KR960009230A - - Google Patents
Info
- Publication number
- KR960009230A KR960009230A KR19950025822A KR19950025822A KR960009230A KR 960009230 A KR960009230 A KR 960009230A KR 19950025822 A KR19950025822 A KR 19950025822A KR 19950025822 A KR19950025822 A KR 19950025822A KR 960009230 A KR960009230 A KR 960009230A
- Authority
- KR
- South Korea
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02672—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using crystallisation enhancing elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
- H01L27/1274—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor
- H01L27/1277—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor using a crystallisation promoting species, e.g. local introduction of Ni catalyst
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78645—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/78654—Monocrystalline silicon transistors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Optics & Photonics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21807794A JP3897826B2 (ja) | 1994-08-19 | 1994-08-19 | アクティブマトリクス型の表示装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960009230A true KR960009230A (ko) | 1996-03-22 |
Family
ID=16714284
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR19950025822A KR960009230A (ko) | 1994-08-19 | 1995-08-19 | |
KR1020010034585A KR100429943B1 (ko) | 1994-08-19 | 2001-06-19 | 액티브 매트릭스형의 표시 장치 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010034585A KR100429943B1 (ko) | 1994-08-19 | 2001-06-19 | 액티브 매트릭스형의 표시 장치 |
Country Status (5)
Country | Link |
---|---|
US (5) | US5731613A (ko) |
JP (1) | JP3897826B2 (ko) |
KR (2) | KR960009230A (ko) |
CN (5) | CN100334743C (ko) |
TW (1) | TW271012B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000050153A (ko) * | 2000-05-18 | 2000-08-05 | 김상우 | 안전모용 충격흡수 라이너 |
Families Citing this family (63)
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US6008078A (en) * | 1990-07-24 | 1999-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device |
JP3562588B2 (ja) | 1993-02-15 | 2004-09-08 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
US6867432B1 (en) * | 1994-06-09 | 2005-03-15 | Semiconductor Energy Lab | Semiconductor device having SiOxNy gate insulating film |
JP3897826B2 (ja) * | 1994-08-19 | 2007-03-28 | 株式会社半導体エネルギー研究所 | アクティブマトリクス型の表示装置 |
JP3442500B2 (ja) | 1994-08-31 | 2003-09-02 | 株式会社半導体エネルギー研究所 | 半導体回路の作製方法 |
US6670640B1 (en) | 1994-09-15 | 2003-12-30 | Semiconductor Energy Laboratory Co., Ltd. | Method for producing semiconductor device |
US6331475B1 (en) | 1995-01-12 | 2001-12-18 | Semiconductor Energy Laboratory Co., Ltd. | Method and manufacturing semiconductor device |
JPH08264802A (ja) | 1995-03-28 | 1996-10-11 | Semiconductor Energy Lab Co Ltd | 半導体作製方法、薄膜トランジスタ作製方法および薄膜トランジスタ |
US7271410B2 (en) * | 1995-03-28 | 2007-09-18 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix circuit |
TW463378B (en) | 1995-06-01 | 2001-11-11 | Semiconductor Energy Lab | Method of manufacturing semiconductor device |
JP3256110B2 (ja) * | 1995-09-28 | 2002-02-12 | シャープ株式会社 | 液晶表示装置 |
JP3472024B2 (ja) * | 1996-02-26 | 2003-12-02 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP4032443B2 (ja) * | 1996-10-09 | 2008-01-16 | セイコーエプソン株式会社 | 薄膜トランジスタ、回路、アクティブマトリクス基板、液晶表示装置 |
JP3795606B2 (ja) * | 1996-12-30 | 2006-07-12 | 株式会社半導体エネルギー研究所 | 回路およびそれを用いた液晶表示装置 |
JPH10214974A (ja) * | 1997-01-28 | 1998-08-11 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP4401448B2 (ja) * | 1997-02-24 | 2010-01-20 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP4318768B2 (ja) * | 1997-07-23 | 2009-08-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JPH11145056A (ja) * | 1997-11-07 | 1999-05-28 | Sony Corp | 半導体材料 |
JPH11214700A (ja) | 1998-01-23 | 1999-08-06 | Semiconductor Energy Lab Co Ltd | 半導体表示装置 |
JPH11338439A (ja) | 1998-03-27 | 1999-12-10 | Semiconductor Energy Lab Co Ltd | 半導体表示装置の駆動回路および半導体表示装置 |
TW454260B (en) * | 1998-06-30 | 2001-09-11 | Matsushita Electric Ind Co Ltd | Thin film transistor and manufacturing method thereof |
US6582996B1 (en) * | 1998-07-13 | 2003-06-24 | Fujitsu Limited | Semiconductor thin film forming method |
US7153729B1 (en) | 1998-07-15 | 2006-12-26 | Semiconductor Energy Laboratory Co., Ltd. | Crystalline semiconductor thin film, method of fabricating the same, semiconductor device, and method of fabricating the same |
JP4436469B2 (ja) * | 1998-09-30 | 2010-03-24 | 三洋電機株式会社 | 半導体装置 |
US6274887B1 (en) * | 1998-11-02 | 2001-08-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method therefor |
US7141821B1 (en) * | 1998-11-10 | 2006-11-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having an impurity gradient in the impurity regions and method of manufacture |
US6277679B1 (en) | 1998-11-25 | 2001-08-21 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing thin film transistor |
US6380558B1 (en) * | 1998-12-29 | 2002-04-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating the same |
US6858898B1 (en) | 1999-03-23 | 2005-02-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
KR100412743B1 (ko) * | 1999-03-30 | 2003-12-31 | 세이코 엡슨 가부시키가이샤 | 박막 트랜지스터의 제조 방법 |
US6461899B1 (en) * | 1999-04-30 | 2002-10-08 | Semiconductor Energy Laboratory, Co., Ltd. | Oxynitride laminate “blocking layer” for thin film semiconductor devices |
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US6646287B1 (en) | 1999-11-19 | 2003-11-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device with tapered gate and insulating film |
US6618115B1 (en) * | 1999-11-19 | 2003-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Defective pixel compensation system and display device using the system |
JP4784955B2 (ja) * | 2001-07-18 | 2011-10-05 | 株式会社 液晶先端技術開発センター | 薄膜半導体装置の製造方法 |
JP4141138B2 (ja) | 2001-12-21 | 2008-08-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP4030758B2 (ja) * | 2001-12-28 | 2008-01-09 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP4011344B2 (ja) * | 2001-12-28 | 2007-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US6601308B2 (en) | 2002-01-02 | 2003-08-05 | Bahram Khoshnood | Ambient light collecting bow sight |
US6841797B2 (en) * | 2002-01-17 | 2005-01-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device formed over a surface with a drepession portion and a projection portion |
KR100514179B1 (ko) * | 2002-11-19 | 2005-09-13 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 이를 사용하는 유기 전계 발광 소자 |
JP4873858B2 (ja) * | 2002-08-19 | 2012-02-08 | ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク | エッジ領域を最小にするために基板のフィルム領域のレーザ結晶化処理方法及び装置並びにそのようなフィルム領域の構造 |
GB0222450D0 (en) * | 2002-09-27 | 2002-11-06 | Koninkl Philips Electronics Nv | Method of manufacturing an electronic device comprising a thin film transistor |
FR2852533B1 (fr) * | 2003-03-20 | 2006-10-06 | Arck Electronique | Dispositif de detection de trous dans des materiaux defilant en bandes continues |
JP2005064453A (ja) * | 2003-07-29 | 2005-03-10 | Advanced Display Inc | 薄膜トランジスタ及びその製造方法 |
US7211840B2 (en) * | 2003-10-31 | 2007-05-01 | Semiconductor Energy Laboratory Co., Ltd. | Transistor |
SG115733A1 (en) * | 2004-03-12 | 2005-10-28 | Semiconductor Energy Lab | Thin film transistor, semiconductor device, and method for manufacturing the same |
KR100682893B1 (ko) * | 2004-10-13 | 2007-02-15 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법 |
US7858451B2 (en) | 2005-02-03 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, semiconductor device and manufacturing method thereof |
JP5232360B2 (ja) * | 2006-01-05 | 2013-07-10 | 株式会社ジャパンディスプレイイースト | 半導体装置及びその製造方法 |
KR101223530B1 (ko) * | 2006-05-10 | 2013-01-18 | 엘지디스플레이 주식회사 | 액정표시장치용 게이트 구동회로 및 이를 포함하는액정표시장치 |
EP1863090A1 (en) * | 2006-06-01 | 2007-12-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
JP4801608B2 (ja) * | 2007-03-06 | 2011-10-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US7879699B2 (en) | 2007-09-28 | 2011-02-01 | Infineon Technologies Ag | Wafer and a method for manufacturing a wafer |
WO2011055660A1 (en) | 2009-11-06 | 2011-05-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8624239B2 (en) | 2010-05-20 | 2014-01-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP5925475B2 (ja) | 2010-12-09 | 2016-05-25 | 株式会社半導体エネルギー研究所 | 光検出回路 |
KR102069683B1 (ko) | 2012-08-24 | 2020-01-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 방사선 검출 패널, 방사선 촬상 장치, 및 화상 진단 장치 |
KR101996038B1 (ko) * | 2012-08-31 | 2019-07-03 | 엘지디스플레이 주식회사 | 평판표시장치 |
DE102013217278B4 (de) | 2012-09-12 | 2017-03-30 | Semiconductor Energy Laboratory Co., Ltd. | Photodetektorschaltung, Bildgebungsvorrichtung und Verfahren zum Ansteuern einer Photodetektorschaltung |
KR102049740B1 (ko) * | 2012-12-13 | 2019-11-28 | 엘지디스플레이 주식회사 | 액정표시장치 및 그 제조방법 |
CN114512510A (zh) * | 2020-11-16 | 2022-05-17 | 群创光电股份有限公司 | 显示装置 |
CN113540125B (zh) * | 2021-07-13 | 2024-01-05 | 武汉天马微电子有限公司 | 阵列基板、显示面板和显示装置 |
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1994
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1995
- 1995-08-09 TW TW084108300A patent/TW271012B/zh not_active IP Right Cessation
- 1995-08-09 US US08/513,090 patent/US5731613A/en not_active Expired - Lifetime
- 1995-08-18 CN CNB001339990A patent/CN100334743C/zh not_active Expired - Lifetime
- 1995-08-18 CN CNB021278636A patent/CN1194378C/zh not_active Expired - Lifetime
- 1995-08-18 CN CN2005100229952A patent/CN1815743B/zh not_active Expired - Lifetime
- 1995-08-18 CN CN95109812A patent/CN1091953C/zh not_active Expired - Fee Related
- 1995-08-18 CN CNB2004100694517A patent/CN100420026C/zh not_active Expired - Lifetime
- 1995-08-19 KR KR19950025822A patent/KR960009230A/ko not_active Application Discontinuation
-
1997
- 1997-09-26 US US08/938,310 patent/US5959313A/en not_active Expired - Lifetime
-
2001
- 2001-06-19 KR KR1020010034585A patent/KR100429943B1/ko not_active IP Right Cessation
-
2004
- 2004-08-26 US US10/926,006 patent/US7557377B2/en not_active Expired - Fee Related
-
2006
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000050153A (ko) * | 2000-05-18 | 2000-08-05 | 김상우 | 안전모용 충격흡수 라이너 |
Also Published As
Publication number | Publication date |
---|---|
US7557377B2 (en) | 2009-07-07 |
US5959313A (en) | 1999-09-28 |
CN1091953C (zh) | 2002-10-02 |
CN1815743A (zh) | 2006-08-09 |
CN1125901A (zh) | 1996-07-03 |
CN1421726A (zh) | 2003-06-04 |
CN1815743B (zh) | 2011-01-05 |
TW271012B (ko) | 1996-02-21 |
US7550765B2 (en) | 2009-06-23 |
KR100429943B1 (ko) | 2004-05-04 |
JPH0864834A (ja) | 1996-03-08 |
CN1295348A (zh) | 2001-05-16 |
CN100420026C (zh) | 2008-09-17 |
US20090261359A1 (en) | 2009-10-22 |
US5731613A (en) | 1998-03-24 |
US8450743B2 (en) | 2013-05-28 |
US20050041005A1 (en) | 2005-02-24 |
CN100334743C (zh) | 2007-08-29 |
JP3897826B2 (ja) | 2007-03-28 |
US20060175612A1 (en) | 2006-08-10 |
CN1194378C (zh) | 2005-03-23 |
CN1553507A (zh) | 2004-12-08 |
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