KR890013829A - 접착성 열융착형 인터커넥터 및 그 제조방법 - Google Patents

접착성 열융착형 인터커넥터 및 그 제조방법 Download PDF

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KR890013829A
KR890013829A KR1019890001743A KR890001743A KR890013829A KR 890013829 A KR890013829 A KR 890013829A KR 1019890001743 A KR1019890001743 A KR 1019890001743A KR 890001743 A KR890001743 A KR 890001743A KR 890013829 A KR890013829 A KR 890013829A
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adhesive heat
sealed
adhesive
electrically insulating
resin composition
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KR950010179B1 (ko
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아끼오 나까무라
오사미 하야시
히데끼 다베이
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이이지마 아쯔시
신에쓰 폴리머 가부시끼가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4922—Contact or terminal manufacturing by assembling plural parts with molding of insulation

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

내용 없음.

Description

접착성 열융착형 인터커넥터 및 그 제조방법.
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 접착성 이방 전기전도성 수지를 사용하여 기판상의 전극과 플레이트 케이블을 접속하는 종래 방법에 있어서의 단면도.
제2도 및 제3도는 각기 전도성 영역이 스트립상 및 점상 분포로 되어 있는 인터커넥터의 사시도.

Claims (12)

  1. 절연영역으로서 기여하는 접착성 열융착형 전기절연성 수지 스트립들과 전도성 영역으로서 기여하는 접착성 열융착형 전기전도성 수지조성물 스트립들이 교번적으로 배열되어 있는 스트립시이트의 형태인 접착성 열융착형 인터커넥터.
  2. 절연영역으로서 기여하는 접착성 열융착형 전기절연성 수지 스트립들과 전도성 영역으로서 기여하는 접착성 열융착형 전기전도성 수지 조성물 스트립들이 교번적으로 배열되어 있는 스트립 시이트의 형태인 접착성 열융착형 인터커넥터의 제조방법으로서, (a) 접착성 열융착형 전기전도성 수지조성물로 일면이 피복된 접착성 열융착형 전기절연성 수지의 막들을 막의 피복면이 인접한 막의 피복되지 않은 면과 접촉되는 방식으로 적층시키고 ; (b) 적층막을 일체화하여 일체로 성층된 블록을 형성시키고 ; 및 (c) 일체로 성층된 블록을 적층막의 표면에 실질적으로 수직인 면에서 슬라이스 가공하는 단계들을 구성하는 접착성 열융착형 인터커넥터의 제조방법.
  3. 절연영역으로서 기여하는 접착성 열융착형 전기절연성 수지 스트립들과 전도성 영역으로서 기여하는 접착성 열융착형 전기전도성 수지 조성물 스트립들이 교번적으로 배열되어 있는 스트립 시이트의 형태인 접착성 열융착형 인터커넥터의 제조방법으로서, (a) 접착성 열융착형 전기절연성 수지로 일면이 피복된 접착성 열융착형 전기전도성 수지조성물의 막들을 막의 피복면이 인접한 막의 피복되지 않은 면과 접촉되는 방식으로 적층시키고 ; (b) 적층막을 일체화하여 일체로 성층된 블록을 형성시키고 ; 및 (c) 일체로 성층된 블록을 적층막의 표면에 실질적으로 수직인 면에서 슬라이스 가공하는 단계들을 구성하는 접착성 열융착형 인터커넥터의 제조방법.
  4. 절연영역으로서 기여하는 접착성 열융착형 전기절연성 수지 스트립들과 전도성 영역으로서 기여하는 접착성 열융착형 전기전도성 수지 조성물 스트립들이 교번적으로 배열되어 있는 스트립 시이트의 형태인 접착성 열융착형 인터커넥터의 제조방법으로서, (a) 접착성 열융착형 전기절연성 수지의 막들과 접착성 열융착형 전기전도성 수지 조성물의 막들을 서로 교번적으로 적층시키고 ; (b) 적층막을 일체화하여 일체로 성층된 블록을 형성시키고 ; 및 (c) 일체로 성층된 블록을 적층막의 표면에 실질적으로 수직인 면에서 슬라이스 가공하는 단계들을 구성하는 접착성 열융착형 인터커넥터의 제조방법.
  5. 절연영역으로서 기여하는 접착성 열융착형 전기절연성 수지로 된 소지 및 전도성 영역으로서 기여하는 상기 접착성 열융착형 전기절연성 수지로 된 소지내에 불연속적으로 분포된 접착성 열융착형 전기전도성 수지 조성물로 된 점상영역으로 구성된 형태인 접착성 열융착형 인터커넥터.
  6. 절연영역으로서 기여하는 접착성 열융착형 전기절연성 수지로 된 소지 및 전도성 영역으로서 기여하는 상기 접착성 열융착형 전기절연성 수지로된 소지내에 불연속적으로 분포된 접착성 열융착형 전기전도성 수지 조성물로된 점상영역으로 구성된 형태인 접착성 열융착형 인터커넥터의 제조방법으로서, (a) 접착성 열융착형 전기절연성 수지 스트립들과 접착성 열융착형 전기전도성 수지 조성물 스트립들이 교번적으로 배열되어 있는 스트립시이트와 접착성 열융착형 전기절연성 시이트들을 스트립시이트의 모든 전도성 시이트들이 동일한 방향으로 진행하는 방식으로 교번적으로 적층시키고 ; (b) 적층막을 일체화하여 일체로 성층된 블록을 형성시키고 ; 및 (c) 일체로 성층된 블록을 스트립 시이트의 전도성 스트립의 진행방향에 실질적으로 수직인 면에서 슬라이스 가공하는 단계들을 구성하는 접착성 열융착형 인터커넥터의 제조방법.
  7. 절연영역으로서 기여하는 접착성 열융착형 전기절연성 수지로 된 소지 및 전도성 영역으로서 기여하는 상기 접착성 열융착형 전기절연성 수지로 된 소지내에 불연속적으로 분포된 접착성 열융착형 전기전도성 수지조성물로된 점상영역으로 구성된 형태인 접착성 열융착형 인터커넥터의 제조방법으로서, (a) 접착성 열융착형 전기절연성 수지스트립들과 접착성 열융착형 전기전도성 수지조성물 스트립들이 교번적으로 배열되어 있고 일면이 접착성 열융착형 전기절연성 수지로 피복된 스트립 시이트들을 시이트의 피복면이 인접한 시이트의 피복되지 않은 면에 접촉되고 스트립 시이트들의 모든 전도성 시이트들이 동일한 방향으로 진행되는 방식으로 적층시키고 ; (b) 적층막을 일체화하여 일체로 성층된 블록을 형성시키고 ; 및 (c) 일체로 성층된 블록을 스트립 시이트의 전도성 스트립의 진행방향 실질적으로 수직인 면에서 슬라이스 가공하는 단계들을 구성하는 절착성 열융착형 인터커넥터의 제조방법.
  8. 제1항에 있어서, 두께가 10 내지 100㎛의 범위인 접착성 열융착형 인터커넥터.
  9. 제2항에 있어서, 접착성 열융착형 전기절연성 막의 두께가 100㎛이하인 접착성 열융착형 인터커넥터의 제조방법.
  10. 제2항에 있어서, 접착성 열융착형 수지의 연화온도가 80 내지 180℃의 범위인 접착성 열융착형 인터커넥터의 제조방법.
  11. 제2항에 있어서, 접착성 열융착형 전기전도성 수지 조성물의 두께가 10 내지 50㎛의 범위인 절착성 열융착형 인터커넥터의 제조방법.
  12. 제5항에 있어서, 두께가 10 내지 100㎛의 범위인 접착성 열융착형 인터커넥터.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890001743A 1988-02-15 1989-02-15 접착성 열융착형 인터커넥터 및 그 제조방법 KR950010179B1 (ko)

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GB8902707D0 (en) 1989-03-30
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JPH01206575A (ja) 1989-08-18
GB2215661A (en) 1989-09-27
US5041183A (en) 1991-08-20

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