KR960042902A - 솔더 볼 장착홈을 갖는 인쇄 회로 기판과 이를 사용한 볼 그리드 어레이 패키지 - Google Patents

솔더 볼 장착홈을 갖는 인쇄 회로 기판과 이를 사용한 볼 그리드 어레이 패키지 Download PDF

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KR960042902A
KR960042902A KR1019950014293A KR19950014293A KR960042902A KR 960042902 A KR960042902 A KR 960042902A KR 1019950014293 A KR1019950014293 A KR 1019950014293A KR 19950014293 A KR19950014293 A KR 19950014293A KR 960042902 A KR960042902 A KR 960042902A
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pattern layer
solder ball
pad
circuit board
mounting groove
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KR1019950014293A
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KR0157284B1 (ko
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오상언
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김광호
삼성전자 주식회사
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Priority to JP7197412A priority patent/JP2768650B2/ja
Priority to US08/512,013 priority patent/US5636104A/en
Publication of KR960042902A publication Critical patent/KR960042902A/ko
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
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    • H05K7/00—Constructional details common to different types of electric apparatus
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    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
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    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
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    • H05K2203/04—Soldering or other types of metallurgic bonding
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

본 발명은 다수의 입출력 핀을 갖는 반도체 소자를 패키지하는 볼 그리드 어레이(BGA) 패키지에 관한 것으로서, 복수의 전도성 패턴 층으로 이루어진 인쇄 회로기판(PCB)의 가장 바깥쪽 패턴 층의 솔더 볼이 부착될 부분에 구멍을 뚫고 이 패턴 층 바로 다음 층에는 상기 구멍에 해당하는 위치에 구리 패드를 형성한다. 바깥쪽 패턴 층의 구멍 주위에는 구리 패드를 도포함으로써, 외부 패드(22)와 내부 패드(23)로 구성된 오목 홈 형태의 솔더 볼 부착 패드를 형성한다. 여기서, 홈의 깊이는 외부 패드가 형성된 패턴 층과 내부 패드가 형성된 패턴층의 층간 두께와 같으며, 홈의 크기는 사용하는 솔더 볼의 크기에 따라 조정된다. 이러한 구조를 갖는 솔더 볼 패드에솔더 볼을 올려놓고 리플로 솔더 공정을 하면, 솔더 볼이 내부 패드와 외부 패드에 모두 녹아붙기 때문에 솔더 볼과 기판과의 결합력이 강화되고, 솔더볼에서 발생하기 쉬운 크랙을 방지하며 솔더 볼의 전체 높이를 낮출 수 있다는 장점이 있다.

Description

솔더 볼 장착홈을 갖는 인쇄 회로 기판과 이를 사용한 볼 그리드 어레이 패키지
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 본 발명에 따른 구조를 갖는 인쇄 회로 기판을 사용한 볼 그리드 어레이 패키지 부분 단면도, 제5도는 본 발명에 따른 구조을 갖는 인쇄 회로 기판의 구조 설명도, 제6A도 및 제6B도는 본 발명에 따른 구조를 갖는 인쇄 회로 기판에 솔더 볼을 놓로 리플로 솔더 공정을 통해 솔더 볼 장착 홈에 부착시킨 부분 확대도, 제7도는 본 발명에 따른 인쇄 회로 기판에 솔더 볼 대신에 구리나 합금으로 이루어진 금속 칼럼을 사용한 볼 그리드 어레이 패키지의 부분 단면도.

Claims (6)

  1. 반도체 칩과, 상기 반도체 칩이 탑재되며 소정의 전도성 패턴이 형성된 제1패턴 층과 제2패턴 층을 포함하는 복수의 패턴 층으로 이루어진 회로 기판과, 상기 반도체 칩을 보호하기 위한 몰딩 수지와, 상기 소정의 전도성 패턴을 통해 상기 반도체 칩과 전기적으로 연결되며 상기 회로 기판 밑면에 부착되는 복수의 솔더 볼을 구비하는 볼 그리드 어레이 반도체 패키지에 있어서, 상기 복수의 솔더 볼이 부착되는 상기 회로 기판의 상기 제1패턴 층에는 제1전도성 패드가 형성되어 있고 상기 제2패턴 층에는 제2전도성 패드가 형성되어 있어서 상기 제1패턴 층과 제2패턴 층의 층간 간격만큼의 깊이를 갖는 솔더 볼장착 홈이 구비되어 있는 것을 특징으로 하는 볼 그리드 어레이 반도체 패키지.
  2. 제1항에 있어서, 상기 솔더 볼 장착 홈의 너비는 상기 솔더 볼의 지름보다 작거나 같은 것을 특징으로 하는 볼 그리드 어레이 반도체 패키지.
  3. 제1항 또는 제2항에 있어서, 상기 솔더 볼은 구리나 합금으로 이루어진 금속 칼럼인 것을 특징으로 하는 볼그리드 어레이 반도체 패키지.
  4. 제1항 또는 제2항에 있어서, 상기 솔더 볼 장착 홈에 장착된 상기 복수의 솔더 볼 각각은 상기 제1전도성 패드와 제2전도성 패드에 용융 접합되어서 버섯 모양을 갖는 것을 특징으로 하는 볼 그리드 어레이 반도체 패키지.
  5. 소정의 전도성 패턴이 형성되어 있는 제1패턴 층과 제2패턴 층을 포함하는 복수의 패턴 층과 상기 복수의 패턴 층 사이에 삽입되는 유전 물질을 구비하는 회로 기판에 있어서, 상기 제1패턴 층에는 제1전기 전도성 패드가 패턴 형성되어 있고 상기 제2패턴 층에는 제2전기 전도성 패드가 패턴 형성되어 있으며, 상기 제1전도성 패드와 제2전도성 패드는 상기 제1패턴 층과 제2패턴 층 사이의 유전 물질의 두께 만큼의 깊이를 가지는 솔더 볼 장착 홈을 구성하는 것을 특징으로 하는 회로 기판.
  6. 제5항에 있어서, 상기 솔더 볼 장착 홈의 너비는 상기 장착 홈에 장착되는 솔더 볼의 지름보다 작거나 같은 것을 특징으로 하는 회로 기판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950014293A 1995-05-31 1995-05-31 솔더 볼 장착홈을 갖는 인쇄 회로 기판과 이를 사용한 볼 그리드 어레이 패키지 KR0157284B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019950014293A KR0157284B1 (ko) 1995-05-31 1995-05-31 솔더 볼 장착홈을 갖는 인쇄 회로 기판과 이를 사용한 볼 그리드 어레이 패키지
JP7197412A JP2768650B2 (ja) 1995-05-31 1995-08-02 ソルダーボールの装着溝を有する印刷回路基板とこれを使用したボールグリッドアレイパッケージ
US08/512,013 US5636104A (en) 1995-05-31 1995-08-07 Printed circuit board having solder ball mounting groove pads and a ball grid array package using such a board

Applications Claiming Priority (1)

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KR1019950014293A KR0157284B1 (ko) 1995-05-31 1995-05-31 솔더 볼 장착홈을 갖는 인쇄 회로 기판과 이를 사용한 볼 그리드 어레이 패키지

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KR960042902A true KR960042902A (ko) 1996-12-21
KR0157284B1 KR0157284B1 (ko) 1999-02-18

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US (1) US5636104A (ko)
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KR100544969B1 (ko) * 1997-03-13 2006-01-24 이비덴 가부시키가이샤 프린트배선판 및 그 제조방법
KR100702967B1 (ko) * 2000-12-01 2007-04-03 삼성전자주식회사 솔더 볼 부착 홈이 형성된 리드 프레임을 포함하는 반도체패키지 및 그를 이용한 적층 패키지

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KR100544969B1 (ko) * 1997-03-13 2006-01-24 이비덴 가부시키가이샤 프린트배선판 및 그 제조방법
US7339118B1 (en) 1997-03-13 2008-03-04 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
US7612295B2 (en) 1997-03-13 2009-11-03 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
KR100450246B1 (ko) * 1997-06-30 2005-05-24 삼성전자주식회사 솔더 볼 부착 장치
KR100702967B1 (ko) * 2000-12-01 2007-04-03 삼성전자주식회사 솔더 볼 부착 홈이 형성된 리드 프레임을 포함하는 반도체패키지 및 그를 이용한 적층 패키지

Also Published As

Publication number Publication date
JP2768650B2 (ja) 1998-06-25
JPH08330473A (ja) 1996-12-13
US5636104A (en) 1997-06-03
KR0157284B1 (ko) 1999-02-18

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