TW354421B - Wafer transferring device - Google Patents

Wafer transferring device

Info

Publication number
TW354421B
TW354421B TW086104411A TW86104411A TW354421B TW 354421 B TW354421 B TW 354421B TW 086104411 A TW086104411 A TW 086104411A TW 86104411 A TW86104411 A TW 86104411A TW 354421 B TW354421 B TW 354421B
Authority
TW
Taiwan
Prior art keywords
wafer
transferring
tank
filling
carrier
Prior art date
Application number
TW086104411A
Other languages
English (en)
Inventor
Yasunobu Suzuki
Hirofumi Moroe
Kazuhiro Imai
Tetsuya Kobaru
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Application granted granted Critical
Publication of TW354421B publication Critical patent/TW354421B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
TW086104411A 1996-04-22 1997-04-08 Wafer transferring device TW354421B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8122838A JPH09289241A (ja) 1996-04-22 1996-04-22 ウェーハ搬送装置

Publications (1)

Publication Number Publication Date
TW354421B true TW354421B (en) 1999-03-11

Family

ID=14845888

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086104411A TW354421B (en) 1996-04-22 1997-04-08 Wafer transferring device

Country Status (4)

Country Link
US (1) US5848868A (zh)
JP (1) JPH09289241A (zh)
KR (1) KR100244688B1 (zh)
TW (1) TW354421B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5980195A (en) * 1996-04-24 1999-11-09 Tokyo Electron, Ltd. Positioning apparatus for substrates to be processed
JPH10107128A (ja) * 1996-10-01 1998-04-24 Shinkawa Ltd ウェーハリングの供給装置
JPH10321564A (ja) * 1997-05-20 1998-12-04 Tokyo Seimitsu Co Ltd ウェーハ回収装置
DE69936057T2 (de) * 1998-06-19 2008-01-10 Matsushita Electric Industrial Co., Ltd., Kadoma Verfahren und anordnung zur herstellung von höckern
US6409463B1 (en) * 2000-02-08 2002-06-25 Seh America, Inc. Apparatuses and methods for adjusting a substrate centering system
US6779278B1 (en) * 2003-07-17 2004-08-24 Nanometrics Incorporated Compact rotating stage
DE102004050463B3 (de) * 2004-10-16 2006-04-20 Manz Automation Ag Testsystem für Solarzellen
US7738081B2 (en) * 2005-05-06 2010-06-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing a flat panel display handler with conveyor device and substrate handler
KR100986274B1 (ko) 2010-01-28 2010-10-07 주식회사 이노비즈 일체형 엘이디 칩 검사 및 분류 장비
KR20120032087A (ko) * 2010-09-28 2012-04-05 한미반도체 주식회사 웨이퍼 공급 시스템
DE102010048043A1 (de) 2010-10-15 2012-04-19 Ev Group Gmbh Vorrichtung und Verfahren zur Prozessierung von Wafern
JP5931389B2 (ja) * 2011-09-29 2016-06-08 川崎重工業株式会社 搬送システム
CN102897572A (zh) * 2012-10-26 2013-01-30 苏州劲翔电子科技有限公司 自动上下料装置
JP6355121B2 (ja) * 2012-12-06 2018-07-11 株式会社古川製作所 大容量袋供給装置
CN203601864U (zh) * 2013-10-24 2014-05-21 富鼎电子科技(嘉善)有限公司 输送装置
JP5538613B1 (ja) * 2013-11-13 2014-07-02 東京エレクトロン株式会社 接合装置及び接合システム
JP6409033B2 (ja) * 2016-08-10 2018-10-17 株式会社カイジョー ボンディング方法
CN109772726B (zh) * 2019-01-03 2021-02-02 大族激光科技产业集团股份有限公司 一种led加工设备及应用其的led加工工艺
JP7222247B2 (ja) * 2019-01-10 2023-02-15 トヨタ紡織株式会社 ワークの移載装置
CN110911311B (zh) * 2019-11-18 2023-02-14 深圳格兰达智能装备股份有限公司 一种针对切割后晶圆的视觉检测机
CN111232519A (zh) * 2020-02-21 2020-06-05 环旭电子股份有限公司 定位输送装置、料盘周转系统及周转方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3902615A (en) * 1973-03-12 1975-09-02 Computervision Corp Automatic wafer loading and pre-alignment system
JPS542662A (en) * 1977-06-08 1979-01-10 Seiko Epson Corp Semiconductor device
US4178113A (en) * 1977-12-05 1979-12-11 Macronetics, Inc. Buffer storage apparatus for semiconductor wafer processing
JPS5534451A (en) * 1978-08-31 1980-03-11 Disco Abrasive Sys Ltd Feeder of workpiece
JPS5978538A (ja) * 1982-10-27 1984-05-07 Toshiba Corp ダイボンダ装置
JPS59110117A (ja) * 1982-12-15 1984-06-26 Toshiba Corp 半導体ウエハ自動位置決め機構
US4507078A (en) * 1983-03-28 1985-03-26 Silicon Valley Group, Inc. Wafer handling apparatus and method
JPH06105742B2 (ja) * 1983-11-28 1994-12-21 株式会社日立製作所 真空処理方法及び装置
JPS61188331A (ja) * 1985-02-15 1986-08-22 Nippon Texas Instr Kk 物体取出装置
US4938654A (en) * 1985-05-17 1990-07-03 Schram Richard R Automated wafer inspection system
JPS6221822A (ja) * 1985-07-19 1987-01-30 Keiji Imai セミ梳毛精紡機のスライバ−クリル
US4764076A (en) * 1986-04-17 1988-08-16 Varian Associates, Inc. Valve incorporating wafer handling arm
JPS63182833A (ja) * 1987-01-26 1988-07-28 Toshiba Corp 位置決め装置
JPH02189949A (ja) * 1989-01-18 1990-07-25 Tokyo Electron Ltd 搬送装置
JP2806431B2 (ja) * 1989-04-28 1998-09-30 株式会社ニデック ウェーハ搬送装置
JPH0441519A (ja) * 1990-06-07 1992-02-12 Daicel Chem Ind Ltd 単量体を含む反応性組成物およびその製造方法

Also Published As

Publication number Publication date
JPH09289241A (ja) 1997-11-04
KR970072292A (ko) 1997-11-07
KR100244688B1 (ko) 2000-02-15
US5848868A (en) 1998-12-15

Similar Documents

Publication Publication Date Title
TW354421B (en) Wafer transferring device
ES8702853A1 (es) Aparato de transferencia de pastillas
EP0791094A4 (en) DEVICE FOR FEEDING FLAT MATERIAL PIECES
JPS56122634A (en) Die device for transfer press
JP4570254B2 (ja) 物品に印刷する方法と装置
JPS5720444A (en) Feeding device for semiconductor wafer
JPS552534A (en) Apparatus for recovering roll core and transferring textile roll
US4781369A (en) Transporting limp fabric
IT1298003B1 (it) Metodo e dispositivo di caricamento degli stampi delle presse ceramiche
CA2183122A1 (en) Apparatus and method for positioning a printing mechanism between stations in a mail handling apparatus
DE69006631T2 (de) Kabelaufroll- und Kabelverpackungsverfahren.
ES8406357A1 (es) Perfeccionamientos en los dispositivos para la manipulacion de objetos
ATE212600T1 (de) Artikelauswahl- und verteilungsvorrichtung
ES8500860A1 (es) Instalacion para paletizar, capa a capa sobre respectivas paletas, objetos de varias clases procedentes de distintas canales.
EP0743484B1 (en) Device for automatically marking gas cylinders
JP2816204B2 (ja) 自動溶断によるバリ取機
GB2075460A (en) Arrangement for palleting machines
KR970002747Y1 (ko) 벽돌 이송 조적장치의 벽돌 잡이판 구조
JPS56134045A (en) Mold making machine
JP2005503278A (ja) バッグを直線状搬送システムまで移送するバッグ移送装置
JPS55102243A (en) Automatic aligning apparatus for substrate
TW329418B (en) Sheet piling-up method and system therefor
JPH03113322U (zh)
JPS6085529U (ja) タイルユニツト製造用積載装置
JPH01158402U (zh)