KR900005576A - 반도체 집적회로 장치 - Google Patents

반도체 집적회로 장치 Download PDF

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Publication number
KR900005576A
KR900005576A KR1019890012250A KR890012250A KR900005576A KR 900005576 A KR900005576 A KR 900005576A KR 1019890012250 A KR1019890012250 A KR 1019890012250A KR 890012250 A KR890012250 A KR 890012250A KR 900005576 A KR900005576 A KR 900005576A
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KR
South Korea
Prior art keywords
integrated circuit
circuit device
semiconductor integrated
wiring layer
wiring
Prior art date
Application number
KR1019890012250A
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English (en)
Inventor
노부오 오와다
가오루 오가야
도오루 고바야시
미끼노리 가와지
Original Assignee
미다 가쓰시게
가부시끼가이샤 히다찌 세이사꾸쇼
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Application filed by 미다 가쓰시게, 가부시끼가이샤 히다찌 세이사꾸쇼 filed Critical 미다 가쓰시게
Publication of KR900005576A publication Critical patent/KR900005576A/ko

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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

내용 없음

Description

반도체 집적회로 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 땜납범프의 레이아우트를 도시한 반도체 칩의 평면도.
제2도는 땜납범프를 확대해서 도시한 반도체 칩의 주요부 평면도.
제4도는 제1도의 Ⅱ-Ⅱ선의 반도체 칩의 단면도.
제5도는 ECL 3입력 OR게이트를 도시한 회로도.

Claims (18)

  1. 주면을 갖는 반도체 기판, 상기 주면에 형성된 여러개의 반도체 소자, 상기 반도체 소자를 덮도록 상기 주면에 형성된 제 1 의 층간 절연막, 상기 제 1 의 층간 절연막위에 형성되어서 서로 평행하게 연장하며 상기 반도체 소자 사이를 전기적으로 접속하기 위한 배선수단으로서 각각이 소정의 두께를 갖는 제 1 의 배선층, 상기 제 1 의 배선층을 덮도록 형성된 제 2 의 층간 절연막, 상기 제 2 의 층간 절연막 위에 형성된 제 2 의 배선층, 상기 제 2 의 배선층중 선택된 하나의 위면에 마련되고 상기 반도체 소자와 상기 반도체 기판의 외부에 마련되는 장치를 전기적으로 접속하기 위한 영역인 패드부와 상기 패드부위에 형성된 돌기전극을 포함하며, 적어도 상기 패드부 영역의 아래 및 그 근방의 제 1 의 배선층 사이에 상기 제 1 의 배선층과 같은 두께의 두전막이 마련되어 있는 반도체 집적회로 장치.
  2. 특허청구의 범위 제 1항에 있어서, 상기 도전막은 더미패턴인 반도체 집적회로 장치.
  3. 특허청구의 범위 제 2 항에 있어서, 상기 더미패턴은 상기 제 1 의 배선층과 동일한 공정으로 형성되는 반도체 집적회로 장치.
  4. 특허청구의 범위 제 2 항에 있어서, 상기 더미패턴은 상기 배선층과 동일한 재료로 구성되어 있는 반도체 집적회로 장치.
  5. 특허청구의 범위 제 2 항에 있어서, 상기 더미패턴은 상기 제 1 의 배선층과 동일한 선의 폭을 갖고, 인접하는 제 1 의 배선층 또는 다른 더미패턴과의 간격이 같아지도록 배치되어 있는 반도체 집적회로 장치.
  6. 특허청구의 범위 제 2 항에 있어서, 상기 더미패턴은 플로팅상태로 되어 있는 반도체 집적회로 장치.
  7. 특허청구의 범위 제 2 항에 있어서, 상기 더미패턴은 상기 제 1 의 배선층의 일부를 구성하고 있는 반도체 집적회로 장치.
  8. 특허 청구의 범위 제 2항에 있어서, 상기 더미패턴은 그물눈형상으로 형성되어 있는 반도체 집적회로 장치.
  9. 특허 청구의 범위 제1항에 있어서, 상기 돌기전극은 범프인 반도체 집적회로 장치.
  10. 특허 청구의 범위 제1항에 있어서, 상기 제 2의 배선층의 측벽을 50 ∼70로 경사지게한 반도체 집적회로장치.
  11. 특허 청구의 범위 제1항에 있어서, 상기 제1의 배선층은 제3의 배선이며, 상기 제2의 배선층은 제4층의 배선인 반도체 집적회로 장치.
  12. 특허 청구의 범위 제1항에 있어서, 상기 도전막은 상기 제3층의 배선채널과 그 바로아래의 제2층 배선층의 배선채널이 교차하는 영역위에 그물눈형상으로 마련되어 있는 반도체 집적회로 장치.
  13. 특허 청구의 범위 제1항에 있어서, 상기 도전막은 상기 패드부 영역 및 그 근방의 영역에서 단차를 완화하기 위해 형성되어 있는 반도체 집적회로 장치.
  14. 특허청구의 범위 제1항에 있어서, 상기 도전막은 제1배선층의 연정하는 방향과 동일한 방향으로 연장하는 사각형의 패턴인 반도체 집적회로 장치
  15. 특허 청구의 범위 제 8항에 있어서, 상기 그물눈형상 더미패턴은 각각이 정방형상의 패턴인 반도체 집적회로 장치.
  16. 특허 청구의 범위 제12항에 있어서, 상기 그물눈형상의 도전막은 각각이 정방형상의 더미패턴인 반도체 집적회로 장치
  17. 특허청구의 범위 제1항에 있어서, 또 상기 반도체 기판을 내장하기 위해서 상기 반도체 기판과 상기 반도체 기판위에 형성된 상기 돌기전극을 거쳐서 전기적으로 접속되어 있는 배선기판, 상기 반도체 기판 및 배선기판과 접합제를 거쳐서 접합되어 있는 상기 반도체 기판을 봉하여 막기 위한 캡을 포함하는 반도체 집적회로 장치
  18. 특허 청구의 범위 제17항에 있어서, 또 상기 배선기판의 상기 돌기전극이 접속되어 있는 면의 반대측의 면위에 형성된 돌기전극을 포함하는 반도체 집적회로 장치
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890012250A 1988-09-13 1989-08-28 반도체 집적회로 장치 KR900005576A (ko)

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US5027188A (en) 1991-06-25
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