KR970701930A - 높은 래치-업 저항을 가진 실리콘 탄화물을 기초로 한 mis구조물(silicon carbide-based mis structure with high latch-up resistance) - Google Patents
높은 래치-업 저항을 가진 실리콘 탄화물을 기초로 한 mis구조물(silicon carbide-based mis structure with high latch-up resistance)Info
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- KR970701930A KR970701930A KR1019960704867A KR19960704867A KR970701930A KR 970701930 A KR970701930 A KR 970701930A KR 1019960704867 A KR1019960704867 A KR 1019960704867A KR 19960704867 A KR19960704867 A KR 19960704867A KR 970701930 A KR970701930 A KR 970701930A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- 239000012212 insulator Substances 0.000 claims abstract 4
- 239000004065 semiconductor Substances 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- 238000005468 ion implantation Methods 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 239000002245 particle Substances 0.000 claims 3
- 230000007704 transition Effects 0.000 claims 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 2
- 229910052796 boron Inorganic materials 0.000 claims 2
- 239000002800 charge carrier Substances 0.000 claims 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
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- H—ELECTRICITY
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1608—Silicon carbide
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
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- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41766—Source or drain electrodes for field effect devices with at least part of the source or drain electrode having contact below the semiconductor surface, e.g. the source or drain electrode formed at least partially in a groove or with inclusions of conductor inside the semiconductor
Abstract
MIS 구조물을 드리프트 구역(1), 드리프트 구역(1)의 표면에 배치된 베이스 구역(3), 베이스 구역(3)내로 이온 주입된 n+소오스 구역(2), 베이스 구역(3)과 소오스 구역(2)을 단락시키는 소오스 전극(S), 및 절연체 구역(5)을 통해 채널 구역(32)의 전기 저항을 제어하기 위한 게이트 전극(G)을 포함한다. 베이스 구역(3)은 전체 소오스 구역(2) 아래 이온 주입된 p+부분 구역(33) 내에서 채널 구역(32)에서 보다 많이 도핑된다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 n 드리프트 구역 내에 이온 주입된 p 베이스 구역의 이온 주입된 n+소오스 구역 아래 연장된 이온 주입된 p+부분 구역을 가진 평면의 MIS 구조물의 단면도이다.
Claims (18)
- a) 적어도 하나의 드리프트 구역(1), b) 드리프트 구역(1)의 표면(10)에 또는 표면(10) 내에 배치된 적어도 하나의 베이스 구역(3), c) 베이스 구역(3)에 의해 드리프트 구역(1)으로부터 분리되는 적어도 하나의 소오스 구역(2), d) 소오스 구역(2)과 베이스 구역(3)을 서로 전기적으로 접촉시키는 적어도 하나의 소오스 전극 S), e) 소오스 구역(2)과 드리프트 구역(1)을 연결시키는 베이스 구역(3)의 적어도 하나의 채널 구역(32), 및 f) 채널 구역(32)과 게이트 전극(G) 사이에 배치된 절연체 구역(5)을 통해 채널 구역(32)의 전기 저항을 제어하기 위한 적어도 하나의 게이트 전극(G)을 포함하며, g) 드리프트 구역(1) 및 소오스 구역(2)은 한 도전형의 실리콘 탄화물(SiC)로 형성되고, 베이스 구역(3)은 반대 도전형의 실리콘 탄화물(SiC)로 형성되며, h) 적어도 부분적으로 소오스 구역(2) 아래 연장되며 소오스 구역(2)에 직접 인접한 부분 구역(33)이 베이스 구역(3)에 제공되며, 상기 부분 구역(33)은 베이스 구역(3)의 채널 구역(32) 보다 높은 전하 담체 농도를 갖는 MIS 구조물.
- 제1항에 있어서, 베이스 구역(3)의 상기 부분 구역(33)이 전체 소오스 구역(2) 아래 연장되는 것을 특징으로 하는 MIS 구조물.
- 제1항 또는 2항에 있어서, 베이스 구역(3)의 상기 부분 구역(33)이 소오스 전극(S)에 까지 연장되는 것을 특징으로 하는 MIS 구조물.
- 제1항 내지 3항 중 어느 한 항에 있어서, 베이스 구역(3)의 상기 부분 구역(33)이 도핑 재료 입자의 이온 주입에 의해 형성되는 것을 특징으로 하는 MIS 구조물.
- 전술한 항들 중 어느 한 항에 있어서, 베이스 구역(3)의 상기 부분구역(33)이 알루미늄(a1)으로 도핑되는 것을 특징으로 하는 MIS 구조물.
- 전술한 항들 중 어느 한 항에 있어서, 베이스 구역(3)의 적어도 채널구역(32)이 붕소(B)로 도핑되는 것을 특징으로 하는 MIS 구조물.
- 전술한 항 중 어느 한 항에 있어서, 베이스 구역(3)의 드리프트 구역(1)에 인접한 천이 구역(34)에서 그것의 채널 영역(32)에서 보다 높은 전하 담체 농도를 갖는 것을 특징으로 하는 MIS 구조물.
- 제7항에 있어서, 베이스 구역(3)의 천이 구역(34)이 베이스 구역(3) 내로의 도핑 재료 입자의 이온 주입에 의해 형성되는 것을 특징으로 하는 MIS 구조물.
- 제7항 또는 8항에 있어서, 베이스 구역(3)의 천이 구역(34)이 붕소(B)로 도핑되는 것을 특징으로 하는 MIS 구조물.
- 전술한 항들 중 어느 한 항에 있어서, 소오스 구역(2)이 베이스 구역(3)내로 도핑 재료 입자의 이온 주입에 의해 형성되는 것을 특징으로 하는 MIS 구조물.
- 전술한 항들 중 어느 한 항에 있어서, 소오스 구역(2)이 질소(N)로 도핑되는 것을 특징으로 하는 MIS 구조물.
- 전술한 항들 중 어느 한 항에 있어서, 드리프트 구역(1)이 그것의 표면(10)으로부터 떨어진 측면에서 반도체 기판(8) 상에 배치되는 것을 특징으로 하는 MIS 구조물.
- 제12항에 있어서, 반도체 기판(8)이 드리프트 구역(1)보다 높은 전하 담체 농도를 갖는 것을 특징으로 하는 MIS 구조물.
- 제12항 또는 13항에 있어서, 반도체 기판(8)이 드리프트 구역(1)과 동일한 도전형인 것을 특징으로 하는 MIS 구조물.
- 제12항 또는 13항에 있어서, 반도체 기판(8)이 드리프트 구역(1)과 반대 도전형인 것을 특징으로 하는 MIS 구조물.
- 제12항 내지 15항 중 어느 한 항에 있어서, 드리프트 구역(1)으로부터 떨어진 반도체 기판(8)의 표면에 드레인 전극(D)에 배치되는 것을 특징으로 하는 MIS 구조물.
- 전술한 항들 중 어느 한 항에 있어서, 절연체 구역(5)이 산화물로 형성되는 것을 특징으로 하는 MIS 구조물.
- 제17항에 있어서, 절연체 구역(5)의 산화물이 열에 의해 형성되는 것을 특징으로 하는 MIS 구조물.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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EP94103325 | 1994-03-04 | ||
EP94103325.0 | 1994-03-04 | ||
PCT/EP1995/000679 WO1995024055A1 (de) | 1994-03-04 | 1995-02-24 | Mis-struktur auf siliciumcarbid-basis mit hoher latch-up-festigkeit |
Publications (1)
Publication Number | Publication Date |
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KR970701930A true KR970701930A (ko) | 1997-04-12 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1019960704867A KR970701930A (ko) | 1994-03-04 | 1995-02-24 | 높은 래치-업 저항을 가진 실리콘 탄화물을 기초로 한 mis구조물(silicon carbide-based mis structure with high latch-up resistance) |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0748520B1 (ko) |
JP (1) | JP3022598B2 (ko) |
KR (1) | KR970701930A (ko) |
DE (1) | DE59504562D1 (ko) |
TW (1) | TW260827B (ko) |
WO (1) | WO1995024055A1 (ko) |
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DE19610135C1 (de) * | 1996-03-14 | 1997-06-19 | Siemens Ag | Elektronische Einrichtung, insbesondere zum Schalten elektrischer Ströme, für hohe Sperrspannungen und mit geringen Durchlaßverlusten |
EP0992067A1 (de) * | 1997-06-09 | 2000-04-12 | Siemens Aktiengesellschaft | Stromrichter sowie seine verwendung |
DE19925233A1 (de) * | 1998-06-08 | 1999-12-09 | Siemens Ag | Halbleiteranordnung mit ohmscher Kontaktierung und Verfahren zur Kontaktierung einer Halbleiteranordnung |
EP1155458B1 (de) * | 1998-12-18 | 2010-02-03 | Infineon Technologies AG | Feldeffekt-transistoranordnung mit einer grabenförmigen gate-elektrode und einer zusätzlichen hochdotierten schicht im bodygebiet |
DE10038190A1 (de) * | 2000-08-04 | 2002-02-21 | Siced Elect Dev Gmbh & Co Kg | Halbleiteraufbau mit lokal ausgedünntem Substrat |
DE10062026A1 (de) | 2000-12-13 | 2002-07-04 | Siemens Ag | Elektronische Schalteinrichtung |
DE10063084B4 (de) * | 2000-12-18 | 2009-12-03 | Siemens Ag | Leistungselektronische Schaltung |
DE10101744C1 (de) | 2001-01-16 | 2002-08-08 | Siemens Ag | Elektronische Schalteinrichtung und Betriebsverfahren |
WO2005083796A1 (ja) * | 2004-02-27 | 2005-09-09 | Rohm Co., Ltd. | 半導体装置およびその製造方法 |
US7118970B2 (en) | 2004-06-22 | 2006-10-10 | Cree, Inc. | Methods of fabricating silicon carbide devices with hybrid well regions |
JP4761942B2 (ja) * | 2004-11-16 | 2011-08-31 | 株式会社東芝 | 半導体装置 |
JP4620564B2 (ja) * | 2005-10-03 | 2011-01-26 | 三菱電機株式会社 | 半導体装置 |
JP5194380B2 (ja) * | 2006-04-28 | 2013-05-08 | 日産自動車株式会社 | 半導体装置 |
JP5036234B2 (ja) | 2006-07-07 | 2012-09-26 | 三菱電機株式会社 | 半導体装置 |
JP2013065774A (ja) | 2011-09-20 | 2013-04-11 | Toshiba Corp | 半導体装置およびその製造方法 |
JP2013131512A (ja) * | 2011-12-20 | 2013-07-04 | Sumitomo Electric Ind Ltd | 半導体装置およびその製造方法 |
US9331197B2 (en) | 2013-08-08 | 2016-05-03 | Cree, Inc. | Vertical power transistor device |
US10868169B2 (en) | 2013-09-20 | 2020-12-15 | Cree, Inc. | Monolithically integrated vertical power transistor and bypass diode |
US10600903B2 (en) | 2013-09-20 | 2020-03-24 | Cree, Inc. | Semiconductor device including a power transistor device and bypass diode |
GB2589543A (en) * | 2019-09-09 | 2021-06-09 | Mqsemi Ag | Method for forming a low injection P-type contact region and power semiconductor devices with the same |
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Publication number | Priority date | Publication date | Assignee | Title |
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JPS60196975A (ja) * | 1984-08-24 | 1985-10-05 | Nissan Motor Co Ltd | 縦型mosfet |
US4587713A (en) * | 1984-02-22 | 1986-05-13 | Rca Corporation | Method for making vertical MOSFET with reduced bipolar effects |
JPS6113667A (ja) * | 1984-06-28 | 1986-01-21 | Toshiba Corp | 絶縁ゲ−ト形電界効果トランジスタ |
JPS63122277A (ja) * | 1986-11-12 | 1988-05-26 | Fuji Electric Co Ltd | 縦型mosfet |
FR2616966B1 (fr) * | 1987-06-22 | 1989-10-27 | Thomson Semiconducteurs | Structure de transistors mos de puissance |
JPH0334573A (ja) * | 1989-06-30 | 1991-02-14 | Sharp Corp | 炭化珪素電界効果トランジスタ |
JP2509713B2 (ja) * | 1989-10-18 | 1996-06-26 | シャープ株式会社 | 炭化珪素半導体装置およびその製造方法 |
JP2542448B2 (ja) * | 1990-05-24 | 1996-10-09 | シャープ株式会社 | 電界効果トランジスタおよびその製造方法 |
DE69029942T2 (de) * | 1990-10-16 | 1997-08-28 | Sgs Thomson Microelectronics | Verfahren zur Herstellung von MOS-Leistungstransistoren mit vertikalem Strom |
JP2917532B2 (ja) * | 1991-01-24 | 1999-07-12 | 富士電機株式会社 | 電界効果トランジスタ |
JPH0555583A (ja) * | 1991-08-27 | 1993-03-05 | Sanyo Electric Co Ltd | 絶縁ゲート型バイポーラトランジスタの製造方法 |
-
1995
- 1995-02-24 DE DE59504562T patent/DE59504562D1/de not_active Expired - Lifetime
- 1995-02-24 EP EP95911267A patent/EP0748520B1/de not_active Expired - Lifetime
- 1995-02-24 WO PCT/EP1995/000679 patent/WO1995024055A1/de active IP Right Grant
- 1995-02-24 KR KR1019960704867A patent/KR970701930A/ko active IP Right Grant
- 1995-02-24 JP JP7522678A patent/JP3022598B2/ja not_active Expired - Fee Related
- 1995-03-02 TW TW084101964A patent/TW260827B/zh active
Also Published As
Publication number | Publication date |
---|---|
JPH09503626A (ja) | 1997-04-08 |
TW260827B (ko) | 1995-10-21 |
JP3022598B2 (ja) | 2000-03-21 |
EP0748520B1 (de) | 1998-12-16 |
WO1995024055A1 (de) | 1995-09-08 |
EP0748520A1 (de) | 1996-12-18 |
DE59504562D1 (de) | 1999-01-28 |
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