KR890008186A - 열경화성 수지 조성물 및 이것을 사용한 프리프레그 및 적충판 - Google Patents

열경화성 수지 조성물 및 이것을 사용한 프리프레그 및 적충판 Download PDF

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KR890008186A
KR890008186A KR1019880014147A KR880014147A KR890008186A KR 890008186 A KR890008186 A KR 890008186A KR 1019880014147 A KR1019880014147 A KR 1019880014147A KR 880014147 A KR880014147 A KR 880014147A KR 890008186 A KR890008186 A KR 890008186A
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thermosetting resin
weight
resin composition
epoxy
hydroxystyrene
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KR960007765B1 (ko
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가쯔오 스기와라
아끼오 다까하시
쥰이찌 기따기리
아끼라 나가이
마사히로 오노
도시가즈 나라하라
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미다 가쓰시게
가부시기가이샤 히다찌 세이사구쇼
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Abstract

내용 없음

Description

열경화성 수지 조성물 및 이것을 사용한 프리프레그 및 적충판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일실시태양을 나타내는 다층 프린트 회로판의 단면도이다.

Claims (13)

  1. (a) 다음 일반식(Ⅰ)의 폴리(P-히드록시스티렌)유도체의 프레폴리머
    〔식중, A는 할로겐 그룹이고, R1은 탄소수 2 내지 4의 알케닐 또는 알케노일 그룹이고, m은 1 내지 4이고, n은 1 내지 100이다), (b) 에폭시-변성 포리부타디엔, 및 (c) 방향족 말레이미드 화합물로 이루어진 열경화성 수지 조성물.
  2. 제1항에 있어서, 조성물이 (a) 폴리(p-히드록시스티렌)유도체의 프레폴리머 10 내지 60중량%, (b) 에폭시-변성 폴리부타디엔 10 내지 60중량% 및 (c) 방향족 말레이미드 화합물 20 내지 70중량%로 이루어진 열경화성 수지 조성물.
  3. 제1항에 있어서, 조성물이 (a) 폴리(p-히드록시스티렌)유도체의 프레폴리머 20 내지 40중량%, (b) 에폭시-변성 폴리부타엔 10 내지 30중량% 및 (c) 방향족 말레이미드 화합물 30 내지 60중량%로 이루어진 열경화성 수지 조성물.
  4. (a) 일반식(Ⅰ)의 폴리(p-히드록시스티렌)유도체의 폴리머
    (식중, A는 할로겐 그룹이고, R1은 탄소수 2 내지 4의 알케닐 또는 알케노일 그룹이고, m은 1 내지 4이고, n은 1 내지 100이다), (b) 일반식(Ⅲ)의 에폭시-변성 폴리부타디엔
    (식중, B는 글리시딜 에테르형 에폭시코폴리머이고, n은 4 내지 100이다), 및 (c) 일반식(Ⅲ)의 방향족 말레이미드 화합물
    (식중, R2는 적어도 하나의 벤젠링을 함유하는 방향족 그룹이고, n은 1 내지 4이다)로 이루어진 열경화성 수지 조성물.
  5. 제4항에 있어서, 조성물이 (a) 폴리(p-히드록시스티렌)유도체의 프레폴리머 10 내지 60중량%, (b) 에폭시-변성 폴리부타디엔 10 내지 60중량% 및 (c) 방향족 말레이미드 화합물 20 내지 70중량%로 이루어진 열경화성 수지 조성물.
  6. 제4항에 있어서, 조성물이 (a) 폴리(p-히드록시스티렌)유도체의 프레폴리머 20 내지 40중량%, (b) 에폭시-변성 폴리부타디엔 10 내지 30중량% 및 (c) 방향족 말레이미드 화합물 30 내지 60중량%로 이루어진 열경화성 수지 조성물.
  7. 섬유상 기재와, (a) 다음 일반식(Ⅰ)의 폴리(p-히드록시스티렌)유도체의 프레폴리머
    (식중, A는 할로겐 그룹이고, R1은 탄소수 2 내지 4의 알케닐 또는 알케노일 그룹이고, m은 1 내지 4이고, n은 1 내지 100이다), (b) 에폭시-변성 폴리부타디엔 및 (c) 방향족 말레이드 화합물로 된 열경화성 수지 조성물로 이루어진 프리프레그.
  8. 제7항에 있어서, 열경화성 수지 조성물이 (a) 폴리(p-히드록시스티렌)유도체의 프레폴리머 10 내지 60중량%, (b) 에폭시-변성 폴리부타디엔 10 내지 60중량% 및 (c) 방향족 말레이미드 화합물 20 내지 70중량%로 이루어진 프리프레그.
  9. 제7항에 있어서, 열경화성 수지 조성물이 (a) 폴리(p-히드록시스티렌)유도체의 프레폴리머 20 내지 40중량%, (b) 에폭시-변성 폴리부타디엔 10 내지 30중량% 및 (c) 방향족 말레이미드 화합물 30 내지 60중량%로 이루어진 프리프레그.
  10. 섬유상 기재와, (a) 일반식(Ⅰ)의 폴리(p-히드록시스티렌)유도체의 프레폴리머
    (식중, A는 할로겐 그룹이고, R1은 탄소수 2 내지 4의 알케닐 또는 알케노일 그룹이고, m은 1 내지 4이고, n은 1 내지 100이다), (b) 일반식(Ⅱ)의 에폭시-변형 폴리부타디엔
    (식중 B는 글리시딜 에테르형 에폭시 코폴리머이고, n은 4 내지 100이다), 및 (c) 일반식(Ⅲ)의 방향족 말레이미드 화합물.
    (식중, R2는 적어도 하나의 벤젠 링을 함유하는 방향족 그룹이고, n은 1 내지 4이다)로 된 열경화성 수지 조성물로 이루어진 프리프레그.
  11. 제10항에 있어서, 열경화성 수지 조성물이 (a) 폴리(p-히드록시스티렌)유도체의 프레폴리머 10 내지 60중량%, (b) 에폭시-변성 폴리부타디엔 10 내지 60중량% 및 (c) 방향족 말레이미드 화합물 20 내지 70중량%로 이루어진 프리프레그.
  12. 제10항에 있어서, 열경화성 수지 조성물이 (a) 폴리(p-히드록시스티렌)유도체의 프레폴리머 20 내지 40중량%, (b) 에폭시-변성 폴리부타디엔 10 내지 30중량% 및 (c) 방향족 말레이미드 화합물 30 내지 60중량%로 이루어진 프리프레그.
  13. 섬유상 기재와 (a) 일반식(Ⅰ)의 폴리(p-히드록시스티렌) 유도체의 프레폴리머.
    (식중, A는 할로겐 그룹이고, R1은 탄소수 2 내지 4의 알케닐 또는 알케노일 그룹이고, m은 1 내지 4이고, n은 1 내지 100이다), (b) 에폭시-변성 폴리부타디엔 및 (c) 방향족 말레이미드 화합물로 된 열경화성 수지 조성물로 이루어진 프리프레그를 적층하여 형성시킨 적층판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880014147A 1987-11-04 1988-10-29 열경화성 수지 조성물 및 이것을 사용한 프리프레그 및 적층판 KR960007765B1 (ko)

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JP62277446A JPH072829B2 (ja) 1987-11-04 1987-11-04 積層板
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JP6885000B2 (ja) * 2016-07-19 2021-06-09 昭和電工マテリアルズ株式会社 半導体再配線層形成用樹脂フィルム、半導体再配線層形成用複合フィルム、それらを用いた半導体装置及び半導体装置の製造方法
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DE3853868T2 (de) 1995-09-21
US4931507A (en) 1990-06-05
JPH01121356A (ja) 1989-05-15
CN1009006B (zh) 1990-08-01
JPH072829B2 (ja) 1995-01-18
EP0315211A1 (en) 1989-05-10
KR960007765B1 (ko) 1996-06-12
US5080965A (en) 1992-01-14
CN1033065A (zh) 1989-05-24
EP0315211B1 (en) 1995-05-24

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