DE68927376D1 - Verfahren zur Herstellung einer Buchse für eine integrierte Schaltung - Google Patents
Verfahren zur Herstellung einer Buchse für eine integrierte SchaltungInfo
- Publication number
- DE68927376D1 DE68927376D1 DE68927376T DE68927376T DE68927376D1 DE 68927376 D1 DE68927376 D1 DE 68927376D1 DE 68927376 T DE68927376 T DE 68927376T DE 68927376 T DE68927376 T DE 68927376T DE 68927376 D1 DE68927376 D1 DE 68927376D1
- Authority
- DE
- Germany
- Prior art keywords
- socket
- manufacturing
- integrated circuit
- integrated
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32763688 | 1988-12-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE68927376D1 true DE68927376D1 (de) | 1996-11-28 |
Family
ID=18201264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68927376T Expired - Lifetime DE68927376D1 (de) | 1988-12-27 | 1989-12-19 | Verfahren zur Herstellung einer Buchse für eine integrierte Schaltung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5206340A (de) |
EP (1) | EP0387450B1 (de) |
CA (1) | CA2006389A1 (de) |
DE (1) | DE68927376D1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5258441A (en) * | 1990-01-08 | 1993-11-02 | Mitsui Toatsu Chemicals, Inc. | Polyimide based friction material and preparation process of the material |
EP0500292B1 (de) * | 1991-02-21 | 1995-01-11 | MITSUI TOATSU CHEMICALS, Inc. | Hitzebeständiger Polyimid Klebstoff |
US5401812A (en) * | 1991-12-24 | 1995-03-28 | Matsushita Electric Works, Ltd. | Thermosetting polyimide composition, thermoset product thereof and manufacturing process thereof |
US5406124A (en) * | 1992-12-04 | 1995-04-11 | Mitsui Toatsu Chemicals, Inc. | Insulating adhesive tape, and lead frame and semiconductor device employing the tape |
US5455327A (en) * | 1993-05-13 | 1995-10-03 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Polyimides containing meta-biphenylenedioxy moieties and articles prepared therefrom |
JP2005042091A (ja) * | 2003-07-04 | 2005-02-17 | Nitto Denko Corp | 電気絶縁材料用ポリイミド樹脂 |
WO2017197077A1 (en) * | 2016-05-12 | 2017-11-16 | E I Du Pont De Nemours And Company | Polyimide compositions and a polyimide test socket housing |
US11045828B2 (en) | 2018-10-19 | 2021-06-29 | Abstract Engineering, Inc. | System and method for controlling and monitoring bathroom water flow |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4410231A (en) * | 1981-09-08 | 1983-10-18 | Texas Instruments Incorporated | Integrated circuit mounting socket |
EP0090059A1 (de) * | 1982-03-26 | 1983-10-05 | Allied Corporation | Verbinder für gedruckte Leiterplatten zum Herstellen eines federnden Druckkontaktes mit wenigstens einer leitenden Fläche |
US4722060A (en) * | 1984-03-22 | 1988-01-26 | Thomson Components-Mostek Corporation | Integrated-circuit leadframe adapted for a simultaneous bonding operation |
WO1987001378A1 (en) * | 1985-08-27 | 1987-03-12 | Mitsui Toatsu Chemicals, Incorporated | Polyimides and heat-resistant adhesives comprising the same |
DE3783477T2 (de) * | 1986-02-25 | 1993-06-17 | Mitsui Toatsu Chemicals | Hochtemperatur-polyimidklebstoff. |
JPS6332881A (ja) * | 1986-07-25 | 1988-02-12 | 日本テキサス・インスツルメンツ株式会社 | Icソケツト |
-
1989
- 1989-12-19 US US07/452,369 patent/US5206340A/en not_active Expired - Fee Related
- 1989-12-19 EP EP89313276A patent/EP0387450B1/de not_active Expired - Lifetime
- 1989-12-19 DE DE68927376T patent/DE68927376D1/de not_active Expired - Lifetime
- 1989-12-21 CA CA002006389A patent/CA2006389A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP0387450B1 (de) | 1996-10-23 |
EP0387450A2 (de) | 1990-09-19 |
CA2006389A1 (en) | 1990-06-27 |
EP0387450A3 (de) | 1990-12-27 |
US5206340A (en) | 1993-04-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |