KR970072292A - 웨이퍼 반송장치 - Google Patents

웨이퍼 반송장치 Download PDF

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Publication number
KR970072292A
KR970072292A KR1019970014843A KR19970014843A KR970072292A KR 970072292 A KR970072292 A KR 970072292A KR 1019970014843 A KR1019970014843 A KR 1019970014843A KR 19970014843 A KR19970014843 A KR 19970014843A KR 970072292 A KR970072292 A KR 970072292A
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KR
South Korea
Prior art keywords
wafer
transfer
suction stage
stopper
stage
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KR1019970014843A
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English (en)
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KR100244688B1 (ko
Inventor
야스노부 스즈키
히로부미 모로에
가즈히로 이마이
데츠야 고바루
Original Assignee
후지야마 겐지
가부시키가이샤 신가와
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Publication of KR970072292A publication Critical patent/KR970072292A/ko
Application granted granted Critical
Publication of KR100244688B1 publication Critical patent/KR100244688B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Abstract

웨이퍼에 무용의 외력을 가하지 않고 안정하게 가공부용 흡착스테이지에 공급 및 가공부용 흡착스테이지로부터 배출할 수가 있다.
로터측 엘리베이터 장치(10A), 웨이퍼의 위치수정용 흡착스테이지(21), 가공부용 흡착스테이지(46), 위치대(70), 언로더측 엘리베이터 장치(10B)가 차례로 배열설치되어, 로더측 엘리베이터장치(10A)에 위치된 로더측 매거진(15)내의 웨이퍼(1)을 가공부용 흡착 스테이지(46)의 상방으로 반송하는 컨베이어(80)와, 컨베이어(80)로 반송된 웨이퍼(1)를 위치수정용 흡착스테이지(21)상에 위치결정하는 스토퍼(39)와, 위치수정용 흡착스테이지(21)의 상면이 스토퍼(39)의 상면과 대략 동일하게, 또한 가공부용 흡착스테이지(46)의 상면이 스토퍼 상하로 이동시킨 후에 작동하는 이송클릭 반송장치(100)를 구비하고 있다.

Description

웨이퍼 반송장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명의 일 실시형태의 평면도이다.

Claims (2)

  1. 웨이퍼를 로더측 매거진으로부터 가공부용 흡착 스테이지로 공급하고, 가공이 끝난 웨이퍼를 언로더측 매거진에 수납하는 웨이퍼 반송장치에 있어서, 상기 로더측 매거진과 상기 가공부용 흡착스테이지와의 사이에 배열설치되어, 상하로의 이동 및 회전구동되는 웨이퍼의 위치수정용 흡착스테이지와, 상기 가공부용 흡착스테이지와 상기 언로더측 매거진과의 사이에 배열설치되어, 웨이퍼 반송방향의 중심에 간극을 갖고 있고 상면이 평면이 위치대와, 상기 로더측 및 언로더측 매거진을 각각 상하로 이동시키는 로더측 및 언로더측 엘리베이터 장치와, 상기 로더측 매거진 내의 웨이퍼를 상기 가공부용 흡착 스테이지의 상방으로 반송하는 컨베이어와, 웨이퍼 반송방향에 대하여 직각으로 대항하여 설치되어, 상기 위치수정용 흡착스테이지에 의하여 상기 컨베이어로부터 웨이퍼가 약간 상승된 상태에서, 전후로 이동하여 상기 웨이퍼를 위치결정하는 한쌍의 위치수정용 클릭과, 상기 가공부용 흡착스테이지와 상기 위치수정용 흡착 스테이지 사이에 배열설치되고, 상기 컨베이어로 반송된 웨이퍼를 위치결정하는 스토퍼와, 상기 위치 수정용 흡착스테이지의 상면이 상기 스토퍼의 상면과 거의 동일하게 위치하는 상태로 상기 위치 수정용 흡착스테이지를 상하로 이동시킨 후, 또한 가공부용 흡착스테이지의 상면이 상기 스토퍼 및 상기 위치대의 상면과 동일하게 되도록 상기 가공붕요 흡착스테이지를 상하로 이동 시킨 후에 작동하여 웨이퍼의 후방을 누르는 이송클릭 반송장치를 구비한 것을 특징으로 하는 웨이퍼 반송장치.
  2. 제1항에 있어서, 상기 이송클릭 반송장치는 상하 및 웨이퍼 반송방향에 동기하여 구동되는 제1, 제2 및 제3이송클릭 아암을 갖고 있고, 제1이송클릭 아암의 이송클릭은 상기 위치수정용 흡착스테이지상의 웨이퍼의 후방을 눌러서 상기 스토퍼상을 경유하여, 상기 가공부용 흡착스테이지상으로 반송하고, 상기 제2이송클릭 아암의 이송클릭은 상기 가공부용 흡착 스테이지상의 웨이퍼의 후방을 눌러서 상기 위치대로 반송하고, 상기 제3이송클락아암의 이송클릭은 상기 위치대의 상기 간극에 배열설치되어 위치대상의 웨이퍼의 후방을 눌러서 상기 언로더측 매거진에 수납하는 것을 특징으로 하는 웨이퍼 반송장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019970014843A 1996-04-22 1997-04-22 웨이퍼 반송장치 KR100244688B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP96-122838 1996-04-22
JP8122838A JPH09289241A (ja) 1996-04-22 1996-04-22 ウェーハ搬送装置

Publications (2)

Publication Number Publication Date
KR970072292A true KR970072292A (ko) 1997-11-07
KR100244688B1 KR100244688B1 (ko) 2000-02-15

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US (1) US5848868A (ko)
JP (1) JPH09289241A (ko)
KR (1) KR100244688B1 (ko)
TW (1) TW354421B (ko)

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JP6409033B2 (ja) * 2016-08-10 2018-10-17 株式会社カイジョー ボンディング方法
CN109772726B (zh) * 2019-01-03 2021-02-02 大族激光科技产业集团股份有限公司 一种led加工设备及应用其的led加工工艺
JP7222247B2 (ja) * 2019-01-10 2023-02-15 トヨタ紡織株式会社 ワークの移載装置
CN110911311B (zh) * 2019-11-18 2023-02-14 深圳格兰达智能装备股份有限公司 一种针对切割后晶圆的视觉检测机
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Also Published As

Publication number Publication date
JPH09289241A (ja) 1997-11-04
KR100244688B1 (ko) 2000-02-15
US5848868A (en) 1998-12-15
TW354421B (en) 1999-03-11

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