TW282566B - - Google Patents
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- Publication number
- TW282566B TW282566B TW84103247A TW84103247A TW282566B TW 282566 B TW282566 B TW 282566B TW 84103247 A TW84103247 A TW 84103247A TW 84103247 A TW84103247 A TW 84103247A TW 282566 B TW282566 B TW 282566B
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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Landscapes
- Engineering & Computer Science (AREA)
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- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Dram (AREA)
Applications Claiming Priority (2)
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JP8897394 | 1994-04-26 | ||
JP21781494 | 1994-08-20 |
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JP (1) | JP3694729B2 (zh) |
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WO (1) | WO1995029506A1 (zh) |
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TWI618204B (zh) * | 2016-05-11 | 2018-03-11 | 宰體有限公司 | 半導體裝置載體、製造半導體裝置載體的方法及具有該載體的半導體裝置處理器 |
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- 1995-04-06 TW TW84103247A patent/TW282566B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI618204B (zh) * | 2016-05-11 | 2018-03-11 | 宰體有限公司 | 半導體裝置載體、製造半導體裝置載體的方法及具有該載體的半導體裝置處理器 |
Also Published As
Publication number | Publication date |
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JP3694729B2 (ja) | 2005-09-14 |
WO1995029506A1 (en) | 1995-11-02 |
KR970702582A (ko) | 1997-05-13 |
US5910010A (en) | 1999-06-08 |
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