TW201835216A - 聚苯醚樹脂組合物 - Google Patents
聚苯醚樹脂組合物 Download PDFInfo
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Abstract
聚苯醚樹脂組合物,包括:100重量份的聚苯醚樹脂;25至40重量份的共聚物;以及0.01至0.02重量份的反應起始劑。共聚物係(A)(a)單官能基單體、(b1)雙官能基單體、與(c)三官能基單體經自由基聚合而成;(B)(a)單官能基單體與(b2)雙官能基單體經自由基聚合而成;或(C)上述之組合。
Description
本發明關於聚苯醚樹脂組合物。
目前高頻技術已進入日常生活,隨著電子傳輸速度的提高,對頻率的要求也越來越高,因此對電子材料具有更高的要求。此類材料除了需具有優異加工性與力學性能,還需具有低介電常數(Dk)、低介電損耗(Df)、與優異的耐熱性。聚苯醚是高性能的樹脂,由於其具有良好對稱的分子鏈、較小的分子間作用力、與較高的芳基比例,因此具有優異的介電特性如低介電常數與低介電損耗,可滿足高頻應用對材料介電性能的要求。同時,聚苯醚還具有較高玻璃化轉變溫度、低吸水率、與優異的衝擊韌性等,在高頻層壓板材料中具有廣闊的應用前景。然而大分子量(>10000)的聚苯醚樹脂具有溶解性差、與環氧樹脂相容性不佳、及熔融黏度高等問題,造成製作的層壓板出現耐熱性不足、黏結性低、與尺寸穩定性差等現象,嚴重影響其使用可靠性。
為克服大分子量聚苯醚樹脂的問題,可採用低分子量的聚苯醚和固化劑三烯丙基異氰脲酸酯(TAIC)形成低介電性的聚苯醚樹脂組合物。TAIC的沸點較低,在使用過程中容易揮發,且聚苯醚樹脂組合物還具有玻璃轉換溫度較低的缺點。玻璃轉換溫度較低會影響銅箔基板的耐熱性與使用壽命。
苯乙烯(及其衍生物)以及二乙烯基類單體之化學結構比TAIC或三烯丙基氰脲酸酯(TAC)具有更低的極性,同時可作為自由基聚合單體,所以這兩類單體可作為聚苯醚樹脂的交聯成分。但這兩類單體的揮發性,在半固化片的製備過程中會導致膠化時間短,且壓製形成的板材其玻璃化轉化溫度不穩定。
綜上所述,目前亟需新的交聯劑或固化劑搭配聚苯醚樹脂以克服前述問題。
本發明一實施例提供之聚苯醚樹脂組合物,包括:100重量份的聚苯醚樹脂;25至40重量份的共聚物;以及0.01至0.02重量份的反應起始劑,其中共聚物係(A)(a)單官能基單體、(b1)雙官能基單體、與(c)三官能基單體經自由基聚合而成;(B)(a)單官能基單體與(b2)雙官能基單體經自由基聚合而成;或(C)上述之組合,其中(a)單官能基單體包括苯乙烯、α-甲基苯乙烯、4-甲基苯乙烯、或上述之組合;其中(b1)雙官能基單體包括雙酚A二甲基丙烯酸酯、二乙烯基苯、1,3-二異丙烯基苯、或上述之組合;其中(b2)雙官能基單體包括(b21)鄰苯二甲酸二烯丙酯與(b22)雙酚A二甲基丙烯酸酯、1,3-二異丙烯基苯、與二乙烯基苯中一或多者的組合;以及其中(c)三官能基單體包括三烯丙基異氰脲酸酯、三烯丙基氰脲酸酯、或上述之組合。
本發明一實施例提供之聚苯醚樹脂組合物,包括:100重量份的聚苯醚樹脂;25至40重量份的共聚物;以及0.01至0.02重量份的反應起始劑。上述聚苯醚樹脂組合物可進一步固化,即反應起始劑使聚苯醚樹脂與共聚物交聯以形成產品。若共聚物之比例過高,則因所得樹脂組合物流動性較差而造成操作性不佳。若共聚物之比例過低,則聚苯醚樹脂含量過高而造成交聯密度下降。若反應起始劑之比例過低,則會降低反應物的交聯密度,進而降低壓合形成的層壓板的Tg。若反應起始劑之比例過高,則反應速率過快而不易操作。
在一實施例中,聚苯醚樹脂為末端為甲基丙烯醯氧基的聚苯醚樹脂、末端乙烯苄基醚的聚苯醚樹脂、或上述之組合。在一實施例中,聚苯醚樹脂的重均分子量為1500-5000,而聚合物分散性指數(polymer dispersity index,PDI)為1.4-1.7。若聚苯醚樹脂的重均分子量過高,則樹脂組合物的黏度過高,含浸不易,壓合時,流動性不足,易造成層與層之間黏著性不好,造成乾板。若聚苯醚樹脂的重均分子量過低,則製成的層壓板介電性能下降。若聚苯醚樹脂的PDI過高,則會影響介電性能和樹脂流動性。
在一實施例中,共聚物係(A)(a)單官能基單體、(b1)雙官能基單體、和(c)三官能基單體經自由基聚合而成、(B)(a)單官能基單體與(b2)雙官能基單體經自由基聚合而成、或(C)上述之組合。此聚合過程通過分子量調節劑,可控制共聚物之數均分子量在3000-6000之間,以避免單體揮發並保證共聚物的流動性。
在一實施例中,上述共聚物之製備方法可為在氮氣環境下混合上述單體、反應起始劑、溶劑、與分子量調節劑,在 60-80℃反應4-6小時。反應起始劑占單體總重的0.1-3wt%,溶劑(如甲苯或二甲苯)用量可控制單體濃度介於30-50wt%,且分子量調節劑(如α-甲基苯乙烯二聚體)與單體總量的當量比為1:5至1:20之間。
當共聚物係(A)(a)單官能基單體、(b1)雙官能基單體、和(c)三官能基單體經自由基聚合而成時,(a)單官能基單體包括苯乙烯、α-甲基苯乙烯、4-甲基苯乙烯、或上述之組合。(b1)雙官能基單體包括雙酚A二甲基丙烯酸酯、二乙烯基苯、1,3-二異丙烯基苯、或上述之組合。(c)三官能基單體包括三烯丙基異氰脲酸酯(TAIC)、三烯丙基氰脲酸酯(TAC)、或上述之組合。在此實施例中,(a)單官能基單體與(b1)雙官能基單體之重量比介於100:40至100:300之間,而(a)單官能基單體與(c)三官能基單體之重量比介於100:40至100:300之間。若(b1)雙官能基單體之比例過高,則因烯丙基單體不能相互自由基聚合導致三官能基單體比較難以實現聚合。若(b1)雙官能基單體之比例過低,則產品的聚合效果會變差且影響介電性能。若(c)三官能基單體之比例過高,則會影響聚合效果。若(c)三官能基單體之比例過低,則交聯密度下降且樹脂流動性變差。
當共聚物係(B)(a)單官能基單體與(b2)雙官能基單體經自由基聚合而成時,(a)單官能基單體包括苯乙烯、α-甲基苯乙烯、4-甲基苯乙烯、或上述之組合,且(b2)雙官能基單體包括(b21)鄰苯二甲酸二烯丙酯與(b22)雙酚A二甲基丙烯酸酯、1,3-二異丙烯基苯、與二乙烯基苯中一或多者的組合。在此實施例中,(a)單官能基單體與(b2)雙官能基單體之重量比介於100:200至100:600 之間。若(b2)雙官能基單體之比例過高,則聚合過程較為難以控制。若(b2)雙官能基單體之比例過低,則交聯密度較小影響層壓板的玻璃轉化溫度。在一實施例中,(b21)鄰苯二甲酸二烯丙酯與(b22)雙酚A二甲基丙烯酸酯、1,3-二異丙烯基苯、與二乙烯基苯中一或多者的重量比介於100:200至100:1100之間。若(b21)鄰苯二甲酸二烯丙酯之比例過低,則樹脂組合物流動性變差。若(b21)鄰苯二甲酸二烯丙酯之比例過高,則樹脂組合物壓合成層壓板的耐濕熱性能變差。
在一實施例中,反應起始劑可為過氧化二苯甲醯(BPO)、過氧化二異丙苯、過氧化二叔丁基、雙(第三丁基過氧化間異丙基)苯、或上述之組合。反應起始劑可在相應溫度梯段有效引發聚合,保證半固化片和對應的電路板材之物理化學性質滿足使用要求。
在一實施例中,上述聚苯醚樹脂組合物可進一步包含20-40重量份的阻燃劑。阻燃劑並不限定於特定種類,只要能滿足阻燃要求即可。舉例來說,可採用溴系阻燃劑如十溴二苯乙烷等,或是磷氮系阻燃劑如環狀苯氧基磷腈化合物等。
在一實施例中,上述聚苯醚樹脂組合物可進一步包含0.5-1重量份的矽烷偶聯劑與20-40重量份的二氧化矽。上述矽烷偶聯劑可為(3-環氧丙氧丙基)三甲氧基矽烷、(3-環氧丙氧丙基)三乙氧基矽烷、3-(甲基丙烯醯氧)丙基三甲氧基矽烷、或上述之組合。矽烷偶聯劑可在無機物質和有機物質的介面之間架起「分子橋」,使兩種性質懸殊的材料連接在一起,以提高複合材料的性能和增加粘接強度。可優先採用3-(甲基丙烯醯氧)丙基三甲氧基 矽烷作為矽烷偶聯劑。在聚苯醚樹脂組合物中添加低介電常數的二氧化矽(如熔融型石英粉),有助於降低樹脂固化物的熱膨脹係數並降低成本。
為了讓本揭露之上述和其他目的、特徵、和優點能更明顯易懂,下文特舉數實施例配合所附圖示,作詳細說明如下:
實施例
下述所用的藥品名稱及來源列舉如下,但不限於所列藥品:末端為甲基丙烯醯氧基的聚苯醚樹脂:購自SABIC所生產的NORYL RESIN SA 9000。
阻燃劑:購自ALBEMARLE ASANO公司所生產的SAYTEX 8010,溴含量82.3%。
矽烷偶聯劑:購自EVONIK公司所生產的Dynasylan MEMO。
熔融型石英粉:購自SIBELCO公司所生產的MEGASIL 525。
E型2116玻璃纖維布購自台玻集團
共聚物的製備
製備例1
在氮氣環境下混合25g之苯乙烯,10g之二乙烯基苯、10g之三烯丙基異氰脲酸酯(TAIC)、0.5g之過氧化苯甲醯(BPO)反應起始劑、5g之α-甲基苯乙烯二聚體、以及50g之甲苯,在60℃反應6小時,得到固含量50%的共聚物。
製備例2
在氮氣環境下混合5g之苯乙烯,15g之雙酚A二甲基丙烯酸酯、15g之TAIC、0.5g之過氧化苯甲醯(BPO)反應起始劑、5g之α-甲基苯乙烯二聚體、以及40g之甲苯,在70℃反應5小時,得到固含量50%的共聚物。
製備例3
在氮氣環境下混合15g之苯乙烯,15g之二乙烯基苯、15g之TAIC、0.5g之過氧化苯甲醯(BPO)反應起始劑、5g之α-甲基苯乙烯二聚體、以及50g之甲苯,在80℃反應4小時,得到固含量50%的共聚物。
製備例4
在氮氣環境混合5g之苯乙烯、5g之α-甲基苯乙烯,5g之雙酚A二甲基丙烯酸酯、25g之TAIC、0.5g之過氧化苯甲醯(BPO)反應起始劑、3.5g之α-甲基苯乙烯二聚體、以及40g之甲苯,在80℃反應4小時,得到固含量50%的共聚物。
製備例5
在氮氣環境下混合10g之苯乙烯、20g之鄰苯二甲酸二烯丙酯、10g之雙酚A二甲基丙烯酸酯、30g之1,3-二異丙烯基苯、0.5g之過氧化苯甲醯(BPO)反應起始劑、5g之α-甲基苯乙烯二聚體、以及75g之甲苯,在80℃反應4小時,得到固含量50%的共聚物。
製備例6
在氮氣環境下混合12.5g之苯乙烯,2.5g之鄰苯二甲酸二烯丙酯,5g之雙酚A二甲基丙烯酸酯、17.5g之1,3-二異丙烯基苯,5g之二乙烯基苯,0.25g之過氧化苯甲醯(BPO)反應起始劑、2.5g之α-甲基苯乙烯二聚體、以及45g之甲苯,在80℃反應4小時,得到固 含量50%的共聚物。
製備例7
在氮氣環境下混合15g之苯乙烯,5g之鄰苯二甲酸二烯丙酯,22.5g之1,3-二異丙烯基苯,5g之二乙烯基苯,0.25g之過氧化苯甲醯(BPO)反應起始劑、2.5g之α-甲基苯乙烯二聚體、以及50g之甲苯,在80℃反應4小時,得到固含量50%的共聚物。
比較製備例1
在氮氣環境下混合10g之苯乙烯、10g之雙酚A二甲基丙烯酸酯、30g之1,3-二異丙烯基苯、0.5g之過氧化苯甲醯(BPO)反應起始劑、5g之α-甲基苯乙烯二聚體,以及55g甲苯,在80℃反應4小時,得到固含量50%的共聚物。
比較製備例2
在氮氣環境下混合5g之苯乙烯,20g之雙酚A二甲基丙烯酸酯、15g之TAIC、0.5g之過氧化苯甲醯(BPO)反應起始劑、5g之α-甲基苯乙烯二聚體、以及45g之甲苯,在70℃反應5小時,得到固含量50%的共聚物。
比較製備例3
在氮氣環境下混合10g之苯乙烯、25g之鄰苯二甲酸二烯丙酯、15g之雙酚A二甲基丙烯酸酯、15g之1,3-二異丙烯基苯、10g之二乙烯基苯、0.5g之過氧化苯甲醯(BPO)反應起始劑、5g之α-甲基苯乙烯二聚體、以及75g之甲苯,在80℃反應4小時,得到固含量50%的共聚物。
比較製備例4
在氮氣環境下混合12g之苯乙烯、15g之鄰苯二甲酸二烯丙 酯、2.5g之二乙烯基苯、0.5g之過氧化苯甲醯(BPO)反應起始劑、5g之α-甲基苯乙烯二聚體、以及35g之甲苯,在80℃反應4小時,得到固含量50%的共聚物。
實施例1
取100g之聚苯醚(SA9000)與100g甲苯混合將聚苯醚完全溶解 後,再加入50g之製備例1製備的共聚物(固含量50%)、20g之阻燃劑(SAYTEX 8010)、0.5g的矽烷偶聯劑(Dynasylan MEMO)、20g的熔融型石英粉(MEGASIL 525)、0.02g的反應起始劑(BPO)、與100g之甲苯混合均勻。
實施例2
取100g的聚苯醚(SA9000)與100g甲苯混合將聚苯醚完全溶解後,再加入60g之製備例2製備的共聚物(固含量50%)、40g之阻燃劑(SAYTEX 8010)、1g之矽烷偶聯劑(Dynasylan MEMO)、40g之熔融型石英粉(MEGASIL 525)、0.02g之反應起始劑(BPO)、與100g之甲苯混合均勻。
實施例3
取100g的聚苯醚(SA9000)與100g甲苯混合將聚苯醚完全溶解後,再加入70g之製備例3製備的共聚物(固含量50%)、32g的阻燃劑(SAYTEX 8010)、1g之矽烷偶聯劑(Dynasylan MEMO)、32g之熔融型石英粉(MEGASIL 525)、0.02g之反應起始劑(BPO)、與100g之甲苯混合均勻。
實施例4
取100g的聚苯醚(SA9000)與100g甲苯混合將聚苯醚完全溶解後,再加入80g之製備例4製備的共聚物(固含量50%)、32g之阻燃劑(SAYTEX 8010)、1g之矽烷偶聯劑(Dynasylan MEMO)、32g之熔融型石英粉(MEGASIL 525)、0.02g之反應起始劑(BPO)、與100g之甲苯混合均勻。
實施例5
取100g的聚苯醚(SA9000)與100g甲苯混合將聚苯醚完全溶解 後,再加入75g之製備例5製備的共聚物(固含量50%)、32g之阻燃劑(SAYTEX 8010)、1g之矽烷偶聯劑(Dynasylan MEMO)、32g之熔融型石英粉(MEGASIL 525)、0.02g之反應起始劑(BPO)、與100g之甲苯混合均勻。
實施例6
取100g的聚苯醚(SA9000)與100g甲苯混合將聚苯醚完全溶解後,再加入50g之製備例6製備的共聚物(固含量50%)、35g之阻燃劑(SAYTEX 8010)、1g之矽烷偶聯劑(Dynasylan MEMO)、35g之熔融型石英粉(MEGASIL 525)、0.02g之反應起始劑(BPO)、與100g之甲苯混合均勻。
實施例7
取100g的聚苯醚(SA9000)與100g甲苯混合將聚苯醚完全溶解後,再加入80g之製備例7製備的共聚物(固含量50%)、32g之阻燃劑(SAYTEX 8010)、1g之矽烷偶聯劑(Dynasylan MEMO)、32g之熔融型石英粉(MEGASIL 525)、0.02g之反應起始劑(BPO)、與100g之甲苯混合均勻。
比較例1
100g的聚苯醚(SA9000)與100g甲苯混合將聚苯醚完全溶解後,再加入40g之TAIC與40g甲苯的混合液、32g之阻燃劑(SAYTEX 8010)、1g之矽烷偶聯劑(Dynasylan MEMO)、32g之熔融型石英粉(MEGASIL 525)、0.02g之反應起始劑(BPO)、與100g之甲苯混合均勻。
比較例2
100g的聚苯醚(SA9000)與100g甲苯混合將聚苯醚完全溶解 後,再加入40g之二乙烯基苯與40g甲苯的混合液、32g之阻燃劑(SAYTEX 8010)、1g之矽烷偶聯劑(Dynasylan MEMO)、32g之熔融型石英粉(MEGASIL 525)、0.02g之反應起始劑(BPO)、與100g之甲苯混合均勻。在後續半固化片製作過程中170℃烘烤時二乙烯基苯揮發,導致無法繼續操作。
比較例3
取100g的聚苯醚(SA9000)與100g甲苯混合將聚苯醚完全溶解後,再加入80g之比較製備例1製備的共聚物(固含量50%)、32g之阻燃劑(SAYTEX 8010)、1g之矽烷偶聯劑(Dynasylan MEMO)、32g之熔融型石英粉(MEGASIL 525)、0.02g之反應起始劑(BPO)、與100g之甲苯混合均勻。
比較例4
取100g的聚苯醚(SA9000)與100g甲苯混合將聚苯醚完全溶解後,再加入80g之比較製備例2製備的共聚物(固含量50%)、32g之阻燃劑(SAYTEX 8010)、1g之矽烷偶聯劑(Dynasylan MEMO)、32g之熔融型石英粉(MEGASIL 525)、0.02g之反應起始劑(BPO)、與100g之甲苯混合均勻。
比較例5
取100g的聚苯醚(SA9000)與100g甲苯混合將聚苯醚完全溶解後,再加入80g之比較製備例3製備的共聚物(固含量50%)、32g之阻燃劑(SAYTEX 8010)、1g之矽烷偶聯劑(Dynasylan MEMO)、32g之熔融型石英粉(MEGASIL 525)、0.02g之反應起始劑(BPO)、與100g之甲苯混合均勻。
比較例6
取100g的聚苯醚(SA9000)與100g甲苯混合將聚苯醚完全溶解後,再加入80g之比較製備例4製備的共聚物(固含量50%)、32g之阻燃劑(SAYTEX 8010)、1g之矽烷偶聯劑(Dynasylan MEMO)、32g之熔融型石英粉(MEGASIL 525)、0.02g之反應起始劑(BPO)、與100g之甲苯混合均勻。
比較例7(單體僅混合而未聚合)
100g的聚苯醚(SA9000)與100g甲苯混合將聚苯醚完全溶解後,再加入50g之製備例1所用單體混合液(12.5g之苯乙烯,5g之二乙烯基苯、5g之TAIC、2.5g之α-甲基苯乙烯二聚體,與25g甲苯的混合液)、20g之阻燃劑(SAYTEX 8010)、0.5g之矽烷偶聯劑(Dynasylan MEMO)、20g之熔融型石英粉(MEGASIL 525)、0.02g之反應起始劑(BPO)、與100g之甲苯混合均勻。
比較例8(單體僅混合而未聚合)
100g的聚苯醚(SA9000)與100g甲苯混合將聚苯醚完全溶解後,再加入75g之製備例5所用單體混合液(5g之苯乙烯、10g之鄰苯二甲酸二烯丙酯、5g之雙酚A二甲基丙烯酸酯、15g之1,3-二異丙烯基苯、2.5g之α-甲基苯乙烯二聚體,與37.5g甲苯的混合液)、32g之阻燃劑(SAYTEX 8010)、1g之矽烷偶聯劑(Dynasylan MEMO)、32g之熔融型石英粉(MEGASIL 525)、0.02g之反應起始劑(BPO)、與100g之甲苯混合均勻。
銅箔基板的製作方法
首先取上述實施例與比較例之樹脂組合物與其他配料混合, 製備膠液狀的預浸料。接著以篩網(100~200mesh)過濾預浸料後,以含浸機將玻璃纖維布(型號:2116)含浸於預浸料中,使玻璃纖維布之膠含量控制在50±2%。接著在170℃下烘烤含浸後的玻璃纖維布2-3分鐘,製成半固化片。將6片上述半固化片堆疊,並在雙側放上銅箔後再進行壓合,壓合溫度為210℃,壓合時間為150分鐘,壓合壓力為200psi,製成銅箔基板。上述銅箔基板之性質如第3表所示。
由第3表可知,本發明所提供的聚苯醚樹脂組合物具有良好剝離強度、耐熱性能,及較低的介電常數和介電損耗。與對比例相比較,具有較高的Tg。
本發明的測定方法是按照如下標準: 玻璃化溫度(Tg)測試方法採用美國電子電路成型標準(IPC standard),IPC-TM-650-2.4.25法(TMA法)。
剝離強度(PS)測試採用美國電子電路成型標準(IPC standard),IPC-TM-650-2.4.8法中的“熱應力後”實驗條件,測試金屬蓋層的剝離強度。
浸錫耐熱性測試:使用50mm×50mm的兩面帶銅樣品,浸入288℃的焊錫中,記錄樣品分層起泡的時間。
耐濕熱性能(PCT)試驗:採用壓力鍋蒸煮實驗(PCT),將對厚度約為0.8mm的帶有18μm銅箔的層壓板的銅箔進行蝕刻獲得5cm×5cm的樣品在115℃下乾燥20小時,板材經壓力鍋(0.105MPa)121℃連續蒸煮120分鐘後,浸入288℃焊錫中浸漬30秒鐘,觀察是否分層。
介電常數及介電損耗測試方法:測試樣板的大小(長×寬×厚)為70mm×3.5mm×0.75mm,使用日本AET的儀器,測量2GHZ的介電常數和低介電損耗,使用的方法是依照JIS-Compliant C 2565的共振腔法(Resonant Cavity)。
雖然本揭露已以數個實施例揭露如上,然其並非用以限定本揭露,任何本技術領域中具有通常知識者,在不脫離本揭露之精神和範圍內,當可作任意之更動與潤飾,因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。
Claims (9)
- 一種聚苯醚樹脂組合物,包括:100重量份的聚苯醚樹脂;25至40重量份的共聚物;以及0.01至0.02重量份的反應起始劑,其中該共聚物係(A)(a)單官能基單體、(b1)雙官能基單體、與(c)三官能基單體經自由基聚合而成;(B)(a)單官能基單體與(b2)雙官能基單體經自由基聚合而成;或(C)上述之組合,其中(a)單官能基單體包括苯乙烯、α-甲基苯乙烯、4-甲基苯乙烯、或上述之組合;其中(b1)雙官能基單體包括雙酚A二甲基丙烯酸酯、二乙烯基苯、1,3-二異丙烯基苯、或上述之組合;其中(b2)雙官能基單體包括(b21)鄰苯二甲酸二烯丙酯與(b22)雙酚A二甲基丙烯酸酯、1,3-二異丙烯基苯、與二乙烯基苯中一或多者的組合;以及其中(c)三官能基單體包括三烯丙基異氰脲酸酯、三烯丙基氰脲酸酯、或上述之組合。
- 如申請專利範圍第1項所述之聚苯醚樹脂組合物,其中該聚苯醚樹脂為末端基為甲基丙烯醯氧的聚苯醚樹脂、末端基乙烯苄基醚的聚苯醚樹脂、或上述之組合。
- 如申請專利範圍第1項所述之聚苯醚樹脂組合物,其 中該聚苯醚樹脂的重均分子量為1500-5000,聚合物分散性指數為1.4-1.7。
- 如申請專利範圍第1項所述之聚苯醚樹脂組合物,其中該共聚物的數均分子量為3000-6000。
- 如申請專利範圍第1項所述之聚苯醚樹脂組合物,其中共聚物係(A)(a)單官能基單體、(b1)雙官能基單體、與(c)三官能基單體經自由基聚合而成,且(a)單官能基單體與(b1)雙官能基單體之重量比介於100:40至100:300之間,而(a)單官能基單體與(c)三官能基單體之重量比介於100:40至100:300之間。
- 如申請專利範圍第1項所述之聚苯醚樹脂組合物,其中共聚物係(B)(a)單官能基單體與(b2)雙官能基單體經自由基聚合而成,且(a)單官能基單體與(b2)雙官能基單體之重量比介於100:200至100:600之間。
- 如申請專利範圍第6項所述之聚苯醚樹脂組合物,其中(b21)鄰苯二甲酸二烯丙酯與(b22)雙酚A二甲基丙烯酸酯、1,3-二異丙烯基苯、與二乙烯基苯中一或多者之重量比介於約100:200至100:1100之間。
- 如申請專利範圍第1項所述之聚苯醚樹脂組合物,更包括20-40重量份的阻燃劑。
- 如申請專利範圍第1項所述之聚苯醚樹脂組合物,更包括0.5-1重量份的矽烷偶聯劑與20-40重量份的二氧化矽。
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