KR870006139A - 도금용 폴리페닐렌 설파이드 수지 조성물 - Google Patents

도금용 폴리페닐렌 설파이드 수지 조성물 Download PDF

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Publication number
KR870006139A
KR870006139A KR860010618A KR860010618A KR870006139A KR 870006139 A KR870006139 A KR 870006139A KR 860010618 A KR860010618 A KR 860010618A KR 860010618 A KR860010618 A KR 860010618A KR 870006139 A KR870006139 A KR 870006139A
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KR
South Korea
Prior art keywords
polyphenylene sulfide
sulfide resin
resin composition
plating
weight
Prior art date
Application number
KR860010618A
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English (en)
Other versions
KR950005315B1 (ko
Inventor
마사토시 사또
켄스께 오가와라
노리아끼 에무라
Original Assignee
나까다니 하루오
토요소다코오교오 가부시끼가이샤
후지오까 켄이찌
호도가야카가꾸코오교오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 나까다니 하루오, 토요소다코오교오 가부시끼가이샤, 후지오까 켄이찌, 호도가야카가꾸코오교오 가부시끼가이샤 filed Critical 나까다니 하루오
Publication of KR870006139A publication Critical patent/KR870006139A/ko
Application granted granted Critical
Publication of KR950005315B1 publication Critical patent/KR950005315B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/04—Polysulfides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/08—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0248—Needles or elongated particles; Elongated cluster of chemically bonded particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0251—Non-conductive microfibers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31533—Of polythioether

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemically Coating (AREA)

Abstract

내용 없음

Description

도금용 폴리페닐렌 설파이드 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. 폴리페닐렌 설파이드 수지 30 내지 70중량%, 유리섬유 70 내지 30중량% 및 티탄산칼륨 섬유 1 내지 10중량%로 이루어진 폴리페닐렌 설파이드 수지 조성물.
  2. 제1항에 있어서, 폴리페닐렌 설파이드 수지가 일반식이인 반복단위를 적어도 70mol% 함유하는 조성물.
  3. 제1항에 있어서, 폴리페닐렌 설파이드 수지가 일반식이인 반복단위를 적어도 90mol% 함유하는 조성물.
  4. 제1항에 있어서, 티탄산칼륨 섬유가 평균 섬유직경이 1㎛ 이하이고, 평균 섬유길이가 5 내지 100㎛ 이며, 종횡비가 적어도 10인 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860010618A 1985-12-12 1986-12-12 도금용 폴리페닐렌 설파이드 수지 조성물 KR950005315B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP277914 1985-12-12
JP27791485 1985-12-12
JP60-277914 1985-12-12

Publications (2)

Publication Number Publication Date
KR870006139A true KR870006139A (ko) 1987-07-09
KR950005315B1 KR950005315B1 (ko) 1995-05-23

Family

ID=17590053

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860010618A KR950005315B1 (ko) 1985-12-12 1986-12-12 도금용 폴리페닐렌 설파이드 수지 조성물

Country Status (6)

Country Link
US (1) US4883702A (ko)
EP (1) EP0229495B1 (ko)
JP (1) JPH07100762B2 (ko)
KR (1) KR950005315B1 (ko)
CA (1) CA1292826C (ko)
DE (1) DE3674182D1 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4814224A (en) * 1987-01-02 1989-03-21 Phillips Petroleum Company Poly(arylene sulfide ketone) composites
JP2676532B2 (ja) * 1987-10-30 1997-11-17 呉羽化学工業株式会社 高熱安定性ポリアリーレンチオエーテルケトン・プリプレグおよびその成形物
JPH02219858A (ja) * 1989-02-22 1990-09-03 Idemitsu Petrochem Co Ltd ポリアリーレンスルフィド樹脂組成物及びその成形体
US5200271A (en) * 1989-02-22 1993-04-06 Idemitsu Petrochemical Co., Ltd. Polyarylene sulfide resin compositions and molded articles
JPH05170956A (ja) * 1991-06-14 1993-07-09 Kureha Chem Ind Co Ltd 樹脂成形品の金属化に好適な粗面化方法
US5503196A (en) * 1994-12-07 1996-04-02 Albany International Corp. Papermakers fabric having a system of machine-direction yarns residing interior of the fabric surfaces
GB2376470A (en) * 2001-06-13 2002-12-18 Furukawa Electric Co Ltd Optical ferrule
US6481900B1 (en) 2001-06-15 2002-11-19 The Furukawa Electric Co., Ltd. Optical ferrule
EP1279751A1 (de) * 2001-07-28 2003-01-29 Aluminal Oberflächtentechnik GmbH & Co. KG Vorrichtung zum galvanischen Abscheiden von Aluminium oder Aluminiumlegierungen aus metallorganischen Aluminiumalkylhaltigen Elektrolyten
JPWO2022202184A1 (ko) 2021-03-22 2022-09-29
JP2023019030A (ja) * 2021-07-28 2023-02-09 東ソー株式会社 ポリアリーレンスルフィド組成物
EP4223905A1 (en) 2022-02-08 2023-08-09 Atotech Deutschland GmbH & Co. KG Etching composition and method for etching at least one surface of a sulfur-containing thermoplastic resin-substrate

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4365037A (en) * 1980-07-18 1982-12-21 Dainippon Ink & Chemicals, Inc. Glass fiber-reinforced polyarylene sulfide resin composition
JPS6055218B2 (ja) * 1981-11-25 1985-12-04 川崎製鉄株式会社 鋳片の溶断だれ判別方法
JPS58152051A (ja) * 1982-03-03 1983-09-09 Sumitomo Electric Ind Ltd ポリフエニレンサルフアイド樹脂組成物
EP0096122B1 (en) * 1982-06-04 1986-09-24 Toray Industries, Inc. Reinforced polyphenylene sulphide board, printed circuit board made therefrom and process for making them
US4487879A (en) * 1982-09-20 1984-12-11 Phillips Petroleum Company Filled arylene sulfide polymer compositions containing (a) glass filter in combination with (b) a mineral filler
JPS5956353A (ja) * 1982-09-25 1984-03-31 Yuasa Battery Co Ltd 有機電解質電池
JPS59215353A (ja) * 1983-05-23 1984-12-05 Otsuka Chem Co Ltd ポリフエニレンサルフアイド樹脂組成物
US4495253A (en) * 1983-05-31 1985-01-22 Hughes Aircraft Company Solderable plated plastic components and process for plating _
JPS6083519A (ja) * 1983-10-13 1985-05-11 株式会社シマノ 釣用リ−ル
US4529769A (en) * 1983-12-06 1985-07-16 Phillips Petroleum Company Poly(arylene sulfide) composition, molding method and article of manufacture
JPS60147471A (ja) * 1984-01-10 1985-08-03 Toyo Soda Mfg Co Ltd 耐候性に優れたポリフエニレンサルフアイド樹脂組成物
CA1260174A (en) * 1984-06-29 1989-09-26 Kureha Chemical Ind Co Ltd PARA-PHENYLENE SULPHIDE COPOLYMERS; METHOD OF PREPARATION AND USE
JPH0635675B2 (ja) * 1984-07-30 1994-05-11 大塚化学株式会社 電気メツキ用樹脂組成物
GB2171555A (en) * 1985-02-20 1986-08-28 Philips Electronic Associated Bipolar semiconductor device with implanted recombination region
JPH02156353A (ja) * 1988-12-08 1990-06-15 Oki Electric Ind Co Ltd ディスクキャッシュ装置の制御方式
JPH05101517A (ja) * 1991-10-07 1993-04-23 Canon Inc 磁気記録再生装置

Also Published As

Publication number Publication date
JPS62270659A (ja) 1987-11-25
EP0229495B1 (en) 1990-09-12
EP0229495A1 (en) 1987-07-22
CA1292826C (en) 1991-12-03
KR950005315B1 (ko) 1995-05-23
DE3674182D1 (de) 1990-10-18
US4883702A (en) 1989-11-28
JPH07100762B2 (ja) 1995-11-01

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