TW282566B - - Google Patents

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Publication number
TW282566B
TW282566B TW84103247A TW84103247A TW282566B TW 282566 B TW282566 B TW 282566B TW 84103247 A TW84103247 A TW 84103247A TW 84103247 A TW84103247 A TW 84103247A TW 282566 B TW282566 B TW 282566B
Authority
TW
Taiwan
Application number
TW84103247A
Inventor
Kiyoshi Inoue
Sugano Toshio
Toshio Yamada
Masakatsu Goto
Original Assignee
Hitachi Ltd
Hitachi Cho Lsi Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Cho Lsi Eng Co Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TW282566B publication Critical patent/TW282566B/zh

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    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Dram (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW84103247A 1994-04-26 1995-04-06 TW282566B (zh)

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