KR880700005A - 폴리이미드 및 폴리이미드로 이루어진 내열성접착제 - Google Patents
폴리이미드 및 폴리이미드로 이루어진 내열성접착제Info
- Publication number
- KR880700005A KR880700005A KR870700370A KR870700370A KR880700005A KR 880700005 A KR880700005 A KR 880700005A KR 870700370 A KR870700370 A KR 870700370A KR 870700370 A KR870700370 A KR 870700370A KR 880700005 A KR880700005 A KR 880700005A
- Authority
- KR
- South Korea
- Prior art keywords
- group
- resistant adhesive
- compound
- polymer
- phosphorus polymer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (10)
- 식(식중 Y는 직결, 탄소수 1내지 10의 2가의 탄화수소기, 6불소화된 이소프로필리덴기, 카르보닐기, 티오기, 술피닐기, 술포닐기 또는 옥시드로 이루어진 군으로부터 선택된 기를표시하며,를 표시하고, R은 탄소수 2이상의 지방족기, 환식지방족기, 단환식 방향족기, 죽합다환식방향족기, 방향족기가 직접 또는 가교원에 의해 상호연결된 비축합다환식방향족기로 이루어진 군으로부터 선택된 4가의 기를 표시한다.)로 표시되는 반복단위를 가진 중합체.
- 제1항에 있어서, Y가 티오기 및 Z가인 중합체.
- 제1항에 있어서, Y가 직결, Z가인 중합체.
- 제1항에 있어서, Y가 직결, Z가및 R가인 중합체.
- 제1항에 있어서, Y가 이소프로필리덴기, Z가및 R가인 중합체,
- 식(식중 Y는 직결, 탄소수 1내지 10의 2가의 탄화수소기, 6불소화된 이소프로필리덴기, 카르보닐기, 티오기, 술피닐기, 술포닐기 또는 옥시드로 이루어진 군으로부터 선택된 기를 표시하며,은 표시하며, R은 탄소수 2이상의 지방족기, 환식지방족기, 단환식 방향족기, 축합다환식방향족기, 방향족기가직접 또는 가교원에 의해 상호연결된 비축합다환식방향족기로 이루어진 군으로부터 선택된 4가의기를 표시한다.)로 표시되는 반복단위를 가진 중합체로 이루어진 내열성 접착제.
- 제6항에 있어서, Y가 티오기 및 Z가인 중합체로 이루어진 내열성 접착제.
- 제6항에 있어서, Y가 직결, Z가인 중합체로 이루어진 내열성 접착제.
- 제6항에 있어서, Y가 직결, Z가및 4가인 중합체로 이루어진 내열성 접착제.
- 제6항에 있어서, Y가 이소프로필리덴기, Z가및 R가인 중합체로 이루어진 내열성 접착제.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60186610A JPS6248782A (ja) | 1985-08-27 | 1985-08-27 | 耐熱性接着剤 |
JP186610 | 1985-08-27 | ||
JP60205283A JP2537179B2 (ja) | 1985-09-19 | 1985-09-19 | ポリイミドおよびポリイミドよりなる耐熱性接着剤 |
JP224812 | 1985-10-11 | ||
JP60224812A JP2587810B2 (ja) | 1985-10-11 | 1985-10-11 | ポリイミドよりなる耐熱性接着剤 |
JP046369 | 1986-03-05 | ||
JP46369 | 1986-03-05 | ||
JP61046369A JP2537188B2 (ja) | 1986-03-05 | 1986-03-05 | ポリイミド |
PCT/JP1986/000335 WO1987001378A1 (en) | 1985-08-27 | 1986-06-30 | Polyimides and heat-resistant adhesives comprising the same |
JP205283 | 1986-09-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880700005A true KR880700005A (ko) | 1988-02-15 |
KR910000868B1 KR910000868B1 (ko) | 1991-02-11 |
Family
ID=27461862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019870700370A KR910000868B1 (ko) | 1985-08-27 | 1986-06-30 | 내열성접착제용 폴리이미드의 제조방법 및 이것을 이용한 접착방법 |
Country Status (7)
Country | Link |
---|---|
US (3) | US4847349A (ko) |
EP (2) | EP0235294B1 (ko) |
KR (1) | KR910000868B1 (ko) |
AU (1) | AU580183B2 (ko) |
CA (1) | CA1268592A (ko) |
DE (1) | DE3650656T2 (ko) |
WO (1) | WO1987001378A1 (ko) |
Families Citing this family (81)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0235294B1 (en) * | 1985-08-27 | 1997-11-12 | MITSUI TOATSU CHEMICALS, Inc. | Polyimides and heat-resistant adhesives comprising the same |
US5278276A (en) * | 1985-08-27 | 1994-01-11 | Mitsui Toatsu Chemicals, Incorporated | Polyimide and high-temperature adhesive of polyimide |
JP2585552B2 (ja) * | 1986-11-19 | 1997-02-26 | 三井東圧化学株式会社 | ポリイミド |
EP0282254B1 (en) * | 1987-03-09 | 1993-06-16 | Chisso Corporation | Diamino compounds and liquid crystal aligning films |
US5288843A (en) * | 1987-05-20 | 1994-02-22 | Mitsui Toatsu Chemicals, Inc. | Polyimides, process for the preparation thereof and polyimide resin compositions |
JP2594273B2 (ja) * | 1987-05-20 | 1997-03-26 | エヌティエヌ株式会社 | 耐熱性樹脂組成物 |
DE3888869T2 (de) * | 1987-06-01 | 1994-09-22 | Mitsui Toatsu Chemicals | Polyimidharz-Zusammensetzung. |
DE3885796T2 (de) * | 1987-06-05 | 1994-05-05 | Mitsui Toatsu Chemicals | Polyimid Harzzubereitung. |
US4931531A (en) * | 1987-07-02 | 1990-06-05 | Mitsui Toatsu Chemicals, Incorporated | Polyimide and high-temperature adhesive thereof |
KR910008340B1 (ko) * | 1987-11-05 | 1991-10-12 | 미쯔이도오아쯔가가꾸 가부시기가이샤 | 폴리이미드의 제조법 및 그것으로 이루어진 복합재료 |
US5098627A (en) * | 1987-12-15 | 1992-03-24 | Ntn-Rulon Industries Company Ltd. | Method for producing a paper-releasing guide-claw of copying machine |
JP2574162B2 (ja) * | 1988-01-06 | 1997-01-22 | チッソ株式会社 | 低融点ポリイミド共重合体 |
CN1042168A (zh) * | 1988-09-26 | 1990-05-16 | M&T化学有限公司 | 聚酰亚胺薄膜模片固定粘合剂 |
JPH0794555B2 (ja) * | 1988-10-20 | 1995-10-11 | 三井東圧化学株式会社 | ポリイミドシートの製造方法 |
CA2000927C (en) * | 1988-10-20 | 1994-09-13 | Masumi Saruwatari | Insulated wire and production process of the insulated wire |
DE68927376D1 (de) * | 1988-12-27 | 1996-11-28 | Mitsui Toatsu Chemicals | Verfahren zur Herstellung einer Buchse für eine integrierte Schaltung |
EP0376592B1 (en) * | 1988-12-28 | 1995-02-08 | MITSUI TOATSU CHEMICALS, Inc. | Polyimide foam |
EP0376892A3 (de) * | 1988-12-30 | 1991-07-10 | Ciba-Geigy Ag | Vernetzbare Polyamide, Poylamid-amidsäuren, Polyamidsäuren sowie die zum entsprechenden Polyamidimid oder Polyimid cyclisierten Derivate |
US5206339A (en) * | 1989-04-05 | 1993-04-27 | Mitsui Toatsu Chemicals, Inc. | Extrusion process of polyimide and polyimide pellet used for the process |
US5069848A (en) * | 1989-04-05 | 1991-12-03 | Mitsui Toatsu Chemicals, Inc. | Extrusion process of polyimide and polyimide pellet used for the process |
US5260407A (en) * | 1989-07-17 | 1993-11-09 | Mitsui Toatsu Chemicals, Incorporated | Polyimide film and preparation process of the film |
US5514748A (en) * | 1989-07-30 | 1996-05-07 | Mitsui Toatsu Chemicals, Inc. | Polyimide based resin composition comprising cured phenolic resins and liquid crystal polymers |
US5312866A (en) * | 1989-11-30 | 1994-05-17 | Mitsui Toatsu Chemicals, Incorporated | Polyimide based resin composition |
KR920701318A (ko) * | 1989-12-22 | 1992-08-11 | 사와무라 하루오 | 폴리이미드 성형품 |
US5212279A (en) * | 1990-10-22 | 1993-05-18 | Hitachi Chemical Co., Ltd. | Hot-melt adhesive and its use in polyimide film and printed circuit board |
DE69209172T2 (de) * | 1991-01-21 | 1996-10-17 | Mitsui Toatsu Chemicals | Bisimidderivate, daraus hergestellte polyimidharze sowie carbonfaser-verstärkte polyimidharze |
DE69201139T2 (de) * | 1991-02-21 | 1995-06-22 | Mitsui Toatsu Chemicals | Hitzebeständiger Polyimid Klebstoff. |
US5406124A (en) * | 1992-12-04 | 1995-04-11 | Mitsui Toatsu Chemicals, Inc. | Insulating adhesive tape, and lead frame and semiconductor device employing the tape |
US5508377A (en) * | 1993-12-21 | 1996-04-16 | Mitsui Toatsu Chemicals, Inc. | Polyimide |
US5484880A (en) * | 1993-12-21 | 1996-01-16 | Mitsui Toatsu Chemicals, Inc. | Polyimide |
KR100572646B1 (ko) * | 1998-07-17 | 2006-04-24 | 제이에스알 가부시끼가이샤 | 폴리이미드계 복합체 및 이 복합체를 사용한 전자 부품, 및 폴리이미드계 수성 분산액 |
US6080832A (en) * | 1998-09-10 | 2000-06-27 | Industrial Technology Research Institute | Low-pretilt alignment layer material |
US6399958B1 (en) * | 1998-12-09 | 2002-06-04 | Advanced Micro Devices, Inc. | Apparatus for visual inspection during device analysis |
US6103806A (en) * | 1998-12-21 | 2000-08-15 | Mitsui Chemicals, Inc. | Polyimide resin composition |
CN1164652C (zh) * | 2000-03-13 | 2004-09-01 | 三井化学株式会社 | 聚酰亚胺的制备方法 |
KR100638623B1 (ko) * | 2001-09-04 | 2006-10-26 | 미쓰이 가가쿠 가부시키가이샤 | 신규한 방향족 디아민 및 그의 폴리이미드 |
US7906722B2 (en) * | 2005-04-19 | 2011-03-15 | Palo Alto Research Center Incorporated | Concentrating solar collector with solid optical element |
US20070107773A1 (en) * | 2005-11-17 | 2007-05-17 | Palo Alto Research Center Incorporated | Bifacial cell with extruded gridline metallization |
US7799371B2 (en) * | 2005-11-17 | 2010-09-21 | Palo Alto Research Center Incorporated | Extruding/dispensing multiple materials to form high-aspect ratio extruded structures |
US7765949B2 (en) * | 2005-11-17 | 2010-08-03 | Palo Alto Research Center Incorporated | Extrusion/dispensing systems and methods |
US7855335B2 (en) * | 2006-04-26 | 2010-12-21 | Palo Alto Research Center Incorporated | Beam integration for concentrating solar collector |
US7638708B2 (en) * | 2006-05-05 | 2009-12-29 | Palo Alto Research Center Incorporated | Laminated solar concentrating photovoltaic device |
US7851693B2 (en) * | 2006-05-05 | 2010-12-14 | Palo Alto Research Center Incorporated | Passively cooled solar concentrating photovoltaic device |
US20090305046A1 (en) * | 2006-07-20 | 2009-12-10 | Tsuyoshi Bito | Thermocurable Polyimide Resin Composition |
US8226391B2 (en) * | 2006-11-01 | 2012-07-24 | Solarworld Innovations Gmbh | Micro-extrusion printhead nozzle with tapered cross-section |
US8322025B2 (en) * | 2006-11-01 | 2012-12-04 | Solarworld Innovations Gmbh | Apparatus for forming a plurality of high-aspect ratio gridline structures |
US7922471B2 (en) * | 2006-11-01 | 2011-04-12 | Palo Alto Research Center Incorporated | Extruded structure with equilibrium shape |
US7780812B2 (en) * | 2006-11-01 | 2010-08-24 | Palo Alto Research Center Incorporated | Extrusion head with planarized edge surface |
US20080116182A1 (en) * | 2006-11-21 | 2008-05-22 | Palo Alto Research Center Incorporated | Multiple Station Scan Displacement Invariant Laser Ablation Apparatus |
US20080116183A1 (en) * | 2006-11-21 | 2008-05-22 | Palo Alto Research Center Incorporated | Light Scanning Mechanism For Scan Displacement Invariant Laser Ablation Apparatus |
US7638438B2 (en) * | 2006-12-12 | 2009-12-29 | Palo Alto Research Center Incorporated | Solar cell fabrication using extrusion mask |
US7928015B2 (en) * | 2006-12-12 | 2011-04-19 | Palo Alto Research Center Incorporated | Solar cell fabrication using extruded dopant-bearing materials |
US20080185039A1 (en) | 2007-02-02 | 2008-08-07 | Hing Wah Chan | Conductor fabrication for optical element |
US7954449B2 (en) | 2007-05-08 | 2011-06-07 | Palo Alto Research Center Incorporated | Wiring-free, plumbing-free, cooled, vacuum chuck |
US7999175B2 (en) * | 2008-09-09 | 2011-08-16 | Palo Alto Research Center Incorporated | Interdigitated back contact silicon solar cells with laser ablated grooves |
US20100221435A1 (en) * | 2008-11-07 | 2010-09-02 | Palo Alto Research Center Incorporated | Micro-Extrusion System With Airjet Assisted Bead Deflection |
US20100118081A1 (en) * | 2008-11-07 | 2010-05-13 | Palo Alto Research Center Incorporated | Dead Volume Removal From An Extrusion Printhead |
US8117983B2 (en) | 2008-11-07 | 2012-02-21 | Solarworld Innovations Gmbh | Directional extruded bead control |
US8080729B2 (en) * | 2008-11-24 | 2011-12-20 | Palo Alto Research Center Incorporated | Melt planarization of solar cell bus bars |
US20100130014A1 (en) * | 2008-11-26 | 2010-05-27 | Palo Alto Research Center Incorporated | Texturing multicrystalline silicon |
US8960120B2 (en) * | 2008-12-09 | 2015-02-24 | Palo Alto Research Center Incorporated | Micro-extrusion printhead with nozzle valves |
US20100139754A1 (en) * | 2008-12-09 | 2010-06-10 | Palo Alto Research Center Incorporated | Solar Cell With Co-Planar Backside Metallization |
US20100139756A1 (en) * | 2008-12-10 | 2010-06-10 | Palo Alto Research Center Incorporated | Simultaneously Writing Bus Bars And Gridlines For Solar Cell |
US20100206357A1 (en) * | 2009-02-18 | 2010-08-19 | Palo Alto Research Center Incorporated | Two-Part Solar Energy Collection System With Replaceable Solar Collector Component |
US20100206302A1 (en) * | 2009-02-18 | 2010-08-19 | Palo Alto Research Center Incorporated | Rotational Trough Reflector Array For Solar-Electricity Generation |
US20100206379A1 (en) * | 2009-02-18 | 2010-08-19 | Palo Alto Research Center Incorporated | Rotational Trough Reflector Array With Solid Optical Element For Solar-Electricity Generation |
US20100206356A1 (en) * | 2009-02-18 | 2010-08-19 | Palo Alto Research Center Incorporated | Rotational Trough Reflector Array For Solar-Electricity Generation |
US20110083728A1 (en) * | 2009-10-14 | 2011-04-14 | Palo Alto Research Center Incorporated | Disordered Nanowire Solar Cell |
US20110100419A1 (en) * | 2009-11-03 | 2011-05-05 | Palo Alto Research Center Incorporated | Linear Concentrating Solar Collector With Decentered Trough-Type Relectors |
US8884156B2 (en) | 2010-11-29 | 2014-11-11 | Palo Alto Research Center Incorporated | Solar energy harvesting device using stimuli-responsive material |
US8040609B1 (en) | 2010-11-29 | 2011-10-18 | Palo Alto Research Center Incorporated | Self-adjusting solar light transmission apparatus |
US8791227B1 (en) | 2012-04-20 | 2014-07-29 | The United States Of America As Represented By The Secretary Of The Air Force | Crosslinked aromatic polyimides and methods of making the same |
US8962890B1 (en) | 2012-04-20 | 2015-02-24 | The United States Of America As Represented By The Secretary Of The Air Force | Multifunctional crosslinkers for shape-memory polyimides, polyamides and poly(amide-imides) and methods of making the same |
US8752380B2 (en) | 2012-05-22 | 2014-06-17 | Palo Alto Research Center Incorporated | Collapsible solar-thermal concentrator for renewable, sustainable expeditionary power generator system |
US9085661B1 (en) | 2012-10-26 | 2015-07-21 | The United States Of America As Represented By The Secretary Of The Air Force | Photomechanically active copolyimides derived from an azobenzenediamine, a rigid dianhydride, and a flexible dianhydride |
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US10239254B1 (en) | 2015-08-07 | 2019-03-26 | The United States Of America As Represented By The Secretary Of The Air Force | Method of fabricating shape memory films |
US10294255B1 (en) | 2015-08-07 | 2019-05-21 | The United States Of America As Represented By The Secretary Of The Air Force | Multifunctional crosslinking agent, crosslinked polymer, and method of making same |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1934889A1 (de) * | 1969-07-10 | 1971-01-14 | Bayer Ag | Neuartige Pyridin-bis-(hydroxyarylaether) und Verfahren zu ihrer Herstellung |
US4065345A (en) * | 1974-12-16 | 1977-12-27 | The United States Of America As Represented By The United States National Aeronautics And Space Administration | Polyimide adhesives |
JPS5235281A (en) * | 1975-09-16 | 1977-03-17 | Sumitomo Bakelite Co Ltd | Peparation of flexible base for printed circuit |
US4196144A (en) * | 1976-06-15 | 1980-04-01 | Ciba-Geigy Corporation | Aromatic diamines and their use as polycondensation components for the manufacture of polyamide, polyamide-imide and polyimide polymers |
US4111906A (en) * | 1976-07-19 | 1978-09-05 | Trw Inc. | Polyimides prepared from perfluoroisopropylidene diamine |
US4203922A (en) * | 1976-07-19 | 1980-05-20 | Trw Inc. | Fluorinated aromatic diamine |
JPS58155790A (ja) * | 1982-03-10 | 1983-09-16 | 日立化成工業株式会社 | 可撓性印刷回路用基板の製造法 |
JPS58157190A (ja) * | 1982-03-12 | 1983-09-19 | 日立化成工業株式会社 | フレキシブル印刷回路用基板の製造法 |
JPS58190092A (ja) * | 1982-04-30 | 1983-11-05 | 宇部興産株式会社 | フレキシブル配線基板の製造法 |
JPS5976451A (ja) * | 1982-10-26 | 1984-05-01 | Hitachi Ltd | 半導体装置 |
JPS59170122A (ja) * | 1983-03-14 | 1984-09-26 | イ−・アイ・デユポン・デ・ニモアス・アンド・カンパニ− | 溶融−融合可能なポリイミド |
JPS59168030A (ja) * | 1983-03-15 | 1984-09-21 | Hitachi Chem Co Ltd | 熱可塑性ポリエ−テルイミドの製造法 |
US4477648A (en) * | 1983-04-07 | 1984-10-16 | Trw Inc. | High-temperature polyimides prepared from 2,2-bis-[(2-halo-4-aminophenoxy)-phenyl]hexafluoropropane |
JPS60501113A (ja) * | 1983-04-22 | 1985-07-18 | エム・アンド・テイ・ケミカルス・インコ−ポレイテツド | 改良されたポリアミド酸およびポリイミド |
US4535101A (en) * | 1984-04-03 | 1985-08-13 | Imi-Tech Corporation | Polyimide of 2,2-bis(4-(4-aminophenoxy)phenyl)-hexafluoropropane and process for the preparation of same |
JPS60243120A (ja) * | 1984-05-18 | 1985-12-03 | Hitachi Ltd | フレキシブルプリント基板の製造方法 |
US4681928A (en) * | 1984-06-01 | 1987-07-21 | M&T Chemicals Inc. | Poly(amide-amide acid), polyamide acid, poly(esteramide acid), poly(amide-imide), polyimide, poly(esterimide) from poly arylene diamine |
US4696994A (en) * | 1984-12-14 | 1987-09-29 | Ube Industries, Ltd. | Transparent aromatic polyimide |
JP2533841B2 (ja) * | 1984-12-18 | 1996-09-11 | 三井東圧化学株式会社 | 耐熱性接着剤 |
US4883718A (en) * | 1985-02-12 | 1989-11-28 | Mitsui Toatsu Chemicals, Inc. | Flexible copper-clad circuit substrate |
AU576675B2 (en) * | 1985-06-20 | 1988-09-01 | National Aeronautics And Space Administration - Nasa | Copolyimides |
EP0235294B1 (en) * | 1985-08-27 | 1997-11-12 | MITSUI TOATSU CHEMICALS, Inc. | Polyimides and heat-resistant adhesives comprising the same |
JPS6250375A (ja) * | 1985-08-30 | 1987-03-05 | Mitsui Toatsu Chem Inc | 耐熱性接着剤 |
JPS6253388A (ja) * | 1985-09-03 | 1987-03-09 | Mitsui Toatsu Chem Inc | 耐熱性接着剤 |
DE3783477T2 (de) * | 1986-02-25 | 1993-06-17 | Mitsui Toatsu Chemicals | Hochtemperatur-polyimidklebstoff. |
-
1986
- 1986-06-30 EP EP86904359A patent/EP0235294B1/en not_active Expired - Lifetime
- 1986-06-30 KR KR1019870700370A patent/KR910000868B1/ko not_active IP Right Cessation
- 1986-06-30 US US07/044,028 patent/US4847349A/en not_active Expired - Lifetime
- 1986-06-30 AU AU61222/86A patent/AU580183B2/en not_active Expired
- 1986-06-30 DE DE3650656T patent/DE3650656T2/de not_active Expired - Lifetime
- 1986-06-30 WO PCT/JP1986/000335 patent/WO1987001378A1/ja active IP Right Grant
- 1986-06-30 EP EP96101394A patent/EP0729995A1/en not_active Withdrawn
- 1986-08-14 CA CA000515976A patent/CA1268592A/en not_active Expired - Lifetime
-
1990
- 1990-11-09 US US07/611,471 patent/US5087689A/en not_active Expired - Lifetime
-
1991
- 1991-06-17 US US07/724,548 patent/US5205894A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
AU580183B2 (en) | 1989-01-05 |
EP0235294B1 (en) | 1997-11-12 |
US5205894A (en) | 1993-04-27 |
EP0235294A4 (en) | 1988-01-07 |
AU6122286A (en) | 1987-03-24 |
EP0729995A1 (en) | 1996-09-04 |
US4847349A (en) | 1989-07-11 |
CA1268592A (en) | 1990-05-01 |
EP0235294A1 (en) | 1987-09-09 |
WO1987001378A1 (en) | 1987-03-12 |
KR910000868B1 (ko) | 1991-02-11 |
DE3650656D1 (de) | 1997-12-18 |
DE3650656T2 (de) | 1998-04-30 |
US5087689A (en) | 1992-02-11 |
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