CN108659501B - 聚苯醚树脂组合物 - Google Patents
聚苯醚树脂组合物 Download PDFInfo
- Publication number
- CN108659501B CN108659501B CN201710256922.2A CN201710256922A CN108659501B CN 108659501 B CN108659501 B CN 108659501B CN 201710256922 A CN201710256922 A CN 201710256922A CN 108659501 B CN108659501 B CN 108659501B
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- China
- Prior art keywords
- polyphenylene ether
- monomer
- ether resin
- weight
- copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920001955 polyphenylene ether Polymers 0.000 title claims abstract description 72
- 239000011342 resin composition Substances 0.000 title claims abstract description 24
- 239000000178 monomer Substances 0.000 claims abstract description 76
- 229920001577 copolymer Polymers 0.000 claims abstract description 42
- 238000006243 chemical reaction Methods 0.000 claims abstract description 38
- 239000003999 initiator Substances 0.000 claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 230000001588 bifunctional effect Effects 0.000 claims abstract description 13
- 238000010526 radical polymerization reaction Methods 0.000 claims abstract description 8
- 150000003254 radicals Chemical class 0.000 claims abstract description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 36
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 34
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 24
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 22
- 239000003063 flame retardant Substances 0.000 claims description 22
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 21
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 claims description 19
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 16
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical compound C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 claims description 16
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims description 15
- IBVPVTPPYGGAEL-UHFFFAOYSA-N 1,3-bis(prop-1-en-2-yl)benzene Chemical compound CC(=C)C1=CC=CC(C(C)=C)=C1 IBVPVTPPYGGAEL-UHFFFAOYSA-N 0.000 claims description 14
- 239000004641 Diallyl-phthalate Substances 0.000 claims description 13
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims description 6
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- -1 methacryloyloxy Chemical group 0.000 claims description 3
- AZDCYKCDXXPQIK-UHFFFAOYSA-N ethenoxymethylbenzene Chemical compound C=COCC1=CC=CC=C1 AZDCYKCDXXPQIK-UHFFFAOYSA-N 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 138
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 39
- 235000019400 benzoyl peroxide Nutrition 0.000 description 39
- 239000004342 Benzoyl peroxide Substances 0.000 description 38
- 238000002360 preparation method Methods 0.000 description 26
- 239000007787 solid Substances 0.000 description 22
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 18
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 description 17
- 239000000843 powder Substances 0.000 description 17
- 239000005350 fused silica glass Substances 0.000 description 15
- 239000012299 nitrogen atmosphere Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 230000009477 glass transition Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
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- 238000004132 cross linking Methods 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
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- 230000000694 effects Effects 0.000 description 2
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- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- CWJHMZONBMHMEI-UHFFFAOYSA-N 1-tert-butylperoxy-3-propan-2-ylbenzene Chemical compound CC(C)C1=CC=CC(OOC(C)(C)C)=C1 CWJHMZONBMHMEI-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 229920001207 Noryl Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- YUWBVKYVJWNVLE-UHFFFAOYSA-N [N].[P] Chemical compound [N].[P] YUWBVKYVJWNVLE-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
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Abstract
聚苯醚树脂组合物,包括:100重量份的聚苯醚树脂;25至40重量份的共聚物;以及0.01至0.02重量份的反应起始剂。共聚物系(A)(a)单官能基单体、(b1)双官能基单体、与(c)三官能基单体经自由基聚合而成;(B)(a)单官能基单体与(b2)双官能基单体经自由基聚合而成;或(C)上述的组合。
Description
技术领域
本发明关于聚苯醚树脂组合物。
背景技术
目前高频技术已进入日常生活,随着电子传输速度的提高,对频率的要求也越来越高,因此对电子材料具有更高的要求。此类材料除了需具有优异加工性与力学性能,还需具有低介电常数(Dk)、低介电损耗(Df)、与优异的耐热性。聚苯醚是高性能的树脂,由于其具有良好对称的分子链、较小的分子间作用力、与较高的芳基比例,因此具有优异的介电特性如低介电常数与低介电损耗,可满足高频应用对材料介电性能的要求。同时,聚苯醚还具有较高玻璃化转变温度、低吸水率、与优异的冲击韧性等,在高频层压板材料中具有广阔的应用前景。然而大分子量(>10000)的聚苯醚树脂具有溶解性差、与环氧树脂兼容性不佳、及熔融黏度高等问题,造成制作的层压板出现耐热性不足、黏结性低、与尺寸稳定性差等现象,严重影响其使用可靠性。
为克服大分子量聚苯醚树脂的问题,可采用低分子量的聚苯醚和固化剂三烯丙基异氰脲酸酯(TAIC)形成低介电性的聚苯醚树脂组合物。TAIC的沸点较低,在使用过程中容易挥发,且聚苯醚树脂组合物还具有玻璃转换温度较低的缺点。玻璃转换温度较低会影响铜箔基板的耐热性与使用寿命。
苯乙烯(及其衍生物)以及二乙烯基类单体的化学结构比TAIC或三烯丙基氰脲酸酯(TAC)具有更低的极性,同时可作为自由基聚合单体,所以这两类单体可作为聚苯醚树脂的交联成分。但这两类单体的挥发性,在半固化片的制备过程中会导致胶化时间短,且压制形成的板材其玻璃化转化温度不稳定。
综上所述,目前亟需新的交联剂或固化剂搭配聚苯醚树脂以克服前述问题。
发明内容
本发明一实施例提供的聚苯醚树脂组合物,包括:100重量份的聚苯醚树脂;25至40重量份的共聚物;以及0.01至0.02重量份的反应起始剂,其中共聚物系(A)(a)单官能基单体、(b1)双官能基单体、与(c)三官能基单体经自由基聚合而成;(B)(a)单官能基单体与(b2)双官能基单体经自由基聚合而成;或(C)上述的组合,其中(a)单官能基单体包括苯乙烯、α-甲基苯乙烯、4-甲基苯乙烯、或上述的组合;其中(b1)双官能基单体包括双酚A二甲基丙烯酸酯、二乙烯基苯、1,3-二异丙烯基苯、或上述的组合;其中(b2)双官能基单体包括(b21)邻苯二甲酸二烯丙酯与(b22)双酚A二甲基丙烯酸酯、1,3-二异丙烯基苯、与二乙烯基苯中一或多者的组合;以及其中(c)三官能基单体包括三烯丙基异氰脲酸酯、三烯丙基氰脲酸酯、或上述的组合。
具体实施方式
本发明一实施例提供的聚苯醚树脂组合物,包括:100重量份的聚苯醚树脂;25至40重量份的共聚物;以及0.01至0.02重量份的反应起始剂。上述聚苯醚树脂组合物可进一步固化,即反应起始剂使聚苯醚树脂与共聚物交联以形成产品。若共聚物的比例过高,则因所得树脂组合物流动性较差而造成操作性不佳。若共聚物的比例过低,则聚苯醚树脂含量过高而造成交联密度下降。若反应起始剂的比例过低,则会降低反应物的交联密度,进而降低压合形成的层压板的Tg。若反应起始剂的比例过高,则反应速率过快而不易操作。
在一实施例中,聚苯醚树脂为末端为甲基丙烯酰氧基的聚苯醚树脂、末端乙烯苄基醚的聚苯醚树脂、或上述的组合。在一实施例中,聚苯醚树脂的重均分子量为1500-5000,而聚合物分散性指数(polymer dispersity index,PDI)为1.4-1.7。若聚苯醚树脂的重均分子量过高,则树脂组合物的黏度过高,含浸不易,压合时,流动性不足,易造成层与层之间黏着性不好,造成干板。若聚苯醚树脂的重均分子量过低,则制成的层压板介电性能下降。若聚苯醚树脂的PDI过高,则会影响介电性能和树脂流动性。
在一实施例中,共聚物系(A)(a)单官能基单体、(b1)双官能基单体、和(c)三官能基单体经自由基聚合而成、(B)(a)单官能基单体与(b2)双官能基单体经自由基聚合而成、或(C)上述的组合。此聚合过程通过分子量调节剂,可控制共聚物的数均分子量在3000-6000之间,以避免单体挥发并保证共聚物的流动性。
在一实施例中,上述共聚物的制备方法可为在氮气环境下混合上述单体、反应起始剂、溶剂、与分子量调节剂,在60-80℃反应4-6小时。反应起始剂占单体总重的0.1-3wt%,溶剂(如甲苯或二甲苯)用量可控制单体浓度介于30-50wt%,且分子量调节剂(如α-甲基苯乙烯二聚体)与单体总量的当量比为1:5至1:20之间。
当共聚物系(A)(a)单官能基单体、(b1)双官能基单体、和(c)三官能基单体经自由基聚合而成时,(a)单官能基单体包括苯乙烯、α-甲基苯乙烯、4-甲基苯乙烯、或上述的组合。(b1)双官能基单体包括双酚A二甲基丙烯酸酯、二乙烯基苯、1,3-二异丙烯基苯、或上述的组合。(c)三官能基单体包括三烯丙基异氰脲酸酯(TAIC)、三烯丙基氰脲酸酯(TAC)、或上述的组合。在此实施例中,(a)单官能基单体与(b1)双官能基单体的重量比介于100:40至100:300之间,而(a)单官能基单体与(c)三官能基单体的重量比介于100:40至100:300之间。若(b1)双官能基单体的比例过高,则因烯丙基单体不能相互自由基聚合导致三官能基单体比较难以实现聚合。若(b1)双官能基单体的比例过低,则产品的聚合效果会变差且影响介电性能。若(c)三官能基单体的比例过高,则会影响聚合效果。若(c)三官能基单体的比例过低,则交联密度下降且树脂流动性变差。
当共聚物系(B)(a)单官能基单体与(b2)双官能基单体经自由基聚合而成时,(a)单官能基单体包括苯乙烯、α-甲基苯乙烯、4-甲基苯乙烯、或上述的组合,且(b2)双官能基单体包括(b21)邻苯二甲酸二烯丙酯与(b22)双酚A二甲基丙烯酸酯、1,3-二异丙烯基苯、与二乙烯基苯中一或多者的组合。在此实施例中,(a)单官能基单体与(b2)双官能基单体的重量比介于100:200至100:600之间。若(b2)双官能基单体的比例过高,则聚合过程较为难以控制。若(b2)双官能基单体的比例过低,则交联密度较小影响层压板的玻璃转化温度。在一实施例中,(b21)邻苯二甲酸二烯丙酯与(b22)双酚A二甲基丙烯酸酯、1,3-二异丙烯基苯、与二乙烯基苯中一或多者的重量比介于100:200至100:1100之间。若(b21)邻苯二甲酸二烯丙酯的比例过低,则树脂组合物流动性变差。若(b21)邻苯二甲酸二烯丙酯的比例过高,则树脂组合物压合成层压板的耐湿热性能变差。
在一实施例中,反应起始剂可为过氧化二苯甲酰(BPO)、过氧化二异丙苯、过氧化二叔丁基、双(第三丁基过氧化间异丙基)苯、或上述的组合。反应起始剂可在相应温度梯段有效引发聚合,保证半固化片和对应的电路板材的物理化学性质满足使用要求。
在一实施例中,上述聚苯醚树脂组合物可进一步包含20-40重量份的阻燃剂。阻燃剂并不限定于特定种类,只要能满足阻燃要求即可。举例来说,可采用溴系阻燃剂如十溴二苯乙烷等,或是磷氮系阻燃剂如环状苯氧基磷腈化合物等。
在一实施例中,上述聚苯醚树脂组合物可进一步包含0.5-1重量份的硅烷偶联剂与20-40重量份的二氧化硅。上述硅烷偶联剂可为(3-环氧丙氧丙基)三甲氧基硅烷、(3-环氧丙氧丙基)三乙氧基硅烷、3-(甲基丙烯酰氧)丙基三甲氧基硅烷、或上述的组合。硅烷偶联剂可在无机物质和有机物质的接口之间架起“分子桥”,使两种性质悬殊的材料连接在一起,以提高复合材料的性能和增加粘接强度。可优先采用3-(甲基丙烯酰氧)丙基三甲氧基硅烷作为硅烷偶联剂。在聚苯醚树脂组合物中添加低介电常数的二氧化硅(如熔融型石英粉),有助于降低树脂固化物的热膨胀系数并降低成本。
为了让本公开的上述和其他目的、特征、和优点能更明显易懂,下文特举数实施例,作详细说明如下:
实施例
下述所用的药品名称及来源列举如下,但不限于所列药品:
末端为甲基丙烯酰氧基的聚苯醚树脂:购自SABIC所生产的NORYL RESIN SA9000。
阻燃剂:购自ALBEMARLE ASANO公司所生产的SAYTEX 8010,溴含量82.3%。
硅烷偶联剂:购自EVONIK公司所生产的Dynasylan MEMO。
熔融型石英粉:购自SIBELCO公司所生产的MEGASIL 525。
E型2116玻璃纤维布购自台玻集团
共聚物的制备
制备例1
在氮气环境下混合25g的苯乙烯,10g的二乙烯基苯、10g的三烯丙基异氰脲酸酯(TAIC)、0.5g的过氧化苯甲酰(BPO)反应起始剂、5g的α-甲基苯乙烯二聚体、以及50g的甲苯,在60℃反应6小时,得到固含量50%的共聚物。
制备例2
在氮气环境下混合5g的苯乙烯,15g的双酚A二甲基丙烯酸酯、15g的TAIC、0.5g的过氧化苯甲酰(BPO)反应起始剂、5g的α-甲基苯乙烯二聚体、以及40g的甲苯,在70℃反应5小时,得到固含量50%的共聚物。
制备例3
在氮气环境下混合15g的苯乙烯,15g的二乙烯基苯、15g的TAIC、0.5g的过氧化苯甲酰(BPO)反应起始剂、5g的α-甲基苯乙烯二聚体、以及50g的甲苯,在80℃反应4小时,得到固含量50%的共聚物。
制备例4
在氮气环境混合5g的苯乙烯、5g的α-甲基苯乙烯,5g的双酚A二甲基丙烯酸酯、25g的TAIC、0.5g的过氧化苯甲酰(BPO)反应起始剂、3.5g的α-甲基苯乙烯二聚体、以及40g的甲苯,在80℃反应4小时,得到固含量50%的共聚物。
制备例5
在氮气环境下混合10g的苯乙烯、20g的邻苯二甲酸二烯丙酯、10g的双酚A二甲基丙烯酸酯、30g的1,3-二异丙烯基苯、0.5g的过氧化苯甲酰(BPO)反应起始剂、5g的α-甲基苯乙烯二聚体、以及75g的甲苯,在80℃反应4小时,得到固含量50%的共聚物。
制备例6
在氮气环境下混合12.5g的苯乙烯,2.5g的邻苯二甲酸二烯丙酯,5g的双酚A二甲基丙烯酸酯、17.5g的1,3-二异丙烯基苯,5g的二乙烯基苯,0.25g的过氧化苯甲酰(BPO)反应起始剂、2.5g的α-甲基苯乙烯二聚体、以及45g的甲苯,在80℃反应4小时,得到固含量50%的共聚物。
制备例7
在氮气环境下混合15g的苯乙烯,5g的邻苯二甲酸二烯丙酯,22.5g的1,3-二异丙烯基苯,5g的二乙烯基苯,0.25g的过氧化苯甲酰(BPO)反应起始剂、2.5g的α-甲基苯乙烯二聚体、以及50g的甲苯,在80℃反应4小时,得到固含量50%的共聚物。
比较制备例1
在氮气环境下混合10g的苯乙烯、10g的双酚A二甲基丙烯酸酯、30g的1,3-二异丙烯基苯、0.5g的过氧化苯甲酰(BPO)反应起始剂、5g的α-甲基苯乙烯二聚体,以及55g甲苯,在80℃反应4小时,得到固含量50%的共聚物。
比较制备例2
在氮气环境下混合5g的苯乙烯,20g的双酚A二甲基丙烯酸酯、15g的TAIC、0.5g的过氧化苯甲酰(BPO)反应起始剂、5g的α-甲基苯乙烯二聚体、以及45g的甲苯,在70℃反应5小时,得到固含量50%的共聚物。
比较制备例3
在氮气环境下混合10g的苯乙烯、25g的邻苯二甲酸二烯丙酯、15g的双酚A二甲基丙烯酸酯、15g的1,3-二异丙烯基苯、10g的二乙烯基苯、0.5g的过氧化苯甲酰(BPO)反应起始剂、5g的α-甲基苯乙烯二聚体、以及75g的甲苯,在80℃反应4小时,得到固含量50%的共聚物。
比较制备例4
在氮气环境下混合12g的苯乙烯、15g的邻苯二甲酸二烯丙酯、2.5g的二乙烯基苯、0.5g的过氧化苯甲酰(BPO)反应起始剂、5g的α-甲基苯乙烯二聚体、以及35g的甲苯,在80℃反应4小时,得到固含量50%的共聚物。
第1表
表1续
实施例1
取100g的聚苯醚(SA9000)与100g甲苯混合将聚苯醚完全溶解后,再加入50g的制备例1制备的共聚物(固含量50%)、20g的阻燃剂(SAYTEX 8010)、0.5g的硅烷偶联剂(Dynasylan MEMO)、20g的熔融型石英粉(MEGASIL 525)、0.02g的反应起始剂(BPO)、与100g的甲苯混合均匀。
实施例2
取100g的聚苯醚(SA9000)与100g甲苯混合将聚苯醚完全溶解后,再加入60g的制备例2制备的共聚物(固含量50%)、40g的阻燃剂(SAYTEX 8010)、1g的硅烷偶联剂(Dynasylan MEMO)、40g的熔融型石英粉(MEGASIL 525)、0.02g的反应起始剂(BPO)、与100g的甲苯混合均匀。
实施例3
取100g的聚苯醚(SA9000)与100g甲苯混合将聚苯醚完全溶解后,再加入70g的制备例3制备的共聚物(固含量50%)、32g的阻燃剂(SAYTEX 8010)、1g的硅烷偶联剂(Dynasylan MEMO)、32g的熔融型石英粉(MEGASIL 525)、0.02g的反应起始剂(BPO)、与100g的甲苯混合均匀。
实施例4
取100g的聚苯醚(SA9000)与100g甲苯混合将聚苯醚完全溶解后,再加入80g的制备例4制备的共聚物(固含量50%)、32g的阻燃剂(SAYTEX 8010)、1g的硅烷偶联剂(Dynasylan MEMO)、32g的熔融型石英粉(MEGASIL 525)、0.02g的反应起始剂(BPO)、与100g的甲苯混合均匀。
实施例5
取100g的聚苯醚(SA9000)与100g甲苯混合将聚苯醚完全溶解后,再加入75g的制备例5制备的共聚物(固含量50%)、32g的阻燃剂(SAYTEX 8010)、1g的硅烷偶联剂(Dynasylan MEMO)、32g的熔融型石英粉(MEGASIL 525)、0.02g的反应起始剂(BPO)、与100g的甲苯混合均匀。
实施例6
取100g的聚苯醚(SA9000)与100g甲苯混合将聚苯醚完全溶解后,再加入50g的制备例6制备的共聚物(固含量50%)、35g的阻燃剂(SAYTEX 8010)、1g的硅烷偶联剂(Dynasylan MEMO)、35g的熔融型石英粉(MEGASIL 525)、0.02g的反应起始剂(BPO)、与100g的甲苯混合均匀。
实施例7
取100g的聚苯醚(SA9000)与100g甲苯混合将聚苯醚完全溶解后,再加入80g的制备例7制备的共聚物(固含量50%)、32g的阻燃剂(SAYTEX 8010)、1g的硅烷偶联剂(Dynasylan MEMO)、32g的熔融型石英粉(MEGASIL 525)、0.02g的反应起始剂(BPO)、与100g的甲苯混合均匀。
比较例1
100g的聚苯醚(SA9000)与100g甲苯混合将聚苯醚完全溶解后,再加入40g的TAIC与40g甲苯的混合液、32g的阻燃剂(SAYTEX 8010)、1g的硅烷偶联剂(Dynasylan MEMO)、32g的熔融型石英粉(MEGASIL 525)、0.02g的反应起始剂(BPO)、与100g的甲苯混合均匀。
比较例2
100g的聚苯醚(SA9000)与100g甲苯混合将聚苯醚完全溶解后,再加入40g的二乙烯基苯与40g甲苯的混合液、32g的阻燃剂(SAYTEX 8010)、1g的硅烷偶联剂(DynasylanMEMO)、32g的熔融型石英粉(MEGASIL 525)、0.02g的反应起始剂(BPO)、与100g的甲苯混合均匀。在后续半固化片制作过程中170℃烘烤时二乙烯基苯挥发,导致无法继续操作。
比较例3
取100g的聚苯醚(SA9000)与100g甲苯混合将聚苯醚完全溶解后,再加入80g的比较制备例1制备的共聚物(固含量50%)、32g的阻燃剂(SAYTEX8010)、1g的硅烷偶联剂(Dynasylan MEMO)、32g的熔融型石英粉(MEGASIL525)、0.02g的反应起始剂(BPO)、与100g的甲苯混合均匀。
比较例4
取100g的聚苯醚(SA9000)与100g甲苯混合将聚苯醚完全溶解后,再加入80g的比较制备例2制备的共聚物(固含量50%)、32g的阻燃剂(SAYTEX8010)、1g的硅烷偶联剂(Dynasylan MEMO)、32g的熔融型石英粉(MEGASIL525)、0.02g的反应起始剂(BPO)、与100g的甲苯混合均匀。
比较例5
取100g的聚苯醚(SA9000)与100g甲苯混合将聚苯醚完全溶解后,再加入80g的比较制备例3制备的共聚物(固含量50%)、32g的阻燃剂(SAYTEX8010)、1g的硅烷偶联剂(Dynasylan MEMO)、32g的熔融型石英粉(MEGASIL525)、0.02g的反应起始剂(BPO)、与100g的甲苯混合均匀。
比较例6
取100g的聚苯醚(SA9000)与100g甲苯混合将聚苯醚完全溶解后,再加入80g的比较制备例4制备的共聚物(固含量50%)、32g的阻燃剂(SAYTEX8010)、1g的硅烷偶联剂(Dynasylan MEMO)、32g的熔融型石英粉(MEGASIL525)、0.02g的反应起始剂(BPO)、与100g的甲苯混合均匀。
比较例7(单体仅混合而未聚合)
100g的聚苯醚(SA9000)与100g甲苯混合将聚苯醚完全溶解后,再加入50g的制备例1所用单体混合液(12.5g的苯乙烯,5g的二乙烯基苯、5g的TAIC、2.5g的α-甲基苯乙烯二聚体,与25g甲苯的混合液)、20g的阻燃剂(SAYTEX 8010)、0.5g的硅烷偶联剂(DynasylanMEMO)、20g的熔融型石英粉(MEGASIL 525)、0.02g的反应起始剂(BPO)、与100g的甲苯混合均匀。
比较例8(单体仅混合而未聚合)
100g的聚苯醚(SA9000)与100g甲苯混合将聚苯醚完全溶解后,再加入75g的制备例5所用单体混合液(5g的苯乙烯、10g的邻苯二甲酸二烯丙酯、5g的双酚A二甲基丙烯酸酯、15g的1,3-二异丙烯基苯、2.5g的α-甲基苯乙烯二聚体,与37.5g甲苯的混合液)、32g的阻燃剂(SAYTEX 8010)、1g的硅烷偶联剂(Dynasylan MEMO)、32g的熔融型石英粉(MEGASIL525)、0.02g的反应起始剂(BPO)、与100g的甲苯混合均匀。
第2表
第2表(续)
铜箔基板的制作方法
首先取上述实施例与比较例的树脂组合物与其他配料混合,制备胶液状的预浸料。接着以筛网(100~200mesh)过滤预浸料后,以含浸机将玻璃纤维布(型号:2116)含浸于预浸料中,使玻璃纤维布的胶含量控制在50±2%。接着在170℃下烘烤含浸后的玻璃纤维布2-3分钟,制成半固化片。将6片上述半固化片堆栈,并在双侧放上铜箔后再进行压合,压合温度为210℃,压合时间为150分钟,压合压力为200psi,制成铜箔基板。上述铜箔基板的性质如第3表所示。
第3表
(延续第3表)
由第3表可知,本发明所提供的聚苯醚树脂组合物具有良好剥离强度、耐热性能,及较低的介电常数和介电损耗。与对比例相比较,具有较高的Tg。
本发明的测定方法是按照如下标准:
玻璃化温度(Tg)测试方法采用美国电子电路成型标准(IPC standard),IPC-TM-650-2.4.25法(TMA法)。
剥离强度(PS)测试采用美国电子电路成型标准(IPC standard),IPC-TM-650-2.4.8法中的“热应力后”实验条件,测试金属盖层的剥离强度。
浸锡耐热性测试:使用50mm×50mm的两面带铜样品,浸入288℃的焊锡中,记录样品分层起泡的时间。
耐湿热性能(PCT)试验:采用高压锅蒸煮实验(PCT),将对厚度约为0.8mm的带有18μm铜箔的层压板的铜箔进行蚀刻获得5cm×5cm的样品在115℃下干燥20小时,板材经高压锅(0.105MPa)121℃连续蒸煮120分钟后,浸入288℃焊锡中浸渍30秒钟,观察是否分层。
介电常数及介电损耗测试方法:测试样板的大小(长×宽×厚)为70mm×3.5mm×0.75mm,使用日本AET的仪器,测量2GHZ的介电常数和低介电损耗,使用的方法是依照JIS-Compliant C 2565的共振腔法(Resonant Cavity)。
虽然本公开已以数个实施例公开如上,然其并非用以限定本公开,任何本领域技术人员,在不脱离本公开的精神和范围内,当可作任意的更动与润饰,因此本公开的保护范围当视权利要求书所界定者为准。
Claims (6)
1.一种聚苯醚树脂组合物,包括:
100重量份的聚苯醚树脂,其中该聚苯醚树脂为末端基为甲基丙烯酰氧的聚苯醚树脂、末端基为乙烯苄基醚的聚苯醚树脂、或上述的组合,该聚苯醚树脂的重均分子量为1500-5000且聚合物分散性指数为1.4-1.7;
25至40重量份的共聚物,其中该共聚物的数均分子量为3000-6000;以及
0.01至0.02重量份的反应起始剂,
其中该共聚物系(A)(a)单官能基单体、(b1)双官能基单体、与(c)三官能基单体经自由基聚合而成;(B)(a)单官能基单体与(b2)双官能基单体经自由基聚合而成;或(C)上述的组合,
其中(a)单官能基单体包括苯乙烯、α-甲基苯乙烯、4-甲基苯乙烯、或上述的组合;
其中(b1)双官能基单体包括双酚A二甲基丙烯酸酯、二乙烯基苯、1,3-二异丙烯基苯、或上述的组合;
其中(b2)双官能基单体包括(b21)邻苯二甲酸二烯丙酯与(b22)双酚A二甲基丙烯酸酯、1,3-二异丙烯基苯、与二乙烯基苯中一或多者的组合;以及
其中(c)三官能基单体包括三烯丙基异氰脲酸酯、三烯丙基氰脲酸酯、或上述的组合。
2.根据权利要求1所述的聚苯醚树脂组合物,其中共聚物系(A)(a)单官能基单体、(b1)双官能基单体、与(c)三官能基单体经自由基聚合而成,且(a)单官能基单体与(b1)双官能基单体的重量比介于100:40至100:300之间,而(a)单官能基单体与(c)三官能基单体的重量比介于100:40至100:300之间。
3.根据权利要求1所述的聚苯醚树脂组合物,其中共聚物系(B)(a)单官能基单体与(b2)双官能基单体经自由基聚合而成,且(a)单官能基单体与(b2)双官能基单体的重量比介于100:200至100:600之间。
4.根据权利要求3所述的聚苯醚树脂组合物,其中(b21)邻苯二甲酸二烯丙酯与(b22)双酚A二甲基丙烯酸酯、1,3-二异丙烯基苯、与二乙烯基苯中一或多者的重量比介于100:200至100:1100之间。
5.根据权利要求1所述的聚苯醚树脂组合物,还包括20-40重量份的阻燃剂。
6.根据权利要求1所述的聚苯醚树脂组合物,还包括0.5-1重量份的硅烷偶联剂与20-40重量份的二氧化硅。
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