A (en) * | 1996-06-24 | 1998-01-14 | International Business Machines Corporation | Stacked semiconductor device package |
| US6054764A (en) * | 1996-12-20 | 2000-04-25 | Texas Instruments Incorporated | Integrated circuit with tightly coupled passive components |
| JPH11317326A (ja) * | 1998-03-06 | 1999-11-16 | Rohm Co Ltd | 電子部品 |
| KR100285664B1 (ko) * | 1998-05-15 | 2001-06-01 | 박종섭 | 스택패키지및그제조방법 |
| US6338097B1 (en) * | 1998-06-19 | 2002-01-08 | Sap Aktiengesellschaft | Cross application time sheet for communicating with one or more enterprise management applications during time data entry |
| JP2000094233A (ja) * | 1998-09-28 | 2000-04-04 | Tokyo Electron Ltd | 収容装置 |
| DE19923523B4 (de) | 1999-05-21 | 2004-09-30 | Infineon Technologies Ag | Halbleitermodul mit übereinander angeordneten, untereinander verbundenen Halbleiterchips |
| US6424033B1 (en) * | 1999-08-31 | 2002-07-23 | Micron Technology, Inc. | Chip package with grease heat sink and method of making |
| US6574077B1 (en) | 1999-12-02 | 2003-06-03 | Seagate Technology Llc | Microactuator assembly having improved standoff configuration |
| JP2001352035A (ja) * | 2000-06-07 | 2001-12-21 | Sony Corp | 多層半導体装置の組立治具及び多層半導体装置の製造方法 |
| US7562350B2 (en) * | 2000-12-15 | 2009-07-14 | Ricoh Company, Ltd. | Processing system and method using recomposable software |
| RU2183884C1 (ru) * | 2000-12-21 | 2002-06-20 | СИНЕРДЖЕСТИК КОМПЬЮТИНГ СИСТЕМС (СИКС) АпС | Гибридный многоуровневый электронный модуль |
| US7185022B2 (en) * | 2001-01-26 | 2007-02-27 | Semiconductor Energy Laboratory Co., Ltd. | Work data management system and work data management method |
| US6749691B2 (en) | 2001-02-14 | 2004-06-15 | Air Liquide America, L.P. | Methods of cleaning discolored metallic arrays using chemical compositions |
| JP3853634B2 (ja) * | 2001-10-29 | 2006-12-06 | シャープ株式会社 | 半導体装置用基板およびこれを用いた半導体装置ならびに積層構造体 |
| US6840751B2 (en) * | 2002-08-22 | 2005-01-11 | Texas Instruments Incorporated | Vertical mold die press machine |
| JP2004134591A (ja) * | 2002-10-10 | 2004-04-30 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
| US20040108583A1 (en) * | 2002-12-05 | 2004-06-10 | Roeters Glen E. | Thin scale outline package stack |
| CN100370611C (zh) * | 2004-02-03 | 2008-02-20 | 旺宏电子股份有限公司 | 电子组件堆叠结构 |
| TWI263286B (en) * | 2004-02-06 | 2006-10-01 | Siliconware Precision Industries Co Ltd | Wire bonding method and semiconductor package using the method |
| US7126829B1 (en) | 2004-02-09 | 2006-10-24 | Pericom Semiconductor Corp. | Adapter board for stacking Ball-Grid-Array (BGA) chips |
| US7193307B2 (en) * | 2004-03-25 | 2007-03-20 | Ault Incorporated | Multi-layer FET array and method of fabricating |
| US20060273432A1 (en) * | 2005-06-06 | 2006-12-07 | Texas Instruments Incorporated | Lead frame with attached components |
| US8041881B2 (en) | 2006-07-31 | 2011-10-18 | Google Inc. | Memory device with emulated characteristics |
| US8060774B2 (en) | 2005-06-24 | 2011-11-15 | Google Inc. | Memory systems and memory modules |
| US8111566B1 (en) | 2007-11-16 | 2012-02-07 | Google, Inc. | Optimal channel design for memory devices for providing a high-speed memory interface |
| US10013371B2 (en) | 2005-06-24 | 2018-07-03 | Google Llc | Configurable memory circuit system and method |
| US8244971B2 (en) | 2006-07-31 | 2012-08-14 | Google Inc. | Memory circuit system and method |
| US8397013B1 (en) | 2006-10-05 | 2013-03-12 | Google Inc. | Hybrid memory module |
| US9171585B2 (en) | 2005-06-24 | 2015-10-27 | Google Inc. | Configurable memory circuit system and method |
| US8055833B2 (en) | 2006-10-05 | 2011-11-08 | Google Inc. | System and method for increasing capacity, performance, and flexibility of flash storage |
| US8359187B2 (en) | 2005-06-24 | 2013-01-22 | Google Inc. | Simulating a different number of memory circuit devices |
| US8438328B2 (en) | 2008-02-21 | 2013-05-07 | Google Inc. | Emulation of abstracted DIMMs using abstracted DRAMs |
| US8796830B1 (en) | 2006-09-01 | 2014-08-05 | Google Inc. | Stackable low-profile lead frame package |
| US20080082763A1 (en) | 2006-10-02 | 2008-04-03 | Metaram, Inc. | Apparatus and method for power management of memory circuits by a system or component thereof |
| US8386722B1 (en) | 2008-06-23 | 2013-02-26 | Google Inc. | Stacked DIMM memory interface |
| US8130560B1 (en) | 2006-11-13 | 2012-03-06 | Google Inc. | Multi-rank partial width memory modules |
| US8077535B2 (en) | 2006-07-31 | 2011-12-13 | Google Inc. | Memory refresh apparatus and method |
| US9507739B2 (en) | 2005-06-24 | 2016-11-29 | Google Inc. | Configurable memory circuit system and method |
| US20080028136A1 (en) | 2006-07-31 | 2008-01-31 | Schakel Keith R | Method and apparatus for refresh management of memory modules |
| US8335894B1 (en) | 2008-07-25 | 2012-12-18 | Google Inc. | Configurable memory system with interface circuit |
| US8327104B2 (en) | 2006-07-31 | 2012-12-04 | Google Inc. | Adjusting the timing of signals associated with a memory system |
| US8089795B2 (en) | 2006-02-09 | 2012-01-03 | Google Inc. | Memory module with memory stack and interface with enhanced capabilities |
| DE112006002300B4 (de) | 2005-09-02 | 2013-12-19 | Google, Inc. | Vorrichtung zum Stapeln von DRAMs |
| US7728362B2 (en) | 2006-01-20 | 2010-06-01 | International Business Machines Corporation | Creating integrated circuit capacitance from gate array structures |
| US9632929B2 (en) | 2006-02-09 | 2017-04-25 | Google Inc. | Translating an address associated with a command communicated between a system and memory circuits |
| US8001513B2 (en) | 2008-08-25 | 2011-08-16 | Micron Technology, Inc. | Integrated circuit apparatus, systems, and methods |
| JP5381018B2 (ja) * | 2008-10-31 | 2014-01-08 | 凸版印刷株式会社 | 凹凸構造パターンの転写装置 |
| JP2012008695A (ja) * | 2010-06-23 | 2012-01-12 | Elpida Memory Inc | メモリシステム、メモリモジュール、モジュールソケット |
| US8780576B2 (en) * | 2011-09-14 | 2014-07-15 | Invensas Corporation | Low CTE interposer |
| US9832876B2 (en) * | 2014-12-18 | 2017-11-28 | Intel Corporation | CPU package substrates with removable memory mechanical interfaces |
| CN107210283A (zh) * | 2015-01-20 | 2017-09-26 | 三菱电机株式会社 | 功率模块 |
| KR20170127324A (ko) * | 2016-05-11 | 2017-11-21 | (주)제이티 | 반도체소자 캐리어, 이의 제조방법 및 이를 포함하는 소자핸들러 |
| JP6677616B2 (ja) * | 2016-09-29 | 2020-04-08 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP6677183B2 (ja) * | 2017-01-25 | 2020-04-08 | オムロン株式会社 | 制御装置 |
| US10750621B2 (en) * | 2017-08-02 | 2020-08-18 | Sumitomo Electric Device Innovations, Inc. | Process of assembling semiconductor device |
| US10903153B2 (en) | 2018-11-18 | 2021-01-26 | International Business Machines Corporation | Thinned die stack |
| US11855056B1 (en) | 2019-03-15 | 2023-12-26 | Eliyan Corporation | Low cost solution for 2.5D and 3D packaging using USR chiplets |
| US12438095B1 (en) | 2021-05-06 | 2025-10-07 | Eliyan Corp. | Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates |
| US12204794B1 (en) * | 2021-05-18 | 2025-01-21 | Eliyan Corporation | Architecture for DRAM control optimization using simultaneous bidirectional memory interfaces |
| US11842986B1 (en) | 2021-11-25 | 2023-12-12 | Eliyan Corporation | Multi-chip module (MCM) with interface adapter circuitry |
| US12190038B1 (en) | 2021-11-25 | 2025-01-07 | Eliyan Corporation | Multi-chip module (MCM) with multi-port unified memory |
| US11841815B1 (en) | 2021-12-31 | 2023-12-12 | Eliyan Corporation | Chiplet gearbox for low-cost multi-chip module applications |
| US12248419B1 (en) | 2022-05-26 | 2025-03-11 | Eliyan Corporation | Interface conversion circuitry for universal chiplet interconnect express (UCIe) |
| CN115377050B (zh) * | 2022-07-12 | 2024-11-22 | 中国电子科技集团公司第二十九研究所 | 一种双面互连气密封装结构及其制备方法 |
| US12058874B1 (en) | 2022-12-27 | 2024-08-06 | Eliyan Corporation | Universal network-attached memory architecture |
| US12525540B1 (en) | 2023-06-05 | 2026-01-13 | Eliyan Corp. | Multi-chip module (MCM) with scalable high bandwidth memory |
| US12182040B1 (en) | 2023-06-05 | 2024-12-31 | Eliyan Corporation | Multi-chip module (MCM) with scalable high bandwidth memory |
| US12204482B1 (en) | 2023-10-09 | 2025-01-21 | Eliyan Corporation | Memory chiplet with efficient mapping of memory-centric interface to die-to-die (D2D) unit interface modules |
| US12204468B1 (en) | 2023-10-11 | 2025-01-21 | Eliyan Corporation | Universal memory interface with dynamic bidirectional data transfers |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4480975A (en) * | 1981-07-01 | 1984-11-06 | Kras Corporation | Apparatus for encapsulating electronic components |
| US4631100A (en) * | 1983-01-10 | 1986-12-23 | Pellegrino Peter P | Method and apparatus for mass producing printed circuit boards |
| US4915607A (en) * | 1987-09-30 | 1990-04-10 | Texas Instruments Incorporated | Lead frame assembly for an integrated circuit molding system |
| JPH01299884A (ja) * | 1988-05-28 | 1989-12-04 | Tomoegawa Paper Co Ltd | ダイボンディング接着テープ |
| JPH0379068A (ja) * | 1989-08-22 | 1991-04-04 | Mitsubishi Electric Corp | 半導体装置 |
| US5387827A (en) * | 1990-01-20 | 1995-02-07 | Hitachi, Ltd. | Semiconductor integrated circuit having logic gates |
| US5241454A (en) * | 1992-01-22 | 1993-08-31 | International Business Machines Corporation | Mutlilayered flexible circuit package |
| JPH05283608A (ja) * | 1992-03-31 | 1993-10-29 | Toshiba Corp | 樹脂封止型半導体装置および樹脂封止型半導体装置の製造方法 |
| JPH05343602A (ja) * | 1992-06-11 | 1993-12-24 | Hitachi Ltd | 高集積半導体装置及びそれを用いた半導体モジュール |
| US5479319A (en) * | 1992-12-30 | 1995-12-26 | Interconnect Systems, Inc. | Multi-level assemblies for interconnecting integrated circuits |
| JP3400067B2 (ja) * | 1994-03-16 | 2003-04-28 | 富士通株式会社 | 印刷配線板の導体切断方法及び装置 |
-
1995
- 1995-04-05 JP JP52751695A patent/JP3694729B2/ja not_active Expired - Lifetime
- 1995-04-05 KR KR1019960705924A patent/KR970702582A/ko not_active Withdrawn
- 1995-04-05 US US08/732,215 patent/US5910010A/en not_active Expired - Lifetime
- 1995-04-05 WO PCT/JP1995/000662 patent/WO1995029506A1/ja not_active Ceased
- 1995-04-06 TW TW84103247A patent/TW282566B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP3694729B2 (ja) | 2005-09-14 |
| US5910010A (en) | 1999-06-08 |
| WO1995029506A1 (fr) | 1995-11-02 |
| TW282566B (cg-RX-API-DMAC10.html) | 1996-08-01 |
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