KR920016575A - 내열성접착제 - Google Patents

내열성접착제 Download PDF

Info

Publication number
KR920016575A
KR920016575A KR1019920002613A KR920002613A KR920016575A KR 920016575 A KR920016575 A KR 920016575A KR 1019920002613 A KR1019920002613 A KR 1019920002613A KR 920002613 A KR920002613 A KR 920002613A KR 920016575 A KR920016575 A KR 920016575A
Authority
KR
South Korea
Prior art keywords
heat resistant
structural unit
resistant adhesive
unit represented
polyamic acid
Prior art date
Application number
KR1019920002613A
Other languages
English (en)
Other versions
KR950009553B1 (ko
Inventor
쇼지 타마이
카쯔아끼 이이야마
아끼히로 야마구찌
Original Assignee
사와무라 하루오
미쯔이도오아쯔가가꾸 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 사와무라 하루오, 미쯔이도오아쯔가가꾸 가부시기가이샤 filed Critical 사와무라 하루오
Publication of KR920016575A publication Critical patent/KR920016575A/ko
Application granted granted Critical
Publication of KR950009553B1 publication Critical patent/KR950009553B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S526/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S526/935—Hot melt adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

내용 없음

Description

내열성접착제
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. 실질적으로 식(1)
    로 표현되는 구조단위를 10∼99몰%와, 식(2)
    로 표현되는 구조단위를 1∼90몰%를 중합체 분자내에 포함하는 폴리이미드로 이루어진 내열성 접착제.
  2. 실질적으로, 식(3)
    로 표현되는 구조단위를 10∼99몰%와, 식(4)
    로 표현되는 구조단위를 1∼90몰% 중합체 분자내에 포함하는 폴리아미드산과 상기의 폴리아미드산을 포함하는 와니스로이루어지는 폴리이미드계 내열성 접착제.
  3. 제2항에 있어서, 농도 0.5g/100㎖로 N,N-디메틸아세트아미드에 용해한 폴리아미드산의 대수점도는 35℃에서 0.1∼3.0dl/g인 것을 특징으로 하는 내열성 접착제.
  4. 실질적으로, 식 (3)
    로 표현된 구조단위의 10∼99몰%와, 식(4)
    로 표현된 구조단위의 1∼90몰%를 중합체 분자내에 포함하는 폴리아미드산으로, 상기 폴리아미드산을 N,N-디메틸아세트아미드에 농도 0.5g/100㎖로 용해시켜 35℃에서 측정한 대수점도가 0.1∼3.0dl/g인 폴리아미드산을 열적 또는 화학적으로이미드화하여 얻은 폴리이미드로 이루어진 내열성 접착제.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920002613A 1991-02-21 1992-02-21 내열성 접착제 KR950009553B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2740691 1991-02-21
JP91-27406 1991-02-21

Publications (2)

Publication Number Publication Date
KR920016575A true KR920016575A (ko) 1992-09-25
KR950009553B1 KR950009553B1 (ko) 1995-08-24

Family

ID=12220200

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920002613A KR950009553B1 (ko) 1991-02-21 1992-02-21 내열성 접착제

Country Status (4)

Country Link
US (1) US5346982A (ko)
EP (1) EP0500292B1 (ko)
KR (1) KR950009553B1 (ko)
DE (1) DE69201139T2 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5406124A (en) * 1992-12-04 1995-04-11 Mitsui Toatsu Chemicals, Inc. Insulating adhesive tape, and lead frame and semiconductor device employing the tape
US5866676A (en) * 1995-02-14 1999-02-02 The United States Of America As Represented By The United States National Aeronautics And Space Administration Copolyimides prepared from 3,4'-oxydianiline and 1,3-bis(3-aminophenoxy) benzene with 3,3', 4, 4'-biphenylcarboxylic dianhydride
US6232428B1 (en) * 1999-01-19 2001-05-15 I.S.T. Corporation Essentially colorless, transparent polyimide coatings and films
US6379486B1 (en) * 2000-07-13 2002-04-30 Xerox Corporation Process for seaming interlocking seams of polyimide component using polyimide adhesive
US6833017B2 (en) * 2001-08-10 2004-12-21 Spx Corporation Filter assembly and method with polyimide
JP2004201285A (ja) * 2002-12-06 2004-07-15 Murata Mfg Co Ltd 圧電部品の製造方法および圧電部品
WO2004088707A1 (ja) * 2003-03-31 2004-10-14 Mitsui Chemicals Inc. 画像表示装置用真空外囲器および画像表示装置用封着材
JP5293182B2 (ja) * 2006-07-20 2013-09-18 三菱瓦斯化学株式会社 熱硬化性ポリイミド樹脂組成物
CN105111717B (zh) * 2015-09-02 2018-01-02 东华大学 一种耐高温bahpfp型层压板及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4065345A (en) * 1974-12-16 1977-12-27 The United States Of America As Represented By The United States National Aeronautics And Space Administration Polyimide adhesives
JPH0765028B2 (ja) * 1985-06-19 1995-07-12 三井東圧化学株式会社 耐熱性接着剤
US4847349A (en) * 1985-08-27 1989-07-11 Mitsui Toatsu Chemicals, Inc. Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines
EP0243507B1 (en) * 1985-10-31 1992-03-11 MITSUI TOATSU CHEMICALS, Inc. Flexible laminate for printed circuit board and process for its production
JP2622678B2 (ja) * 1987-01-12 1997-06-18 チッソ株式会社 溶融成形可能な結晶性ポリイミド重合体
JPH0196221A (ja) * 1987-10-08 1989-04-14 Mitsubishi Petrochem Co Ltd 芳香族ポリイミド共重合体
JPH0794555B2 (ja) * 1988-10-20 1995-10-11 三井東圧化学株式会社 ポリイミドシートの製造方法
JP2624852B2 (ja) * 1988-10-28 1997-06-25 三井東圧化学株式会社 ポリイミドの製造方法
DE68927376D1 (de) * 1988-12-27 1996-11-28 Mitsui Toatsu Chemicals Verfahren zur Herstellung einer Buchse für eine integrierte Schaltung
US5069848A (en) * 1989-04-05 1991-12-03 Mitsui Toatsu Chemicals, Inc. Extrusion process of polyimide and polyimide pellet used for the process

Also Published As

Publication number Publication date
EP0500292A1 (en) 1992-08-26
DE69201139D1 (de) 1995-02-23
DE69201139T2 (de) 1995-06-22
KR950009553B1 (ko) 1995-08-24
EP0500292B1 (en) 1995-01-11
US5346982A (en) 1994-09-13

Similar Documents

Publication Publication Date Title
KR870010123A (ko) 내충격성 폴리아미드 성형 재료
KR920016575A (ko) 내열성접착제
KR830010402A (ko) 감광성 중합체 조성물
KR840009295A (ko) α-L-아스파르틸-L-페닐아라딘 메틸에스테르 및 그의 염산염의 제조방법
KR880009635A (ko) r-글로불린 주사용 용액
KR920019902A (ko) 내열성접착제 및 이 접착제를 사용한 접착방법
KR910006416A (ko) 열경화성 수지 조성물
KR900001757A (ko) 열안정성이 양호한 폴리이미드의 제조방법
KR920002717A (ko) 분말 피복 조성물
KR890008086A (ko) 사이클로헥산 유도체
KR870002213A (ko) 도료 조성물
KR880014418A (ko) 폴리실란 및 감광성 조성물
KR920014853A (ko) 실록산 변성 폴리이미드 수지의 제조방법
KR900016308A (ko) 광학 활성기 함유 콜레스테릭 액정 폴리에스테르
DE69434356D1 (de) Inclusion-Komplex von Beta-Cyclodextrin mit Diclofenac
KR890006694A (ko) 내열성이 우수하고 용융상태에서 이방성을 나타내는 수지
KR870006139A (ko) 도금용 폴리페닐렌 설파이드 수지 조성물
KR940005984A (ko) 액정 배열 필름 및 액정 디스플레이 장치
KR910700283A (ko) 모노이소시아네이트 캡핑된 에폭시 수지
KR910021446A (ko) 폴리페닐렌 술피드 수지 조성물
KR890011917A (ko) 폴리아미드 음이온 용액의 제조방법
KR840008328A (ko) 에폭시화합물의 경화방법 및 경화촉진 방법
KR890002342A (ko) 안트라퀴논계색소 및 이색소를 사용한 편광필름
KR960037648A (ko) 할로겐 함유 시아네이트 에스테르, 그의 제조 방법 및 그를 함유하는 열경화성 수지 조성물
KR940014720A (ko) 유연성 인쇄회로기판용 접착제 조성물

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20110720

Year of fee payment: 17

EXPY Expiration of term