KR920000146A - 고전압 직접회로 - Google Patents
고전압 직접회로 Download PDFInfo
- Publication number
- KR920000146A KR920000146A KR1019900018872A KR900018872A KR920000146A KR 920000146 A KR920000146 A KR 920000146A KR 1019900018872 A KR1019900018872 A KR 1019900018872A KR 900018872 A KR900018872 A KR 900018872A KR 920000146 A KR920000146 A KR 920000146A
- Authority
- KR
- South Korea
- Prior art keywords
- integrated circuit
- high voltage
- voltage integrated
- circuit according
- stable layer
- Prior art date
Links
- 239000004020 conductor Substances 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 3
- 230000003071 parasitic effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Bipolar Transistors (AREA)
- Dicing (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명이 해결해야 할 문제점을 예시한 예시도,
제5도는 본 발명을 따르는 직접회로의 단면도,
제6도는 본 발명을 따르는 직접회로의 단면도.
Claims (5)
- 대지 또는 대지에 가까운 전위에 접속된 급속도체(30),(32)가 연결되고 안정층(18)에 의해 덮혀진 고전압 직접회로에 있어서, 안정층(18)은 금속도체(30),(32)위에서 부분적으로 나누어진 형태(34),(36)로 되어 MOS형 트랜지스터의 기생발생을 방지하는 것을 특징으로 하는 상기 고전압 직접회로.
- 제1항에 있어서, 안정층(18)은 금속도체(30),(32)위에 슬롯이 형성된 것을 특징으로 하는 고전압 직접회로.
- 제2항에 있어서, 슬롯들이 서로가 인접한 것을 특징으로 하는 고전압 직접회로.
- 제2 또는 3항에 있어서, 슬롯들(34),(36)은 나비가 수 ㎛인 것을 특징으로 하는 고전압 직접회로.
- 선행항중 어떤항에 있어서, 금속도체위에서 나누어진 형태들은 처리단계가 같고 결합패드 및 스크라이브선과 같은 마스크에 형성된 것을 특징으로 하는 고전압 직접회로.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE8904120-6 | 1989-12-06 | ||
SE8904120A SE465193B (sv) | 1989-12-06 | 1989-12-06 | Foer hoegspaenning avsedd ic-krets |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920000146A true KR920000146A (ko) | 1992-01-10 |
KR960001614B1 KR960001614B1 (ko) | 1996-02-02 |
Family
ID=20377705
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900018872A KR960001614B1 (ko) | 1989-12-06 | 1990-11-21 | 고전압 집적회로 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5861656A (ko) |
KR (1) | KR960001614B1 (ko) |
GB (1) | GB2238910B (ko) |
IT (1) | IT1243934B (ko) |
SE (1) | SE465193B (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6246070B1 (en) * | 1998-08-21 | 2001-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device provided with semiconductor circuit made of semiconductor element and method of fabricating the same |
JP4493741B2 (ja) * | 1998-09-04 | 2010-06-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
EP1026732A1 (en) * | 1999-02-05 | 2000-08-09 | Motorola, Inc. | A method of forming a high voltage semiconductor device |
US6580107B2 (en) * | 2000-10-10 | 2003-06-17 | Sanyo Electric Co., Ltd. | Compound semiconductor device with depletion layer stop region |
JP2003229502A (ja) * | 2002-02-01 | 2003-08-15 | Mitsubishi Electric Corp | 半導体装置 |
US6683329B2 (en) * | 2002-02-28 | 2004-01-27 | Oki Electric Industry Co., Ltd. | Semiconductor device with slot above guard ring |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3836998A (en) * | 1969-01-16 | 1974-09-17 | Signetics Corp | High voltage bipolar semiconductor device and integrated circuit using the same and method |
US3611071A (en) * | 1969-04-10 | 1971-10-05 | Ibm | Inversion prevention system for semiconductor devices |
JPS4836598B1 (ko) * | 1969-09-05 | 1973-11-06 | ||
JPS4914390B1 (ko) * | 1969-10-29 | 1974-04-06 | ||
JPS501872B1 (ko) * | 1970-01-30 | 1975-01-22 | ||
JPS4940394B1 (ko) * | 1970-08-28 | 1974-11-01 | ||
DE2603747A1 (de) * | 1976-01-31 | 1977-08-04 | Licentia Gmbh | Integrierte schaltungsanordnung |
JPS5811750B2 (ja) * | 1979-06-04 | 1983-03-04 | 株式会社日立製作所 | 高耐圧抵抗素子 |
JPS5955037A (ja) * | 1982-09-24 | 1984-03-29 | Hitachi Ltd | 半導体装置 |
JPS6066444A (ja) * | 1983-09-21 | 1985-04-16 | Seiko Epson Corp | 半導体装置 |
JPS60247940A (ja) * | 1984-05-23 | 1985-12-07 | Hitachi Ltd | 半導体装置およびその製造方法 |
US4606998A (en) * | 1985-04-30 | 1986-08-19 | International Business Machines Corporation | Barrierless high-temperature lift-off process |
US4825278A (en) * | 1985-10-17 | 1989-04-25 | American Telephone And Telegraph Company At&T Bell Laboratories | Radiation hardened semiconductor devices |
JPH01184942A (ja) * | 1988-01-20 | 1989-07-24 | Toshiba Corp | トリミング素子とその電気短絡方法 |
JPH0237776A (ja) * | 1988-07-28 | 1990-02-07 | Fujitsu Ltd | 半導体装置 |
-
1989
- 1989-12-06 SE SE8904120A patent/SE465193B/sv not_active IP Right Cessation
-
1990
- 1990-11-16 GB GB9024952A patent/GB2238910B/en not_active Expired - Fee Related
- 1990-11-21 KR KR1019900018872A patent/KR960001614B1/ko not_active IP Right Cessation
- 1990-11-27 IT IT02220190A patent/IT1243934B/it active IP Right Grant
-
1992
- 1992-03-23 US US07/855,490 patent/US5861656A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
SE8904120D0 (sv) | 1989-12-06 |
GB2238910B (en) | 1993-08-11 |
GB9024952D0 (en) | 1991-01-02 |
GB2238910A (en) | 1991-06-12 |
SE8904120L (sv) | 1991-06-07 |
KR960001614B1 (ko) | 1996-02-02 |
IT9022201A0 (it) | 1990-11-27 |
IT1243934B (it) | 1994-06-28 |
SE465193B (sv) | 1991-08-05 |
US5861656A (en) | 1999-01-19 |
IT9022201A1 (it) | 1991-06-07 |
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Legal Events
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---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20100128 Year of fee payment: 15 |
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EXPY | Expiration of term |