CN1009006B - 热固性树脂组合物及由其制得的预浸料和层压板材 - Google Patents
热固性树脂组合物及由其制得的预浸料和层压板材Info
- Publication number
- CN1009006B CN1009006B CN88107546A CN88107546A CN1009006B CN 1009006 B CN1009006 B CN 1009006B CN 88107546 A CN88107546 A CN 88107546A CN 88107546 A CN88107546 A CN 88107546A CN 1009006 B CN1009006 B CN 1009006B
- Authority
- CN
- China
- Prior art keywords
- weight
- formula
- thermosetting resin
- compositions
- representative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 title claims abstract description 50
- 229920005989 resin Polymers 0.000 title claims abstract description 50
- 239000000463 material Substances 0.000 title claims abstract description 47
- 239000000203 mixture Substances 0.000 title claims abstract description 37
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 23
- -1 maleimide compound Chemical class 0.000 claims abstract description 29
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 9
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 9
- 150000002367 halogens Chemical class 0.000 claims abstract description 9
- 239000004593 Epoxy Substances 0.000 claims description 19
- 150000002118 epoxides Chemical class 0.000 claims description 17
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 10
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 9
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 229940125810 compound 20 Drugs 0.000 claims 2
- JAXFJECJQZDFJS-XHEPKHHKSA-N gtpl8555 Chemical compound OC(=O)C[C@H](N)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1CCC[C@@H]1C(=O)N[C@H](B1O[C@@]2(C)[C@H]3C[C@H](C3(C)C)C[C@H]2O1)CCC1=CC=C(F)C=C1 JAXFJECJQZDFJS-XHEPKHHKSA-N 0.000 claims 2
- YXOGSLZKOVPUMH-UHFFFAOYSA-N ethene;phenol Chemical class C=C.OC1=CC=CC=C1 YXOGSLZKOVPUMH-UHFFFAOYSA-N 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical class OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 abstract 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052801 chlorine Inorganic materials 0.000 abstract 1
- 239000000460 chlorine Substances 0.000 abstract 1
- 230000004048 modification Effects 0.000 abstract 1
- 238000012986 modification Methods 0.000 abstract 1
- 239000002966 varnish Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 230000031709 bromination Effects 0.000 description 11
- 238000005893 bromination reaction Methods 0.000 description 11
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 10
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- 239000005062 Polybutadiene Substances 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 229920002857 polybutadiene Polymers 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 238000001723 curing Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000004848 polyfunctional curative Substances 0.000 description 7
- 239000007870 radical polymerization initiator Substances 0.000 description 7
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 6
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 6
- 238000010030 laminating Methods 0.000 description 6
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 description 5
- 239000001294 propane Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 3
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229940106691 bisphenol a Drugs 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000009998 heat setting Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 2
- OKIRBHVFJGXOIS-UHFFFAOYSA-N 1,2-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=CC=C1C(C)C OKIRBHVFJGXOIS-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- RIGJHQFSJDRFFJ-UHFFFAOYSA-N 3-(2-methylphenyl)pyrrole-2,5-dione Chemical compound CC1=CC=CC=C1C1=CC(=O)NC1=O RIGJHQFSJDRFFJ-UHFFFAOYSA-N 0.000 description 2
- DGIZWWSIVMBMKG-UHFFFAOYSA-N 3-[(4-methoxyphenyl)methyl]pyrrole-2,5-dione Chemical compound C1=CC(OC)=CC=C1CC1=CC(=O)NC1=O DGIZWWSIVMBMKG-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- YVNRUPSDZZZUQJ-UHFFFAOYSA-N [O].NC1=CC=CC=C1 Chemical compound [O].NC1=CC=CC=C1 YVNRUPSDZZZUQJ-UHFFFAOYSA-N 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N anhydrous trimellitic acid Natural products OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 229960003280 cupric chloride Drugs 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 239000002648 laminated material Substances 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical class CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical group C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- 125000001781 1,3,4-oxadiazolyl group Chemical group 0.000 description 1
- QDEQBRUNBFJJPW-UHFFFAOYSA-N 1-(3-chlorophenyl)pyrrole-2,5-dione Chemical compound ClC1=CC=CC(N2C(C=CC2=O)=O)=C1 QDEQBRUNBFJJPW-UHFFFAOYSA-N 0.000 description 1
- MUSBHZSCJOVTRF-UHFFFAOYSA-N 1-acetyl-3-phenylpyrrole-2,5-dione Chemical compound O=C1N(C(=O)C)C(=O)C=C1C1=CC=CC=C1 MUSBHZSCJOVTRF-UHFFFAOYSA-N 0.000 description 1
- MKRBAPNEJMFMHU-UHFFFAOYSA-N 1-benzylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CC1=CC=CC=C1 MKRBAPNEJMFMHU-UHFFFAOYSA-N 0.000 description 1
- AXFVIWBTKYFOCY-UHFFFAOYSA-N 1-n,1-n,3-n,3-n-tetramethylbutane-1,3-diamine Chemical compound CN(C)C(C)CCN(C)C AXFVIWBTKYFOCY-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- VEUMBMHMMCOFAG-UHFFFAOYSA-N 2,3-dihydrooxadiazole Chemical compound N1NC=CO1 VEUMBMHMMCOFAG-UHFFFAOYSA-N 0.000 description 1
- PSYGHMBJXWRQFD-UHFFFAOYSA-N 2-(2-sulfanylacetyl)oxyethyl 2-sulfanylacetate Chemical compound SCC(=O)OCCOC(=O)CS PSYGHMBJXWRQFD-UHFFFAOYSA-N 0.000 description 1
- OWMNWOXJAXJCJI-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxymethyl)oxirane;phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1.C1OC1COCC1CO1 OWMNWOXJAXJCJI-UHFFFAOYSA-N 0.000 description 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 1
- LIZVXGBYTGTTTI-UHFFFAOYSA-N 2-[(4-methylphenyl)sulfonylamino]-2-phenylacetic acid Chemical compound C1=CC(C)=CC=C1S(=O)(=O)NC(C(O)=O)C1=CC=CC=C1 LIZVXGBYTGTTTI-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical class CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- MYGMGGHRPDDQCN-UHFFFAOYSA-N 2-methyl-1-(2-methylprop-1-enoxy)prop-1-ene Chemical compound CC(C)=COC=C(C)C MYGMGGHRPDDQCN-UHFFFAOYSA-N 0.000 description 1
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical compound CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 1
- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- WAMBUHSSUGGLJO-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;2-(oxiran-2-ylmethoxymethyl)oxirane Chemical compound C1OC1COCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 WAMBUHSSUGGLJO-UHFFFAOYSA-N 0.000 description 1
- ZQMZIOUGOZDCNR-UHFFFAOYSA-N 4-n-[(4-aminophenyl)methyl]benzene-1,4-diamine Chemical compound C1=CC(N)=CC=C1CNC1=CC=C(N)C=C1 ZQMZIOUGOZDCNR-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- JNWCSWVHBAYYOW-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-2,4-diene-1,6-diamine Chemical compound NC12C(C=CC=C1)(N)O2 JNWCSWVHBAYYOW-UHFFFAOYSA-N 0.000 description 1
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- UKJZWMPMJWCBHU-UHFFFAOYSA-N C(C1=CC=CC=C1)(=O)C1=CC=CC=C1.NNC(NN)=O Chemical compound C(C1=CC=CC=C1)(=O)C1=CC=CC=C1.NNC(NN)=O UKJZWMPMJWCBHU-UHFFFAOYSA-N 0.000 description 1
- RIVSZKOLDGSFAM-UHFFFAOYSA-N C1CCC(CC1)C2=CC(=C(C=C2)N)CN Chemical compound C1CCC(CC1)C2=CC(=C(C=C2)N)CN RIVSZKOLDGSFAM-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- KZTYYGOKRVBIMI-UHFFFAOYSA-N S-phenyl benzenesulfonothioate Natural products C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 1
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- BQODPTQLXVVEJG-UHFFFAOYSA-N [O].C=C Chemical compound [O].C=C BQODPTQLXVVEJG-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- XDNRNZSKIORSCI-UHFFFAOYSA-N aniline;1,3-thiazole Chemical compound C1=CSC=N1.NC1=CC=CC=C1 XDNRNZSKIORSCI-UHFFFAOYSA-N 0.000 description 1
- SOVQUSVSLWXVKO-UHFFFAOYSA-N aniline;cyclohexane Chemical compound C1CCCCC1.NC1=CC=CC=C1 SOVQUSVSLWXVKO-UHFFFAOYSA-N 0.000 description 1
- MPBGOKQNJACTET-UHFFFAOYSA-N aniline;methanamine Chemical compound NC.NC1=CC=CC=C1 MPBGOKQNJACTET-UHFFFAOYSA-N 0.000 description 1
- RANHLFAPKWTQOO-UHFFFAOYSA-N aniline;propane Chemical compound CCC.NC1=CC=CC=C1 RANHLFAPKWTQOO-UHFFFAOYSA-N 0.000 description 1
- ZYIFLKPDFLWFAE-UHFFFAOYSA-N aniline;toluene Chemical compound CC1=CC=CC=C1.NC1=CC=CC=C1 ZYIFLKPDFLWFAE-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 150000003851 azoles Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229960001760 dimethyl sulfoxide Drugs 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 150000003949 imides Chemical group 0.000 description 1
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical compound [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- WJXKWIFHRZWPET-UHFFFAOYSA-N tert-butyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OC(C)(C)C WJXKWIFHRZWPET-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229960002415 trichloroethylene Drugs 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 239000006200 vaporizer Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
- C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2363/00—Epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B2379/08—Polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2351/00—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2475—Coating or impregnation is electrical insulation-providing, -improving, or -increasing, or conductivity-reducing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2631—Coating or impregnation provides heat or fire protection
- Y10T442/2721—Nitrogen containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2861—Coated or impregnated synthetic organic fiber fabric
- Y10T442/2893—Coated or impregnated polyamide fiber fabric
- Y10T442/2902—Aromatic polyamide fiber fabric
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2926—Coated or impregnated inorganic fiber fabric
- Y10T442/2951—Coating or impregnation contains epoxy polymer or copolymer or polyether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
- Y10T442/3472—Woven fabric including an additional woven fabric layer
- Y10T442/3528—Three or more fabric layers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本发明提供一种热固性树脂组合物,该组合物包含(a)一种用通式(I)代表的聚(对一羟基苯乙烯)衍生物的预聚物。式(1)中,A为卤素,R1为含2~4个碳原子的链烯基或链烯酰基,m表示1~4的数,n表示1~100的数,(b)一种环氯改性的聚丁二烯,和(c)一种芳族马来酰亚胺化合物。并提供使用该树脂组合物的预浸料和层压板材。
Description
本发明涉及一种热固性树脂组合物和由其制得的预浸料和层压板材。特别是涉及一种适用于制造多层印刷电路板的层压材料、该层压材料的特点是具有极好的耐火性、耐热性和电性能。而且固化时的收缩率低。
迄今主要用于制造多层印刷电路板的层压材料都采用酚树脂、环氧树脂、聚酰亚胺等树脂,并在树脂中加入了溴化改性树脂或添加剂型阻燃剂以使其具有很好的耐火性。特别是对于一些大型计算机来说,由于它们所要求的密度越来越高,已采用耐热性和尺寸稳定性都很好的聚酰亚胺型树脂。但是,近年来,随着大型计算机运算速度的提高,开始需要采用介电常数低的印刷电路板以提高信号发送率。为了提供这种介电常数低的层压材料,人们已研制了含有聚四氟乙烯(PTFE)树脂或聚丁二烯树脂的层压板材。例如,Proc.NEPCON(1981),第160~169页及日本专利申请公开第126,451/80号就介绍了这种层压板材。
此外,日本专利申请公开第33,050/86号公开了一种介电常数很低的耐火树脂组合物,它含有一种聚(对-羟基苯乙烯)衍生物和一种环氧化聚丁二烯。
但PTFE层压板材的热膨胀系数大,由于PTFE树脂是热塑性的,玻璃化温度低,因而高温时尺寸稳定性不足。特别是在多层粘合中其通孔可靠性是不能令人满意的。此外,PTFE由于缺乏合适的溶剂,一般是用热熔压粘合法粘合的,这样它那非常高的熔化温度是不利的。另一方面,聚丁二烯树脂的分子结构使它具有易于燃烧的缺点,因此必须在其中加入添加剂型阻燃剂(如十溴二苯醚和磷酸三苯酯)或活性阻燃剂(如异丁烯酸三溴苯酯和丙烯酸三溴苯酯)以使其具有耐火性、但加入这些阻燃剂会使聚丁二烯树脂原有的优良的电性能、耐热性和尺寸稳定性变坏。
本发明的一个目的是提供具有很好的耐火性和很低的介电常数并能象聚酰亚胺层压材料那样高密度布线的层压材料,作为可取代迄今用于大型计算
机的聚酰亚胺型多层印刷线路板的材料。
本发明的第一项内容涉及一种耐火热固性树脂组合物。该组合物是下面的通式(Ⅰ)所代表的聚(对-羟基苯乙烯)衍生物的预聚物、通式(Ⅱ)所代表的环氧改性的聚丁二烯和通式(Ⅳ)所代表的芳族马来酰亚胺化合物的混合物:
式中A为卤素,R1为含2~4个碳原子的链烯基或链烯酰基,m表示1~4的数,n表示1~100的数;
(Ⅱ)
式中B为缩水甘油醚型环氧共聚物,n表示4~100的数;
(Ⅲ)
式中R2为至少含一个苯环的芳基,n表示1~4的数。
本发明的第二项内容涉及用上述树脂组合物制得的预浸料,该预浸料是用通式(Ⅰ)所代表的聚(对-羟基苯乙烯)衍生物的预聚物、通式(Ⅱ)所代表的环氧改性的聚丁二烯和通式(Ⅲ)所代表的芳族马来酰亚胺化合物溶于溶剂中所获得的清漆那样的溶液浸渍纤维状基层材料而得:
(Ⅰ)
式中A为卤素,R1为含2~4个碳原子的链烯基或链烯酰基(如烯丙基,丁烯基,乙烯基,丙烯酰基,异丁烯酰基和环氧异丁烯酰基),m表示1~4的数,n表示1~100的数;
(Ⅱ)
式中,B为缩水甘油醚型环氧共聚物,n表示4~100的数;
式中,R2为至少含一个苯环的芳基,n表示1~4的数。
本发明的第三项内容涉及用上述树脂组合物制得的层压板材,该层压板材是通过预浸料的层叠与粘合而得,而该预浸料则是用通式(Ⅰ)所代表的聚(对-羟基苯乙烯)衍生物的预聚物、通式(Ⅱ)所代表的环氧改性的聚丁二烯和通式(Ⅲ)所代表的芳族马来酰亚胺所组成的组合物浸渍纤维状基层材料而得。
式中,A为卤素,R1为含2~4个碳原子的链烯基或链烯酰基,(如烯丙基,丁烯基,乙烯基,丙烯酰基,异丁烯酰基和环氧异丁烯酰基),m表示1~4的数,n表示1~100的数;
式中,B为缩水甘油醚型环氧共聚物,n表示4~100的数;
式中,R2为至少含一个苯环的芳基,n表示1~4的数。
图1为代表本发明的一个具体方案的多层印刷线路板的剖面透视图。
本发明的热固性树脂组合物包含用上述通式(Ⅰ)、(Ⅱ)和(Ⅲ)所代表的三种组分。通式(Ⅰ)所代表的化合物的典型例子有聚(对-羟基苯乙烯)的乙烯基醚、异丁烯基醚或烯丙基醚的溴化产物或其丙烯酸酯、异丁烯酸酯或环氧异丁烯酸
酯的溴化产物。可根据需要,只使用其中的一种或将其中的两种或两种以上一起使用。
通式(Ⅱ)所代表的环氧改性的聚丁二烯是本发明所使用的热固性树脂之一,用于使聚丁二烯改性的缩水甘油醚型环氧树脂的具体例子有二环氧甘油醚双酚A,二环氧甘油醚2,2′-二溴双酚A、二环氧甘油醚2,2′,4,4′-四溴双酚A、二环氧甘油醚2,2′-二甲基双酚A、二环氧甘油醚2,2′,4-三甲基双酚A、苯酚线型环氧树脂和邻甲酚线型环氧树脂。可根据需要只使其中的一种或将其中的两种或两种以上一起使用。
通式(Ⅲ)所代表的芳族马来酰亚胺化合物是本发明使用的热固性树脂之一,其具体例子有双马来酰亚胺,如N,N′-间-亚苯基双马来酰亚胺,N,N′-对-亚苯基双马来酰亚胺,N,N′-4,4′-二苯甲烷双马来酰亚胺,N,N-4,4′-(二苯醚)双马来酰亚胺,N,N′-亚甲基二(3-氯-对-亚苯基)-双马来酰亚胺,N,N′-4,4′-(二苯砜)双马来酰亚胺,N,N′-间二甲苯双马来酰亚胺,N,N′-4,4′-二苯基环己烷双马来酰亚胺,N,N′-4,4′-二苯基丙烷双马来酰亚胺,2,2′-二〔4-(4-马来酰亚胺苯氧基)苯基〕丙烷,2,2-二〔4-甲基-4-(4-马来酰亚胺苯氧基)苯基六氟〕丙烷,2,2′-二(4-马来酰亚胺苯氧基)六氟丙烷,2,2′-二(4-马亚酰亚胺苯基)六氟丙烷1,3-二(3-马来酰亚胺苯氧基)苯和3,3′-双马来酰亚胺二苯酮;以及单马来酰亚胺,如N-苯基马来酰亚胺,N-3-氯苯基马来酰亚胺,N-邻-甲苯基马来酰亚胺,N-间-甲苯基马来酰亚胺,N-对-甲苯基马来酰亚胺,N-邻-甲氧苯基马来酰亚胺,N-间-甲氧苯基马来酰亚胺。N-对-甲氧苯基马来酰亚胺。N-苄基马来酰亚胺。N-吡啶基马来酰亚胺,N-羟苯基马来酰亚胺,N-乙酸基苯基马来酰亚胺。N-二氯苯基马来酰亚胺,N-二苯酮马来酰亚胺,N-(二苯醚)马来酰亚胺和N-乙酰苯基马来酰亚胺。可根据需要只使用其中的一种或者将其中的两种或两种以上一起使用。
用于本发明的芳族马来酰亚胺化合物在提高耐热性方面的效果胜于脂族马来酰亚胺化合物。
在含上述通式(Ⅰ)、(Ⅱ)和(Ⅲ)所代表的三种组分的混合物的热固性树脂组合物中加入游离基聚合引发剂和环氧固化剂能使该组合物的固化加速。
游离基聚合引发剂的典型例子有过氧化苯甲酰,过氧化二枯基,过氧化甲乙酮,过氧月桂酸叔丁酯,过氧邻苯二甲酸二叔丁酯,过氧化二苄基,2,5-二甲基-2,5-二(过氧化叔丁基)己烷,过氧化叔丁基枯基,氢过氧化叔丁基,过氧化二叔丁基,2,5-二甲基-2,5-二(过氧化叔丁基)己炔(3),氢过氧化二异丙苯,氢过氧化对
烷,氢过氧化蒎烷,2,5-二甲基己烷-2,2-二氢过氧化物和氢过氧化枯烯。它们的加入量宜为树脂组合物重量的0.1~10%。
环氧固化剂的典型例子有4,4′-二氨基二环己基甲烷,1,4-二氨基环己烷,2,6-二氨基吡啶,间-苯二胺,对苯二胺,4,4′-二氨基二苯基甲烷,2,2′-二(4-氨基苯)丙烷,4,4′-二氨基苯氧化物,4,4′-二氨基苯砜,二(4-氨基苯)甲膦氧化物,二(4-氨基苯)苯膦氧化物,二(4-氨基苯)甲胺,1,5-二氨基萘,间-苯二甲基二胺,1,1′-二(对-氨基苯)-呋咱,对-苯二甲基二胺,六亚甲基二胺,6,6′-二氨基-2,2′-二吡啶基,4,4′-二氨基二苯酮,4,4′-二氨基偶氮苯,二(4-氨基苯)苯甲烷,1,1′-二(4-氨基苯)环己烷,1,1′-二(4-氨基-3-甲基苯基)环己烷,2,5-二(间-氨基苯)-1,3,4,-噁二唑,2,5,-二(对-氨基苯)-1,3,4-噁二唑,2,5-二(间-氨基苯)噻唑并(4,5-d)噻唑,5,5′-二(间-氨基苯)2,2′-二(1,3,4-噁二唑基),4,4′-二氨基二苯基醚,4,4′-二(6-氨基苯)-2,2′-二噻唑,间-二(4-对-氨基苯-2-噻唑基)苯4,4′-二氨基-N-苯甲酰苯胺,4,4′-二氨基苯苯甲酸酯,N,N′-二(4-氨基苄基)-对-苯二胺,4,4′-亚甲基二(2-二氯苯胺),苯胍胺,甲基胍胺,四甲基丁二胺,邻苯二甲酸酐,1,2,4-苯三酸酐,1,2,4,5-苯四酸酐,二苯酮四甲酸酐,乙二醇二(脱水1,2,4-苯三酸酯),甘油三-(脱水1,2,4-苯三酸酯),马来酐,2-甲基咪唑,2-苯基咪唑,2-乙基-4-甲基咪
唑,1-氰乙基-2-乙基-4-甲基咪唑,2-十-烷基咪唑和2-十七烷基咪唑。至少使用一种这样的固化剂。固化剂的合适用量宜为环氧改性的聚丁二烯的重量的0.1~30%,最好为0.3~10%。
游离基聚合引发剂和环氧固化剂根据需要也可一起使用。
上述热固性树脂组合物的混合比例可根据需要而异。一般,当通式(Ⅰ)所代表的聚(对-羟基苯乙烯)衍生物所占的比例增加时,耐火性和机械强度会改善,而柔韧性则降低,固化时的收缩增大。当通式(Ⅱ)所代表的环氧改性的聚丁二烯所占的比例增加时,柔韧性和与铜箔的粘合力会改善,而耐热性则会降低。当通式(Ⅲ)所代表的芳族马来酰亚胺所占的比例增加时,耐火性和耐热性会改善,固化时的收缩会减少,且尺寸稳定性也会改善。
制备本发明的热固性树脂组合物时,宜使通式(Ⅰ)的组分占10~60%(重量),最好为20~40%(重量);宜使通式(Ⅱ)的组分占10~60%(重量),最好为10~30%(重量);宜使通式(Ⅲ)的组分占20~70%(重量),最好为30~60%(重量)。
在本发明的组合物中还可根据需要加入第四种组分-芳香胺。
芳香胺的例子有4,4′-二氨基二苯基甲烷,4,4′-二氨基二苯基砜,4,4′-二氨基二苯基醚,2,2-二〔4-(4-氨基苯氧基)-苯基〕丙烷,2,2-二〔4-(4-氨基苯氧基)苯基〕-六氟丙烷,4,4′-二(3-氨基苯氧基)二苯基,和1,3-二(3-氨基苯氧基)苯。
下面将介绍制造本发明的层压板材的一般方法。
首先,将聚(对-羟基苯乙烯)衍生物、环氧改性的聚丁二烯和芳族马来酰亚胺溶于一种有机溶剂,制得清漆。可以采用的有机溶剂的例子有甲苯,二甲苯,丙酮,甲乙酮,甲基异丁基酮,N,N-二甲基甲酰胺,N-甲基吡咯烷酮,二甲亚砜,三氯乙烯,三氯乙烷,三氯甲烷,二噁烷和乙酸乙酯。
可根据需要将清漆加热,使其进行初步反应,以调节树脂在制备层压板材时的流动性和胶凝时间。此外,还可在清漆中加入偶合剂以提高清漆与基层材料的粘合力。然后再在这样制得的清漆中加入游离基聚合引发剂和环氧固化剂以制成浸渍用清漆。
然后用这样制得的浸渍用清漆浸渍片状基层材料,浸渍后在室温至170℃的温度下干燥,使预浸料不粘手。干燥温度的选择取决于所采用的溶剂和引发剂的种类。最后,将这样制得的预浸料按所需层数叠合,在100~250℃温度和1~100公斤力/厘米2的压力下进行热固化以获得层压板材。
几乎所有常用于层压材料的片状材料均可用于本发明。无机纤维的例子有各种玻璃(如含SiO2、Al2O3和其它成分的E玻璃、C玻璃、A玻璃、S玻璃、D玻璃和YM-31-A玻璃,以及由石英制得的Q玻璃)的纤维和陶瓷纤维。有机纤维的例子有由具有芳香族聚酰胺-酰亚胺骨架的高分子化合物制成的芳基酰胺纤维。
虽然本发明的树脂组合物固化时收缩率很低的原因还不清楚,但可以认为这是由于加入了马来酰亚胺化合物。
由于固化时的收缩率很低,在固化产物即层压板材等之中积聚的应力也小,因而很少发现有裂纹产生。
实施例
实施例1
将50重量份溴化聚(对-羟基苯乙烯)的异丁烯酸酯(酯的分子量为7,000~12,000,含溴量为42%)、30重量份用二环氧甘油醚双酚A改性的聚丁二烯和20重量份2,2′-二〔4-4(马来酰亚胺苯氧基)苯基)丙烷溶于由100重量份甲基异丁基酮和150重量份丙酮组成的混合溶剂中,并在搅拌下将该溶液在50~70℃下加热,再将0.5重量份用作游离基聚合引发剂的2,5-二甲基-2,5-二(过氧化叔丁基)己炔(3)和2重量份用作环氧固化剂的苯胍胺加入该溶液中,并搅拌所得的混合物,直至其完全溶解为止。从而获得清漆。
将所得的清漆置于蒸发器中,在减压和40~50℃下加热,除去空气和溶剂,以获得固体树脂组合物。将该树脂组合物置于一用脱模剂处理过的模具中,在130°~150℃下加热使其变为液体,并在减压下除去空气和泡沫,然后在170℃下热固化120分钟,在200℃下热固化120分钟,在230℃下热固化120分钟,以获得树脂片材。
实施例2~13和比较实例1~6
用基本上与实施例1相同的方法制备树脂片材,所不同的是按表1和2所示的比例进行混合。
在实施例11和比较实例4中所用的溴化聚(对-羟基苯乙烯)的丙烯酸酯的分子量为7,000~12,000,
含溴量为45%;在实施例12和比较实例5中使用的溴化聚(对-羟基苯乙烯)的烯丙醚的分子量为7,000~12,000,含溴量为43%,在实施例13和比较实施例6中所用的溴化聚(对-羟基苯乙烯)的环氧异丁烯酸酯的分子量为7,000~12,000,含溴量为35%。
表3所示为上述实施例和比较实施例中制得的树脂片材的重要特性。
实施例14
将50重量份溴化聚(对-羟基苯乙烯)的异丁烯酸酯(该酯的分子量为7,000~12,000含溴量为42%)、30重量份用二环氧甘油醚双酚A改性的聚丁二烯和20重量份2,2′-二〔4-(4-(马来酰亚胺苯氧基)苯基)丙烷溶于由100重量份甲基异丁基酮和150重量份二甲基甲酰胺组成的混合溶剂中,并在搅拌下将该溶液在100°~120℃下加热30分钟。再将0.5重量份用作游离基聚合引发剂的2,5-二甲基-2,5-二(过氧化叔丁基)己炔(3)和2重量份用作环氧固化剂的苯胍胺加入该溶液中,并搅拌所得的混合物,直至其完全溶解为止,从而获得清漆。
用所得的清漆浸渍玻璃布(E玻璃,0.1毫米厚),在室温下晾干,然后在150℃下干燥10~20分钟以获得不粘手的预浸料。然后将10层预浸料叠合,在40公斤力/厘米2的压力和130℃的温度下加热30分钟,再在170℃下压制1小时和在220℃下压制2小时以获得层压板材。
实施例15~21和比较实例7~10
层压板材的制备方法基本上与实施例14相同,但按照表4所示的比例进行混合。
在实施例19中,所用的溴化聚(对-羟基苯乙烯)的丙烯酸酯的分子量为7,000~12,000,含溴量为45%;在实施例20中,所用的溴化聚(对-羟基苯乙烯)的烯丙醚的分子量为7,000~12,000,含溴量为43%,在实施例21中,所用的溴化聚(对-羟基苯乙烯)的环氧异丁酸酯的分子量为7,000~12,000,含溴量为35%。
比较实施例11和12分别代表环氧树脂层压板材和聚酰亚胺树脂层压板材。
比较例13
将50重量份1,2-聚丁二烯预聚物和50重量份甲酚线型环氧改性的聚丁二烯溶于二甲苯中以获得固体含量为20~30%(重量)的清漆。再将2重量份用作游离基聚合引发剂的过氧化二枯基和1重量份用作环氧固化剂的2-乙基-4-甲基咪唑加入该清漆中。然后,重复实施例14的操作以获得层压板材。
表5所示为在上述实施例和比较实施例中所获得的层压板材的重要特性。
实施例22
用表6所示的树脂组合物在按照实施例14所述的方法制得的预浸料的两面分别粘合一层厚度为35微米的铜箔,铜箔的与预浸料接触的一面事先使之粗糙。将该组件在30公斤力/厘米2的压力和130℃的温度下加热30分钟,在170℃下加热1小时,在200℃下加热2小时,以获得敷铜的层压板材。绝缘层的厚度为100微米。用光蚀刻方法处理该敷铜层压板材,以形成内层电路图形,包括信号层、电源层、匹配层等。然后用下面的方法处理电路图形的铜表面以形成双面布置组合电路板材。
用三氧乙烯洗涤→浸在氯化铜/盐酸溶液(1)中(40°~50℃,2分钟)→水洗→浸在10%硫酸中(室温,2分钟)→水洗→吹空气→浸在形成氧化膜的溶液(2)中(70°~80℃,2分钟)→水洗→干燥(100℃,30分钟)。
溶液组成
(1)浓盐酸300克,氯化铜50克,蒸馏水650克(用于使铜表面粗糙)。
(2)氢氧化钠5克,三代磷酸钩10克,亚氯酸钠30克,蒸馏水955克(用于使铜表面稳定)完成上述处理后,将所生成的线路板和上述预浸料树脂片材结合成图1所示的结构,以形成30层线路导电层2。然后进行粘合,粘合的条件为在40公斤/厘米2压力下在170℃保持90分钟和在220℃下保持90分钟以制备多层印刷电路板。
在多层粘合过程中,将导销插入板材四个角上的孔中,以防止错位。在多层粘合后,用微型钻钻出一直径为0.3或0.6毫米的小孔,并在该孔的全部表面上化学镀铜以形成通孔导体4。接着,用浸蚀的方法形成最外层的电路,这样就完成了多层印刷电路板的制作。
在本实施例中,能制得尺寸为570毫米×400毫米×约3.5毫米(厚)的多层印刷电路板,在该电路板中线的宽度为70微米或100微米,Channel/grid比为2~3/1.3毫米,层与层的切变比(Shear)约为100微米或小于100微米。玻璃布约占绝缘层的30%(体积)。
在图1中,1和3表示绝缘层,2表示电路导
体层,4为一通孔;1为上述镀铜的层压板基层,3为预浸料树脂片材。
实施例23~29和比较实例14~17
多层印刷电路板的制作方法与实施例22相同,但分别使用表6所示的树脂组合物。
表7所示为利用从多层印刷电路板上切下的试片测定的焊接耐热性和热冲击特性的试验结果。
热分解温度是在升温速率为5℃/分的空气中用10毫克研成粉末的树脂样品测定的,并以重量损失达到5%的温度作为热分解温度。
线膨胀系数的测定方法是在升温速率为2℃/分的情况下测量在厚度方向的热膨胀并根据50℃~200℃之间的尺寸变化计算出线膨胀系数。
固化时的体积收缩率是根据固体在固化前后的比重的差别计算而得。
弯曲强度是用切成25×50毫米大小的层压板材测定的,测定时两个支点之间的距离为30毫米,在室温和180℃下的弯曲速率为1毫米/分。
介电常数是按照JISC6481的方法测定的,系测定1MHZ频率时的静电容量。
焊接耐热性和挠曲特性是按照JISC6481的方法评定的,测定焊接耐热性时是在试样在260℃下经受300秒后检查其外观。
耐火性是按照UL-94垂直方法测定的。热冲击特性的评定方法是以-60℃~+125℃的温度变化作为一个周期(∞)测定出现裂纹时的周期数。
本发明的树脂组合物与以前的低介电常数的树脂组合物相比,固化时的体积收缩率较小,因此模压性能好。
用本发明的树脂组合物制得的层压材料,具有与公认的低介电常数材料-聚丁二烯型材料差不多的低介电常数。由于本发明的材料的介电常数低达3.5左右,而目前用作大型计算机的多层印刷电路板的环氧型材料和聚酰亚胺型材料的介电常数为4.7,因此采用本发明的材料能使信号发送延迟时间缩短15%。
而且,用本发明的树脂组合物制作多层印刷电路板能获得具有极好的热冲击特性的基层。
按照本发明能获得收缩率低的树脂组合物,并能提供具有极好的抗龟裂性、耐热性和耐火性的低介电常数层压板材。
Claims (9)
2、按照权利要求1所述的热固性树脂组合物,该组合物包含:
(a)20~40%(重量)上述聚(对-羟基苯乙烯)衍生物的预聚物,
(b)10~30%(重量)上述环氧改性的聚丁二烯,和
(c)30~60%(重量)上述芳族马来酰亚胺化合物。
4、按照权利要求3所述的热固性树脂组合物,该组合物包含
(a)20~40%(重量)上述聚(对-羟基苯乙烯)衍生物预聚物,
(b)10~30%(重量)上述环氧改性的聚丁二烯,和
(c)30~60%(重量)上述芳族马来酰亚胺化合物。
5、包含纤维状基层材料和热固性树脂组合物的预浸料,所述的热固性树脂组合物包含:
(a)10-60%(重量)的一种通用式(Ⅰ)代表的聚(对-羟基苯基乙烯)衍生物的预聚物
Ⅰ
式中,A为卤素,R1为含2~4个碳原子的链烯基或链烯酰基,m表示1~4的数,n表示1~100的数,
(b)10~60%(重量)的一种环氧改性的聚丁二烯,其特征在于,
(c)20~70%(重量)的一种芳族马来酰亚胺化合物。
6、按照权利要求5所述的预浸料,其中所述的热固性树脂组合物包含:
(a)20~40%(重量)上述聚(对-羟基苯乙烯)衍生物的预聚物,
(b)10~30%(重量)上述环氧改性的聚丁二烯,和
(c)30~60%(重量)上述芳族马来酰亚胺化合物。
7、一种包含纤维状基层材料和热固性树脂组合物的预浸料,所述的热固性树脂组合物包含
(a)10-60%(重量)的一种用通式(Ⅰ)代表的聚(对-羟基苯乙烯)衍生物的预聚物
(Ⅰ)
式中,A为卤素,R1为含2~4个碳原子的链烯基或链烯酰基,m表示1~4的数,n表示1~100的数,
(b)10~60%(重量)的一种用通式(Ⅱ)代表的环氧改性的聚丁二烯
(Ⅱ)
式中,B为缩水甘油醚型环氧共聚物,n表示4~100的数,其特征在于,
(c)20~70%(重量)的一种用通式(Ⅲ)代表的芳族马来酰亚胺化合物
(Ⅲ)
式中,R2为至少含一个苯环的芳基,n表示1~4的数。
8、按照权利要求7所述的预浸料,其中所述的热固性树脂组合物包含
(a)20~40%(重量)上述聚(对-羟基苯乙烯)衍生物的预聚物,
(b)10~30%(重量)上述环氧改性的聚丁二烯,和
(c)30~60%(重量)上述芳族马来酰亚胺化合物。
9、一种用预浸料层压而得的层压板材,所述的预浸料包含纤维状基层材料和热固性树脂组合物,该热固性树脂组合物包含:
(a)10-60%(重量)的一种用通式(Ⅰ)代表的聚(对-羟基苯乙烯)衍生物的预聚物
Ⅰ
式中,A为卤素,R1为含2~4个碳原子的链烯基或链烯酰基,m表示1~4的数,n表示1~100的数,
(b)10~60%(重量)的一种环氧改性的聚丁二烯,其特征在于,
(c)20~70%(重量)的一种芳族马来酰亚胺化合物。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62277446A JPH072829B2 (ja) | 1987-11-04 | 1987-11-04 | 積層板 |
JP277446/87 | 1987-11-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1033065A CN1033065A (zh) | 1989-05-24 |
CN1009006B true CN1009006B (zh) | 1990-08-01 |
Family
ID=17583686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN88107546A Expired CN1009006B (zh) | 1987-11-04 | 1988-11-03 | 热固性树脂组合物及由其制得的预浸料和层压板材 |
Country Status (6)
Country | Link |
---|---|
US (2) | US4931507A (zh) |
EP (1) | EP0315211B1 (zh) |
JP (1) | JPH072829B2 (zh) |
KR (1) | KR960007765B1 (zh) |
CN (1) | CN1009006B (zh) |
DE (1) | DE3853868T2 (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0234450B1 (en) * | 1986-02-19 | 1994-10-12 | Hitachi, Ltd. | Thermosetting resin and prepreg and laminate using the same |
EP0954553B2 (en) † | 1997-01-21 | 2008-12-10 | Dow Global Technologies Inc. | Latent catalysts for epoxy curing systems |
JP3184485B2 (ja) * | 1997-11-06 | 2001-07-09 | 三井金属鉱業株式会社 | 銅張積層板用樹脂組成物、樹脂付き銅箔、多層銅張り積層板および多層プリント配線板 |
JP2006225484A (ja) * | 2005-02-16 | 2006-08-31 | Murata Mfg Co Ltd | 複合誘電体材料及び電子部品 |
CN101443368B (zh) * | 2006-05-18 | 2012-08-29 | 弗来克塞斯股份有限公司 | 含有双柠康酰亚胺、双衣康酰亚胺和/或柠康酰亚氨基衣康酰亚胺的组合物 |
JP5266685B2 (ja) * | 2006-09-29 | 2013-08-21 | 日立化成株式会社 | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
US9093448B2 (en) | 2008-11-25 | 2015-07-28 | Lord Corporation | Methods for protecting a die surface with photocurable materials |
WO2010068488A1 (en) * | 2008-11-25 | 2010-06-17 | Lord Corporation | Methods for protecting a die surface with photocurable materials |
CN101643565B (zh) * | 2009-08-24 | 2010-07-21 | 广东生益科技股份有限公司 | 复合材料、用其制作的高频电路基板及其制作方法 |
SG10201606122TA (en) * | 2012-01-19 | 2016-09-29 | Isola Usa Corp | Synthesized resins and varnishes, prepregs and laminates made thereform |
JP6303320B2 (ja) * | 2013-08-06 | 2018-04-04 | 味の素株式会社 | 部品実装基板の製造方法 |
JP6885000B2 (ja) * | 2016-07-19 | 2021-06-09 | 昭和電工マテリアルズ株式会社 | 半導体再配線層形成用樹脂フィルム、半導体再配線層形成用複合フィルム、それらを用いた半導体装置及び半導体装置の製造方法 |
WO2018150771A1 (ja) * | 2017-02-20 | 2018-08-23 | Jsr株式会社 | 感光性樹脂組成物、硬化膜およびその製造方法ならびに電子部品 |
CN109082019B (zh) * | 2017-06-13 | 2020-04-14 | 广东生益科技股份有限公司 | 一种聚合物树脂及其在高频电路板中的应用 |
CN109082021B (zh) * | 2017-06-13 | 2021-01-01 | 广东生益科技股份有限公司 | 一种聚合物树脂组合物及其在高频电路板中的应用 |
CN109082020A (zh) * | 2017-06-13 | 2018-12-25 | 广东生益科技股份有限公司 | 聚合物树脂组合物及其在高频电路板中的应用 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5573726A (en) * | 1978-11-28 | 1980-06-03 | Fujitsu Ltd | Heat-resistant resin composition |
JPS5573728A (en) * | 1978-11-28 | 1980-06-03 | Fujitsu Ltd | Heat-resistant resin composition |
US4229550A (en) * | 1978-12-11 | 1980-10-21 | Trw Inc. | Flexibilized vinyl polybutadiene maleimide resins |
JPS55126455A (en) * | 1979-03-23 | 1980-09-30 | Nippon Baldwin Kk | Circulation replenishment adjustor for printing press wetting water |
JPS6011634B2 (ja) * | 1979-03-24 | 1985-03-27 | 富士通株式会社 | 耐熱性積層板 |
JPS55127425A (en) * | 1979-03-24 | 1980-10-02 | Fujitsu Ltd | Heat-resistant resin composition and heat-resistant laminated sheet |
JPS6133050A (ja) * | 1984-07-26 | 1986-02-15 | Ricoh Co Ltd | ル−プ通信方式 |
JPS61243844A (ja) * | 1985-04-23 | 1986-10-30 | Hitachi Ltd | 熱硬化性樹脂組成物 |
US4743647A (en) * | 1985-08-02 | 1988-05-10 | Amoco Corporation | Prepreg resin from aromatic bismaleimide and ethylenically unsaturated coreactant |
EP0234450B1 (en) * | 1986-02-19 | 1994-10-12 | Hitachi, Ltd. | Thermosetting resin and prepreg and laminate using the same |
JPH0680094B2 (ja) * | 1986-02-19 | 1994-10-12 | 株式会社日立製作所 | 難燃性樹脂組成物 |
JPS6356548A (ja) * | 1986-08-27 | 1988-03-11 | Hitachi Ltd | 熱硬化性樹脂組成物、それを用いた積層板およびその製造方法 |
-
1987
- 1987-11-04 JP JP62277446A patent/JPH072829B2/ja not_active Expired - Lifetime
-
1988
- 1988-10-29 KR KR1019880014147A patent/KR960007765B1/ko not_active IP Right Cessation
- 1988-11-02 US US07/266,406 patent/US4931507A/en not_active Expired - Fee Related
- 1988-11-03 CN CN88107546A patent/CN1009006B/zh not_active Expired
- 1988-11-04 DE DE3853868T patent/DE3853868T2/de not_active Expired - Fee Related
- 1988-11-04 EP EP88118454A patent/EP0315211B1/en not_active Expired - Lifetime
-
1990
- 1990-03-26 US US07/487,406 patent/US5080965A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1033065A (zh) | 1989-05-24 |
JPH072829B2 (ja) | 1995-01-18 |
US4931507A (en) | 1990-06-05 |
US5080965A (en) | 1992-01-14 |
DE3853868T2 (de) | 1995-09-21 |
JPH01121356A (ja) | 1989-05-15 |
EP0315211B1 (en) | 1995-05-24 |
KR890008186A (ko) | 1989-07-10 |
KR960007765B1 (ko) | 1996-06-12 |
EP0315211A1 (en) | 1989-05-10 |
DE3853868D1 (de) | 1995-06-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1009006B (zh) | 热固性树脂组合物及由其制得的预浸料和层压板材 | |
CN87100741A (zh) | 热固性树脂及使用该树脂制备的半固化片和层压材料 | |
TW201835216A (zh) | 聚苯醚樹脂組合物 | |
JPH11236430A (ja) | ポリフェニレンエーテル熱硬化性組成物 | |
JPH0713165B2 (ja) | 熱硬化性樹脂組成物 | |
JPH0680094B2 (ja) | 難燃性樹脂組成物 | |
US5212244A (en) | Thermosetting resin composition, and prepreg and laminated sheet which use the same | |
JPH0764913B2 (ja) | 新しい硬化性ポリフェニレンエーテル・エポキシ樹脂組成物 | |
JP2866661B2 (ja) | 熱硬化性樹脂組成物並びにそれを用いたプリプレグおよび積層板 | |
Wang et al. | Synthesis and properties of thermosetting modified polyphenylene ether | |
JPH0764914B2 (ja) | 新規な硬化性ポリフェニレンエーテル・エポキシ樹脂組成物 | |
JP2533747B2 (ja) | 積層板及びその製造方法 | |
JPH08245872A (ja) | 低誘電率・低誘電正接のポリフェニレンエーテル系樹脂組成物 | |
JP2570138B2 (ja) | 難燃性樹脂組成物を用いた積層板 | |
WO2023145473A1 (ja) | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板 | |
JP2570145B2 (ja) | 熱硬化性樹脂組成物を用いたプリプレグおよび積層板 | |
JPS6119640A (ja) | 耐熱積層板の製造方法 | |
JPH0771843B2 (ja) | 積層板 | |
TW202336126A (zh) | 樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及印刷配線板 | |
JP2009203384A (ja) | 架橋性樹脂組成物 | |
JPS6059932B2 (ja) | 電気用不飽和ポリエステル樹脂積層板の加工性改良方法 | |
JPS6119641A (ja) | 耐熱積層板の製法 | |
JPH06116349A (ja) | ポリフェニレンエーテル樹脂組成物および複合材料 | |
JPH0218325B2 (zh) | ||
JPH05287192A (ja) | 硬化性を有するポリフェニレンエーテル・エポキシ樹脂組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C13 | Decision | ||
GR02 | Examined patent application | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C15 | Extension of patent right duration from 15 to 20 years for appl. with date before 31.12.1992 and still valid on 11.12.2001 (patent law change 1993) | ||
OR01 | Other related matters | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |