KR970024296A - 탄화실리콘(SiC) 반도체 소자 (SiC SEMICONDUCTOR DEVICE) - Google Patents

탄화실리콘(SiC) 반도체 소자 (SiC SEMICONDUCTOR DEVICE) Download PDF

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Publication number
KR970024296A
KR970024296A KR1019960044989A KR19960044989A KR970024296A KR 970024296 A KR970024296 A KR 970024296A KR 1019960044989 A KR1019960044989 A KR 1019960044989A KR 19960044989 A KR19960044989 A KR 19960044989A KR 970024296 A KR970024296 A KR 970024296A
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KR
South Korea
Prior art keywords
semiconductor
epitaxial layer
silicon
high band
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019960044989A
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English (en)
Korean (ko)
Inventor
자나다난 에스 에이지트
Original Assignee
클레버터 레슬리 씨.
인터내쇼널 렉티파이어 코포레이션
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Filing date
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Application filed by 클레버터 레슬리 씨., 인터내쇼널 렉티파이어 코포레이션 filed Critical 클레버터 레슬리 씨.
Publication of KR970024296A publication Critical patent/KR970024296A/ko
Withdrawn legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/028Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/668Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149Source or drain regions of field-effect devices
    • H10D62/151Source or drain regions of field-effect devices of IGFETs 
    • H10D62/152Source regions of DMOS transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/82Heterojunctions
    • H10D62/822Heterojunctions comprising only Group IV materials heterojunctions, e.g. Si/Ge heterojunctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10P14/6349

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Bipolar Transistors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
KR1019960044989A 1995-10-10 1996-10-10 탄화실리콘(SiC) 반도체 소자 (SiC SEMICONDUCTOR DEVICE) Withdrawn KR970024296A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US498395P 1995-10-10 1995-10-10
US60/004,983 1995-10-10

Publications (1)

Publication Number Publication Date
KR970024296A true KR970024296A (ko) 1997-05-30

Family

ID=21713529

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960044989A Withdrawn KR970024296A (ko) 1995-10-10 1996-10-10 탄화실리콘(SiC) 반도체 소자 (SiC SEMICONDUCTOR DEVICE)

Country Status (9)

Country Link
US (1) US5877515A (enExample)
JP (1) JPH09172159A (enExample)
KR (1) KR970024296A (enExample)
DE (1) DE19641839A1 (enExample)
FR (1) FR2740907B1 (enExample)
GB (1) GB2306250A (enExample)
IT (1) IT1285498B1 (enExample)
SG (1) SG64402A1 (enExample)
TW (1) TW317647B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010023873A (ko) * 1997-09-10 2001-03-26 인피니언 테크놀로지스 아게 드리프트 구역을 가진 반도체 소자

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JPH08213607A (ja) * 1995-02-08 1996-08-20 Ngk Insulators Ltd 半導体装置およびその製造方法
JP3327135B2 (ja) * 1996-09-09 2002-09-24 日産自動車株式会社 電界効果トランジスタ
JP3461274B2 (ja) * 1996-10-16 2003-10-27 株式会社東芝 半導体装置
JP3206727B2 (ja) * 1997-02-20 2001-09-10 富士電機株式会社 炭化けい素縦型mosfetおよびその製造方法
WO1998059374A2 (en) * 1997-06-23 1998-12-30 Cooper James Albert Jr Insulated gate power semiconductor device having a semi-insulating semiconductor substrate
KR20000068738A (ko) * 1997-08-13 2000-11-25 모리시타 요이찌 반도체기판 및 반도체소자
US6448160B1 (en) * 1999-04-01 2002-09-10 Apd Semiconductor, Inc. Method of fabricating power rectifier device to vary operating parameters and resulting device
US6420225B1 (en) 1999-04-01 2002-07-16 Apd Semiconductor, Inc. Method of fabricating power rectifier device
US6624030B2 (en) 2000-12-19 2003-09-23 Advanced Power Devices, Inc. Method of fabricating power rectifier device having a laterally graded P-N junction for a channel region
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US6331455B1 (en) 1999-04-01 2001-12-18 Advanced Power Devices, Inc. Power rectifier device and method of fabricating power rectifier devices
WO2001018872A1 (en) * 1999-09-07 2001-03-15 Sixon Inc. SiC WAFER, SiC SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD OF SiC WAFER
US6303508B1 (en) 1999-12-16 2001-10-16 Philips Electronics North America Corporation Superior silicon carbide integrated circuits and method of fabricating
US6407014B1 (en) 1999-12-16 2002-06-18 Philips Electronics North America Corporation Method achieving higher inversion layer mobility in novel silicon carbide semiconductor devices
US6537860B2 (en) 2000-12-18 2003-03-25 Apd Semiconductor, Inc. Method of fabricating power VLSI diode devices
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JP3559971B2 (ja) * 2001-12-11 2004-09-02 日産自動車株式会社 炭化珪素半導体装置およびその製造方法
US6515330B1 (en) * 2002-01-02 2003-02-04 Apd Semiconductor, Inc. Power device having vertical current path with enhanced pinch-off for current limiting
US7183575B2 (en) 2002-02-19 2007-02-27 Nissan Motor Co., Ltd. High reverse voltage silicon carbide diode and method of manufacturing the same high reverse voltage silicon carbide diode
US7282739B2 (en) * 2002-04-26 2007-10-16 Nissan Motor Co., Ltd. Silicon carbide semiconductor device
US7074643B2 (en) * 2003-04-24 2006-07-11 Cree, Inc. Silicon carbide power devices with self-aligned source and well regions and methods of fabricating same
JP2006245243A (ja) * 2005-03-02 2006-09-14 Fuji Electric Device Technology Co Ltd 半導体装置およびその製造方法
US7588961B2 (en) * 2005-03-30 2009-09-15 Nissan Motor Co., Ltd. Semiconductor device and manufacturing method thereof
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JP4903439B2 (ja) * 2005-05-31 2012-03-28 株式会社東芝 電界効果トランジスタ
US7589004B2 (en) * 2005-06-21 2009-09-15 Los Alamos National Security, Llc Method for implantation of high dopant concentrations in wide band gap materials
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JP2007299845A (ja) * 2006-04-28 2007-11-15 Nissan Motor Co Ltd 半導体装置の製造方法および半導体装置
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WO2009042807A2 (en) * 2007-09-26 2009-04-02 Lakota Technologies, Inc. Adjustable field effect rectifier
US8643055B2 (en) * 2007-09-26 2014-02-04 Stmicroelectronics N.V. Series current limiter device
US8148748B2 (en) 2007-09-26 2012-04-03 Stmicroelectronics N.V. Adjustable field effect rectifier
US8492771B2 (en) 2007-09-27 2013-07-23 Infineon Technologies Austria Ag Heterojunction semiconductor device and method
US20090159896A1 (en) * 2007-12-20 2009-06-25 General Electric Company Silicon carbide mosfet devices and methods of making
WO2010080855A2 (en) 2009-01-06 2010-07-15 Lakota Technologies Inc. Self-bootstrapping field effect diode structures and methods
SG183740A1 (en) * 2009-02-20 2012-09-27 Semiconductor Energy Lab Semiconductor device and manufacturing method of the same
JP5699628B2 (ja) * 2010-07-26 2015-04-15 住友電気工業株式会社 半導体装置
IT1401754B1 (it) * 2010-08-30 2013-08-02 St Microelectronics Srl Dispositivo elettronico integrato e relativo metodo di fabbricazione.
IT1401756B1 (it) 2010-08-30 2013-08-02 St Microelectronics Srl Dispositivo elettronico integrato con struttura di terminazione di bordo e relativo metodo di fabbricazione.
IT1401755B1 (it) 2010-08-30 2013-08-02 St Microelectronics Srl Dispositivo elettronico integrato a conduzione verticale e relativo metodo di fabbricazione.
JP5730521B2 (ja) * 2010-09-08 2015-06-10 株式会社日立ハイテクノロジーズ 熱処理装置
US8389348B2 (en) * 2010-09-14 2013-03-05 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanism of forming SiC crystalline on Si substrates to allow integration of GaN and Si electronics
GB2484506A (en) * 2010-10-13 2012-04-18 Univ Warwick Heterogrowth
DE102011053641A1 (de) * 2011-09-15 2013-03-21 Infineon Technologies Ag SiC-MOSFET mit hoher Kanalbeweglichkeit
CN104347708A (zh) * 2013-08-07 2015-02-11 中芯国际集成电路制造(北京)有限公司 多栅vdmos晶体管及其形成方法
JP6228850B2 (ja) 2014-01-10 2017-11-08 ルネサスエレクトロニクス株式会社 半導体装置
JP6237408B2 (ja) * 2014-03-28 2017-11-29 住友電気工業株式会社 炭化珪素半導体装置およびその製造方法
CN105336775B (zh) * 2014-07-01 2018-03-09 无锡华润华晶微电子有限公司 一种vdmos器件的元胞结构及其制作方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010023873A (ko) * 1997-09-10 2001-03-26 인피니언 테크놀로지스 아게 드리프트 구역을 가진 반도체 소자

Also Published As

Publication number Publication date
ITMI962098A1 (it) 1998-04-10
GB2306250A (en) 1997-04-30
US5877515A (en) 1999-03-02
IT1285498B1 (it) 1998-06-08
TW317647B (enExample) 1997-10-11
GB9621170D0 (en) 1996-11-27
SG64402A1 (en) 1999-04-27
DE19641839A1 (de) 1997-05-15
FR2740907B1 (fr) 1999-05-14
FR2740907A1 (fr) 1997-05-09
JPH09172159A (ja) 1997-06-30

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