KR940006485U - 리드 노출형 반도체 조립장치 - Google Patents

리드 노출형 반도체 조립장치

Info

Publication number
KR940006485U
KR940006485U KR2019920015766U KR920015766U KR940006485U KR 940006485 U KR940006485 U KR 940006485U KR 2019920015766 U KR2019920015766 U KR 2019920015766U KR 920015766 U KR920015766 U KR 920015766U KR 940006485 U KR940006485 U KR 940006485U
Authority
KR
South Korea
Prior art keywords
assembly equipment
semiconductor assembly
exposed semiconductor
lead exposed
lead
Prior art date
Application number
KR2019920015766U
Other languages
English (en)
Other versions
KR0128251Y1 (ko
Inventor
차기본
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019920015766U priority Critical patent/KR0128251Y1/ko
Priority to JP1993045198U priority patent/JP2599748Y2/ja
Priority to TW082106855A priority patent/TW223183B/zh
Publication of KR940006485U publication Critical patent/KR940006485U/ko
Priority to US08/290,398 priority patent/US5428248A/en
Application granted granted Critical
Publication of KR0128251Y1 publication Critical patent/KR0128251Y1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29005—Structure
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    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
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    • H01L2224/48091—Arched
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR2019920015766U 1992-08-21 1992-08-21 리드 노출형 반도체 조립장치 KR0128251Y1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR2019920015766U KR0128251Y1 (ko) 1992-08-21 1992-08-21 리드 노출형 반도체 조립장치
JP1993045198U JP2599748Y2 (ja) 1992-08-21 1993-08-19 リード露出型半導体パッケージ
TW082106855A TW223183B (en) 1992-08-21 1993-08-24 Resin molded semiconductor package
US08/290,398 US5428248A (en) 1992-08-21 1994-08-15 Resin molded semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019920015766U KR0128251Y1 (ko) 1992-08-21 1992-08-21 리드 노출형 반도체 조립장치

Publications (2)

Publication Number Publication Date
KR940006485U true KR940006485U (ko) 1994-03-25
KR0128251Y1 KR0128251Y1 (ko) 1998-10-15

Family

ID=19338791

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019920015766U KR0128251Y1 (ko) 1992-08-21 1992-08-21 리드 노출형 반도체 조립장치

Country Status (4)

Country Link
US (1) US5428248A (ko)
JP (1) JP2599748Y2 (ko)
KR (1) KR0128251Y1 (ko)
TW (1) TW223183B (ko)

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US5594234A (en) * 1994-11-14 1997-01-14 Texas Instruments Incorporated Downset exposed die mount pad leadframe and package
KR0156622B1 (ko) * 1995-04-27 1998-10-15 문정환 반도체 패키지,리드프레임 및 제조방법
KR0179803B1 (ko) * 1995-12-29 1999-03-20 문정환 리드노출형 반도체 패키지
US5866939A (en) * 1996-01-21 1999-02-02 Anam Semiconductor Inc. Lead end grid array semiconductor package
KR100186309B1 (ko) * 1996-05-17 1999-03-20 문정환 적층형 버텀 리드 패키지
KR100206910B1 (ko) * 1996-06-14 1999-07-01 구본준 반도체 패키지의 디플래쉬 방법
KR0179924B1 (ko) * 1996-06-14 1999-03-20 문정환 버텀리드 반도체 패키지
KR0179925B1 (ko) * 1996-06-14 1999-03-20 문정환 리드프레임 및 그를 이용한 버텀 리드 반도체 패키지
KR980006174A (ko) * 1996-06-18 1998-03-30 문정환 버틈 리드 패키지
US5863805A (en) * 1996-07-08 1999-01-26 Industrial Technology Research Institute Method of packaging semiconductor chips based on lead-on-chip (LOC) architecture
KR100201397B1 (ko) * 1996-07-29 1999-06-15 구본준 반도체 패키지 장착용 패키지
JP3026426B2 (ja) * 1996-08-29 2000-03-27 沖電気工業株式会社 樹脂封止型半導体装置とその製造方法及びその金型構造
JP3012816B2 (ja) * 1996-10-22 2000-02-28 松下電子工業株式会社 樹脂封止型半導体装置およびその製造方法
KR100237051B1 (ko) * 1996-12-28 2000-01-15 김영환 버텀리드 반도체 패키지 및 그 제조 방법
KR100242994B1 (ko) * 1996-12-28 2000-02-01 김영환 버텀리드프레임 및 그를 이용한 버텀리드 반도체 패키지
DE19701165C1 (de) * 1997-01-15 1998-04-09 Siemens Ag Chipkartenmodul
JP3877401B2 (ja) 1997-03-10 2007-02-07 三洋電機株式会社 半導体装置の製造方法
JP3022393B2 (ja) * 1997-04-21 2000-03-21 日本電気株式会社 半導体装置およびリードフレームならびに半導体装置の製造方法
US6157074A (en) * 1997-07-16 2000-12-05 Hyundai Electronics Industries Co., Ltd. Lead frame adapted for variable sized devices, semiconductor package with such lead frame and method for using same
KR100259359B1 (ko) * 1998-02-10 2000-06-15 김영환 반도체 패키지용 기판 및 반도체 패키지, 그리고 그 제조방법
JP3420057B2 (ja) * 1998-04-28 2003-06-23 株式会社東芝 樹脂封止型半導体装置
US6122822A (en) * 1998-06-23 2000-09-26 Vanguard International Semiconductor Corporation Method for balancing mold flow in encapsulating devices
US7332375B1 (en) 1998-06-24 2008-02-19 Amkor Technology, Inc. Method of making an integrated circuit package
US7112474B1 (en) 1998-06-24 2006-09-26 Amkor Technology, Inc. Method of making an integrated circuit package
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KR0128251Y1 (ko) 1998-10-15
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JP2599748Y2 (ja) 1999-09-20
JPH0629147U (ja) 1994-04-15

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