KR100546832B1 - 임베디드 pcb 기판을 사용한 듀플렉서 및 그 제조 방법 - Google Patents
임베디드 pcb 기판을 사용한 듀플렉서 및 그 제조 방법 Download PDFInfo
- Publication number
- KR100546832B1 KR100546832B1 KR1020030058072A KR20030058072A KR100546832B1 KR 100546832 B1 KR100546832 B1 KR 100546832B1 KR 1020030058072 A KR1020030058072 A KR 1020030058072A KR 20030058072 A KR20030058072 A KR 20030058072A KR 100546832 B1 KR100546832 B1 KR 100546832B1
- Authority
- KR
- South Korea
- Prior art keywords
- filter
- filter stage
- pcb substrate
- metal layer
- duplexer
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/703—Networks using bulk acoustic wave devices
- H03H9/706—Duplexers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0571—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including bulk acoustic wave [BAW] devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81192—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1006—Non-printed filter
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Waveguide Switches, Polarizers, And Phase Shifters (AREA)
Abstract
Description
Claims (13)
- 송신 주파수 대역의 신호를 통과시키는 제1필터단;수신 주파수 대역의 신호를 통과시키는 제2필터단;상부표면의 일정 부분에 상기 제1필터단 및 제2필터단이 서로 소정 거리 이격되어 접합되고, 상기 제1필터단 및 제2필터단간의 신호간섭을 방지하는 필터격리부를 내장한 임베디드 PCB 기판;및상기 제1필터단 및 상기 제2필터단의 상층으로 일정 거리 이격되도록 상기 임베디드 PCB 기판 상부 전면을 덮는 패키징 기판;을 포함하는 것을 특징으로 하는 듀플렉서.
- 제1항에 있어서,상기 제1필터단 및 제2필터단 중 적어도 하나는,하부전극, 압전층 및 상부전극이 차례로 적층되어 이루어지는 압전 박막 음향 공진기를 적어도 하나 포함하는 것을 특징으로 하는 듀플렉서.
- 제1항에 있어서,상기 제1필터단 및 제2필터단은,도전성 범프를 사용하는 범핑(bumping)방식으로, 각각 상기 임베디드 PCB 기판 상면과 소정간격의 에어갭을 가지도록 접합된 것을 특징으로 하는 듀플렉서.
- 제1항에 있어서,상기 필터 격리부는,상기 제1필터단 및 제2필터단으로 입력되는 신호 상호간의 주파수 위상차를 90°로 만들어 상호간섭을 방지하는 역할을 하는 것을 특징으로 하는 듀플렉서.
- 제4항에 있어서,상기 필터격리부는,PCB 기판의 양면에 제1메탈층, 유전층 및 제2메탈층이 순차적으로 적층되어 형성되는 커패시터 및 코일;을 포함하는 것을 특징으로 하는 듀플렉서.
- 제4항에 있어서,상기 필터격리부는, 순차적으로 적층된 수개의 PCB 기판 사이에 제작되어, 상기 제1필터단 및 제2필터단 중 어느 하나가 통과시키는 신호의 파장의 1/4 에 해당하는 길이를 가지는 트랜스미션 라인;을 포함하는 것을 특징으로 하는 듀플렉서.
- (a) 필터 격리부가 내장된 임베디드 PCB 기판을 제조하는 단계;(b) 상기 임베디드 PCB 기판 상면의 일정 부분상에 외부단자와의 접속을 위한 복수개의 패드(pad)를 형성하는 단계;(c) 하부전극, 압전층 및 상부전극이 차례로 적층된 압전 박막 음향 공진기 를 적어도 하나 포함하는 제1필터단 및 제2필터단을 개별적으로 제작하는 단계;(d) 상기 임베디드 PCB기판에 형성된 상기 복수개의 패드에 상기 제1필터단 및 제2필터단을 각각 접합하는 단계;및(e) 상기 제1필터단 및 제2필터단과 소정거리 이격된 상태로 상기 임베디드 PCB 기판 전면을 패키징하는 단계;를 포함하는 것을 특징으로 하는 듀플렉서의 제조 방법.
- 제7항에 있어서,상기 필터 격리부는, PCB 기판의 양면에 제1메탈층, 유전층 및 제2메탈층이 순차적으로 적층되어 형성되는 커패시터 및 코일을 포함하는 것을 특징으로 하는 듀플렉서의 제조 방법.
- 제8항에 있어서,상기 (a) 단계는,PCB 기판 양면에 제1메탈층을 적층하는 단계;상기 제1메탈층에 포토레지스트 막을 적층한 후, 에칭하여 코일의 하부패턴을 제조하는 단계;상기 코일의 하부패턴 상에 제1프리프레그(prepreg) 및 유전체를 차례로 적층하고, 상기 유전체를 일정 형상으로 패터닝하는 단계;패터닝된 상기 유전체 상에 제2프리프레그 및 제2메탈층을 차례로 적층하는 단계;상기 제2메탈층을 하프에칭(half etching)한 후, 패터닝하여 코일의 상부 패턴을 제조하는 단계;상기 제2메탈층이 패터닝으로 제거된 부분을 드릴링(drilling)하여 상기 코일의 하부패턴을 노출시키는 단계;상기 드릴링된 부분을 메탈 도금하여 상기 코일의 하부패턴 및 상부패턴을 연결시키는 단계;상기 메탈 도금된 부분을 부분 에칭하여 코일을 제작하는 단계;및상기 코일 상에 제3프리프레그 및 제3메탈층을 차례로 적층하는 단계;를 포함하는 것을 특징으로 하는 듀플렉서의 제조 방법.
- 제7항에 있어서,상기 필터 격리부는, 순차적으로 적층된 수개의 PCB 기판 사이에 제작된, 상기 제1필터단 및 제2필터단 중 어느 하나가 통과시키는 신호 파장의 1/4 에 해당하는 길이를 가지는 트랜스미션 라인;을 포함하는 것을 특징으로 하는 듀플렉서의 제조 방법.
- 제7항에 있어서,상기 (b)단계는,상기 임베디드 PCB 기판의 일정 부분을 관통하는 두 개의 쓰루홀(through hole)을 제작하는 단계;상기 임베디드 PCB 기판의 상하부 표면 및 상기 쓰루홀의 양측 벽을 제4메탈층으로 도금하는 단계;양측 벽이 도금된 상기 쓰루홀의 내부 및 상기 임베디드 PCB 기판의 상하부 표면에 솔더 레지스트를 증착하고 패터닝하는 단계;및상기 임베디드 PCB 기판의 상하부 표면상에서 상기 솔더 레지스트가 증착되지 않은 부분을 제5메탈층으로 도금하는 단계;를 포함하는 것을 특징으로 하는 듀플렉서의 제조 방법.
- 제7항에 있어서,상기 (d)단계는,상기 복수개의 패드 상부에 각각 도전성 범프를 제작하는 단계;및상기 임베디드 PCB 기판 상면과 소정간격의 에어갭을 가지도록 상기 제1필터단 및 제2필터단을 각각 상기 도전성 범프와 접합하는 단계;를 포함하는 것을 특징으로 하는 듀플렉서의 제조 방법.
- 제7항에 있어서,상기 (e)단계는,별도 PCB 기판의 소정 부분을 식각하여 패키징 기판을 제조하는 단계;상기 PCB 기판 상에서 식각된 부분을 제외한 부분에 본딩 물질을 입히는 단 계;및상기 식각된 부분 내에 상기 제1필터단 및 제2필터단이 소정거리 이격되어 위치하도록, 상기 패키징 기판을 상기 임베디드 PCB 기판에 접합하는 단계;를 포함하는 것을 특징으로 하는 듀플렉서의 제조 방법.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030058072A KR100546832B1 (ko) | 2003-08-21 | 2003-08-21 | 임베디드 pcb 기판을 사용한 듀플렉서 및 그 제조 방법 |
EP04253883A EP1508936B1 (en) | 2003-08-21 | 2004-06-29 | Duplexer fabrication method using embedded PCB and duplexer fabricated by the same |
DE602004020716T DE602004020716D1 (de) | 2003-08-21 | 2004-06-29 | Herstellungsverfahren für Duplexer mit eingebetteter Leiterplatte und hiermit hergestellter Duplexer |
US10/923,086 US7893792B2 (en) | 2003-08-21 | 2004-08-23 | Duplexer using an embedded PCB and method of fabricating the same |
JP2004242915A JP2005073265A (ja) | 2003-08-21 | 2004-08-23 | 埋め込みpcb基板を用いたデュプレクサおよびその製造方法 |
US13/006,052 US8418331B2 (en) | 2003-08-21 | 2011-01-13 | Method of fabricating a duplexer using an embedded PCB |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030058072A KR100546832B1 (ko) | 2003-08-21 | 2003-08-21 | 임베디드 pcb 기판을 사용한 듀플렉서 및 그 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050020289A KR20050020289A (ko) | 2005-03-04 |
KR100546832B1 true KR100546832B1 (ko) | 2006-01-26 |
Family
ID=34056941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030058072A KR100546832B1 (ko) | 2003-08-21 | 2003-08-21 | 임베디드 pcb 기판을 사용한 듀플렉서 및 그 제조 방법 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7893792B2 (ko) |
EP (1) | EP1508936B1 (ko) |
JP (1) | JP2005073265A (ko) |
KR (1) | KR100546832B1 (ko) |
DE (1) | DE602004020716D1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100666693B1 (ko) | 2004-11-23 | 2007-01-11 | 삼성전자주식회사 | 모놀리식 듀플렉서 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7627552B2 (en) | 2003-03-27 | 2009-12-01 | Microsoft Corporation | System and method for filtering and organizing items based on common elements |
US7552175B2 (en) * | 2004-04-30 | 2009-06-23 | Microsoft Corporation | Mechanism for controlling communication paths between conference members |
US7248131B2 (en) | 2005-03-14 | 2007-07-24 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Monolithic vertical integration of an acoustic resonator and electronic circuitry |
US7665028B2 (en) | 2005-07-13 | 2010-02-16 | Microsoft Corporation | Rich drag drop user interface |
KR100631212B1 (ko) | 2005-08-01 | 2006-10-04 | 삼성전자주식회사 | 모놀리식 듀플렉서 및 그 제조방법 |
CN101019300B (zh) * | 2005-08-11 | 2011-07-27 | 株式会社村田制作所 | 绝缘型开关电源装置 |
US7483274B2 (en) * | 2005-09-29 | 2009-01-27 | Welch Allyn, Inc. | Galvanic isolation of a signal using capacitive coupling embedded within a circuit board |
KR100916501B1 (ko) * | 2007-09-06 | 2009-09-08 | 엘지이노텍 주식회사 | 신호 처리 장치 |
EP2309829A1 (en) * | 2009-09-24 | 2011-04-13 | Harman Becker Automotive Systems GmbH | Multilayer circuit board |
FR2961345A1 (fr) * | 2010-06-10 | 2011-12-16 | St Microelectronics Tours Sas | Circuit integre passif |
WO2012155340A1 (en) | 2011-05-17 | 2012-11-22 | Huawei Technologies Co., Ltd. | Microwave module |
KR101365368B1 (ko) * | 2012-12-26 | 2014-02-24 | 삼성전기주식회사 | 공통모드필터 및 이의 제조방법 |
CN104347526B (zh) | 2013-07-29 | 2018-06-19 | 讯芯电子科技(中山)有限公司 | 双工器封装结构及制造方法 |
US10291283B2 (en) | 2016-04-01 | 2019-05-14 | Intel Corporation | Tunable radio frequency systems using piezoelectric package-integrated switching devices |
US11463069B2 (en) | 2019-03-25 | 2022-10-04 | Skyworks Solutions, Inc. | Acoustic wave filters with isolation |
US20230046599A1 (en) | 2020-01-24 | 2023-02-16 | Qdevil Aps | A multi channel filter for low electron temperatures |
EP4094324A1 (en) | 2020-01-24 | 2022-11-30 | Qdevil ApS | A rolled or folded filter |
CN111261359A (zh) * | 2020-03-24 | 2020-06-09 | 福州瑞芯微电子股份有限公司 | 一种信号隔离器 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3156348B2 (ja) * | 1992-03-19 | 2001-04-16 | 富士通株式会社 | 弾性表面波フィルタとその製造方法 |
JPH08181443A (ja) * | 1994-12-21 | 1996-07-12 | Murata Mfg Co Ltd | セラミック多層基板およびその製造方法 |
KR0157284B1 (ko) | 1995-05-31 | 1999-02-18 | 김광호 | 솔더 볼 장착홈을 갖는 인쇄 회로 기판과 이를 사용한 볼 그리드 어레이 패키지 |
US5703544A (en) * | 1996-03-13 | 1997-12-30 | Ericsson Inc. | RF printed circuit module and method of making same |
JP3575783B2 (ja) | 1997-05-21 | 2004-10-13 | 日本アビオニクス株式会社 | プリント配線板およびその製造方法 |
US5910756A (en) * | 1997-05-21 | 1999-06-08 | Nokia Mobile Phones Limited | Filters and duplexers utilizing thin film stacked crystal filter structures and thin film bulk acoustic wave resonators |
JP3982876B2 (ja) * | 1997-06-30 | 2007-09-26 | 沖電気工業株式会社 | 弾性表面波装置 |
US6239536B1 (en) * | 1998-09-08 | 2001-05-29 | Tfr Technologies, Inc. | Encapsulated thin-film resonator and fabrication method |
US6262637B1 (en) | 1999-06-02 | 2001-07-17 | Agilent Technologies, Inc. | Duplexer incorporating thin-film bulk acoustic resonators (FBARs) |
US6356455B1 (en) * | 1999-09-23 | 2002-03-12 | Morton International, Inc. | Thin integral resistor/capacitor/inductor package, method of manufacture |
JP4529262B2 (ja) | 2000-09-14 | 2010-08-25 | ソニー株式会社 | 高周波モジュール装置及びその製造方法 |
JP2002092427A (ja) | 2000-09-18 | 2002-03-29 | Nippon Paint Co Ltd | 商品受注・納入システム |
JP2002185149A (ja) | 2000-12-15 | 2002-06-28 | Nippon Avionics Co Ltd | プリント配線板の製造方法 |
US6424238B1 (en) * | 2001-01-08 | 2002-07-23 | Motorola, Inc. | Acoustic wave filter and method of forming the same |
KR100518616B1 (ko) * | 2001-01-18 | 2005-10-04 | 노키아 코포레이션 | 필터디바이스 및 필터디바이스를 제조하는 방법 |
US6472954B1 (en) * | 2001-04-23 | 2002-10-29 | Agilent Technologies, Inc. | Controlled effective coupling coefficients for film bulk acoustic resonators |
JP3941416B2 (ja) * | 2001-04-26 | 2007-07-04 | ソニー株式会社 | 高周波モジュール装置及びその製造方法 |
JP3937302B2 (ja) | 2001-12-10 | 2007-06-27 | 宇部興産株式会社 | 薄膜圧電共振器を用いたフィルタ及び送受切換器 |
US6885260B2 (en) * | 2001-05-11 | 2005-04-26 | Ube Industries, Ltd. | Filter using film bulk acoustic resonator and transmission/reception switch |
JP3940887B2 (ja) * | 2001-05-11 | 2007-07-04 | 宇部興産株式会社 | 薄膜圧電共振器を用いた送受切換器 |
JP4079699B2 (ja) | 2001-09-28 | 2008-04-23 | 富士通株式会社 | 多層配線回路基板 |
US6778038B2 (en) * | 2001-10-05 | 2004-08-17 | Tdk Corporation | Piezoelectric resonant filter, duplexer, and method of manufacturing same |
JP4000960B2 (ja) | 2001-10-19 | 2007-10-31 | 株式会社村田製作所 | 分波器、通信装置 |
DE20221966U1 (de) * | 2002-06-06 | 2010-02-25 | Epcos Ag | Mit akustischen Wellen arbeitendes Bauelement mit einem Anpaßnetzwerk |
-
2003
- 2003-08-21 KR KR1020030058072A patent/KR100546832B1/ko active IP Right Grant
-
2004
- 2004-06-29 DE DE602004020716T patent/DE602004020716D1/de not_active Expired - Fee Related
- 2004-06-29 EP EP04253883A patent/EP1508936B1/en not_active Expired - Fee Related
- 2004-08-23 US US10/923,086 patent/US7893792B2/en not_active Expired - Fee Related
- 2004-08-23 JP JP2004242915A patent/JP2005073265A/ja active Pending
-
2011
- 2011-01-13 US US13/006,052 patent/US8418331B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100666693B1 (ko) | 2004-11-23 | 2007-01-11 | 삼성전자주식회사 | 모놀리식 듀플렉서 |
Also Published As
Publication number | Publication date |
---|---|
US8418331B2 (en) | 2013-04-16 |
US20110107570A1 (en) | 2011-05-12 |
US7893792B2 (en) | 2011-02-22 |
KR20050020289A (ko) | 2005-03-04 |
EP1508936A1 (en) | 2005-02-23 |
EP1508936B1 (en) | 2009-04-22 |
DE602004020716D1 (de) | 2009-06-04 |
JP2005073265A (ja) | 2005-03-17 |
US20050105478A1 (en) | 2005-05-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8418331B2 (en) | Method of fabricating a duplexer using an embedded PCB | |
US10305444B2 (en) | Electronic component module | |
JP6729790B2 (ja) | 高周波モジュール | |
US9035721B2 (en) | Duplexer, communication module component, and communication device | |
KR101079347B1 (ko) | 다층의 유기 적층물을 이용하여 제조되는 집적 수동디바이스 | |
JP5135320B2 (ja) | 液晶性ポリマー及び多層ポリマーベースの無線周波/無線マルチバンド用途の受動信号処理コンポーネント | |
KR100949224B1 (ko) | 필터 회로 장치 및 그 제조 방법 | |
JP2018074566A (ja) | 埋め込みrfフィルタパッケージ構造およびその製造方法 | |
WO2016024559A1 (ja) | 高周波モジュール | |
JP4926179B2 (ja) | 分波器デバイス用回路基板、分波器、及び通信装置 | |
JP2009290606A (ja) | 分波器および無線通信機器 | |
KR20070008456A (ko) | 필터 장치와 이것을 이용한 멀티 밴드 필터, 분파기 및통신 장치 | |
WO2018123699A1 (ja) | 高周波モジュール | |
EP1306902A1 (en) | High-frequency module and its manufacturing method | |
KR100955948B1 (ko) | 다중대역 송신단 모듈 및 이의 제조 방법 | |
US20050195047A1 (en) | RF duplexer | |
US20140197915A1 (en) | Electronic component | |
WO2021192429A1 (ja) | 高周波モジュール及び通信装置 | |
KR100498041B1 (ko) | 기판 접합을 이용하여 제조된 단일칩 듀플렉서 및 그 제조방법 | |
Koch et al. | Ultra low-profile self-matched HTCC SAW-duplexer: manufacturing and performance challenges | |
KR100560417B1 (ko) | 단일칩 듀플레서 및 그 제조방법 | |
CN117791064A (zh) | 一种通用多频段滤波嵌入式集成接口及其制造方法 | |
CN117353691A (zh) | 一种体声波滤波器的制造方法、体声波滤波器及通信设备 | |
JP2020096106A (ja) | 回路基板 | |
KR20080051797A (ko) | 필터 소자 및 필터 소자의 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20121210 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20131217 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20141224 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20151217 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20161220 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20181218 Year of fee payment: 14 |
|
FPAY | Annual fee payment |
Payment date: 20191216 Year of fee payment: 15 |