KR880006294A - 폴리이미드 - Google Patents

폴리이미드 Download PDF

Info

Publication number
KR880006294A
KR880006294A KR870012911A KR870012911A KR880006294A KR 880006294 A KR880006294 A KR 880006294A KR 870012911 A KR870012911 A KR 870012911A KR 870012911 A KR870012911 A KR 870012911A KR 880006294 A KR880006294 A KR 880006294A
Authority
KR
South Korea
Prior art keywords
group
bond
polyimide
para
meta
Prior art date
Application number
KR870012911A
Other languages
English (en)
Other versions
KR910005344B1 (ko
Inventor
히데아끼 오이카와
가쯔아끼 이이야마
노부히도 고가
사브로오 가와시마
쇼오지 다마이
마사히로 오오타
야끼히로 야마구찌
Original Assignee
미지마 마사요시
미쯔이도오아쯔가가꾸 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미지마 마사요시, 미쯔이도오아쯔가가꾸 가부시기가이샤 filed Critical 미지마 마사요시
Publication of KR880006294A publication Critical patent/KR880006294A/ko
Application granted granted Critical
Publication of KR910005344B1 publication Critical patent/KR910005344B1/ko

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046Polyimides containing oxygen in the form of ether bonds in the main chain

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

내용 없음

Description

폴리이미드
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 폴리이미드의 가시, 자외 영역의 스팩트럼도의 일례를 도시한 도면,
제2도는 본 발명의 폴리이미드 분말의 적외선 흡수스팩트럼도의 일례를 도시한 도면

Claims (1)

  1. 식(I)
    (식중, X는 직결, 탄소수 1내지 10의 2가의 사슬식 탄화수소기, 6불소화된 이소프로필리덴기, 카르보닐기, 술포닐기 및 티오기로 이루어진 군으로부터 선택된기를 표시하고, 이미드 고리의 질소원자의 결합위치는 에테르 결합에 대해서 메타위 또는 파라위이다.)으로 표시되는 반복단위를 가진 폴리이미드.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임
KR1019870012911A 1986-11-19 1987-11-17 폴리이미드 KR910005344B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP274206 1986-11-19
JP61-274206 1986-11-19
JP61274206A JP2585552B2 (ja) 1986-11-19 1986-11-19 ポリイミド

Publications (2)

Publication Number Publication Date
KR880006294A true KR880006294A (ko) 1988-07-22
KR910005344B1 KR910005344B1 (ko) 1991-07-25

Family

ID=17538512

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870012911A KR910005344B1 (ko) 1986-11-19 1987-11-17 폴리이미드

Country Status (7)

Country Link
US (1) US4908409A (ko)
EP (1) EP0269319B1 (ko)
JP (1) JP2585552B2 (ko)
KR (1) KR910005344B1 (ko)
AU (1) AU579777B2 (ko)
CA (1) CA1295776C (ko)
DE (1) DE3788937T2 (ko)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63130633A (ja) * 1986-11-20 1988-06-02 Kanegafuchi Chem Ind Co Ltd 新規なポリアミド酸及びポリイミドの製造法
EP0299865B1 (en) * 1987-07-15 1998-01-07 National Aeronautics And Space Administration Process for preparing low dielectric polyimides
AU599517B2 (en) * 1987-10-23 1990-07-19 Mitsui Toatsu Chemicals Inc. Method for preparing polyimide and composite material thereof
KR910008340B1 (ko) * 1987-11-05 1991-10-12 미쯔이도오아쯔가가꾸 가부시기가이샤 폴리이미드의 제조법 및 그것으로 이루어진 복합재료
EP0330739A3 (en) * 1987-12-31 1990-09-26 General Electric Company Very high heat resistant thermoplastic polyether imides containing an aromatic structure
US4906730A (en) * 1988-05-06 1990-03-06 General Electric Company Polyetherimide blends, and molding method
JPH0794555B2 (ja) * 1988-10-20 1995-10-11 三井東圧化学株式会社 ポリイミドシートの製造方法
CA2002147A1 (en) * 1988-11-07 1990-05-07 Shuichi Morikawa Production process for polyimide fibers
EP0376592B1 (en) * 1988-12-28 1995-02-08 MITSUI TOATSU CHEMICALS, Inc. Polyimide foam
EP0387203A3 (de) * 1989-03-10 1991-09-11 Ciba-Geigy Ag Nichtreaktive Endgruppen aufweisende Polyamid- und Polyimidverbindungen
US5106938A (en) * 1989-06-08 1992-04-21 General Electric Company Melt crystalline polyetherimides
US5260407A (en) * 1989-07-17 1993-11-09 Mitsui Toatsu Chemicals, Incorporated Polyimide film and preparation process of the film
US5514748A (en) * 1989-07-30 1996-05-07 Mitsui Toatsu Chemicals, Inc. Polyimide based resin composition comprising cured phenolic resins and liquid crystal polymers
US5312866A (en) * 1989-11-30 1994-05-17 Mitsui Toatsu Chemicals, Incorporated Polyimide based resin composition
JP2558363B2 (ja) * 1989-11-30 1996-11-27 三井東圧化学株式会社 液晶パネル用配向剤
KR930005151B1 (ko) * 1990-05-15 1993-06-16 재단법인 한국화학연구소 폴리에테르이미드이미드수지와 그 제조방법
US5212279A (en) * 1990-10-22 1993-05-18 Hitachi Chemical Co., Ltd. Hot-melt adhesive and its use in polyimide film and printed circuit board
US5401812A (en) * 1991-12-24 1995-03-28 Matsushita Electric Works, Ltd. Thermosetting polyimide composition, thermoset product thereof and manufacturing process thereof
US5321096A (en) * 1992-04-02 1994-06-14 Mitsui Toatsu Chemical, Incorporated Polyimide composition
US5354839A (en) * 1992-04-07 1994-10-11 Mitsui Toatsu Chemicals, Incorporated Polyimide and preparation process of same
US5494996A (en) * 1993-01-21 1996-02-27 Mitsui Toatsu Chemicals Inc. Polyimide resin composition
JPH069936A (ja) * 1993-04-30 1994-01-18 Mitsui Toatsu Chem Inc 耐熱性接着剤
US9822088B2 (en) 2011-03-30 2017-11-21 The United States Of America As Represented By The Administrator Of Nasa Anisotropic copoly(imide oxetane) coatings and articles of manufacture, copoly(imide oxetane)s containing pendant fluorocarbon moieties, oligomers and processes therefor
JP5845911B2 (ja) 2012-01-13 2016-01-20 宇部興産株式会社 ポリイミド前駆体水溶液組成物、及びポリイミド前駆体水溶液組成物の製造方法
KR101706402B1 (ko) * 2012-04-03 2017-02-14 삼성에스디아이 주식회사 수용성 바인더 조성물, 및 이를 이용한 이차전지용 전극
US9278374B2 (en) 2012-06-08 2016-03-08 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Modified surface having low adhesion properties to mitigate insect residue adhesion
JP6580808B2 (ja) * 2012-06-19 2019-09-25 日鉄ケミカル&マテリアル株式会社 表示装置及びその製造方法
KR102276288B1 (ko) 2013-11-25 2021-07-12 삼성전자주식회사 폴리이미드 제조용 조성물, 폴리이미드, 상기 폴리이미드를 포함하는 성형품, 및 상기 성형품을 포함하는 디스플레이 장치
WO2016060213A1 (ja) 2014-10-17 2016-04-21 三菱瓦斯化学株式会社 ポリイミド樹脂組成物、ポリイミドフィルム及び積層体
US9975997B2 (en) 2015-03-27 2018-05-22 Samsung Electronics Co., Ltd. Compositions, composites prepared therefrom, and films and electronic devices including the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833546A (en) * 1972-12-29 1974-09-03 Gen Electric Method for making polyetherimides
JPS58157190A (ja) * 1982-03-12 1983-09-19 日立化成工業株式会社 フレキシブル印刷回路用基板の製造法
JPS5945322A (ja) * 1982-09-08 1984-03-14 Hitachi Chem Co Ltd ポリアミノビスイミド樹脂の製造方法
JPS5976451A (ja) * 1982-10-26 1984-05-01 Hitachi Ltd 半導体装置
US4443591A (en) * 1983-01-21 1984-04-17 General Electric Company Method for making polyetherimide
JPS59168030A (ja) * 1983-03-15 1984-09-21 Hitachi Chem Co Ltd 熱可塑性ポリエ−テルイミドの製造法
JPS60501113A (ja) * 1983-04-22 1985-07-18 エム・アンド・テイ・ケミカルス・インコ−ポレイテツド 改良されたポリアミド酸およびポリイミド
JPS6183239A (ja) * 1984-10-01 1986-04-26 Kawasaki Steel Corp ピツチ微小中空体の製造方法
US4696994A (en) * 1984-12-14 1987-09-29 Ube Industries, Ltd. Transparent aromatic polyimide
JP2533841B2 (ja) * 1984-12-18 1996-09-11 三井東圧化学株式会社 耐熱性接着剤
EP0235294B1 (en) * 1985-08-27 1997-11-12 MITSUI TOATSU CHEMICALS, Inc. Polyimides and heat-resistant adhesives comprising the same
JP2537179B2 (ja) * 1985-09-19 1996-09-25 三井東圧化学株式会社 ポリイミドおよびポリイミドよりなる耐熱性接着剤
JPS6253388A (ja) * 1985-09-03 1987-03-09 Mitsui Toatsu Chem Inc 耐熱性接着剤
DE3783477T2 (de) * 1986-02-25 1993-06-17 Mitsui Toatsu Chemicals Hochtemperatur-polyimidklebstoff.

Also Published As

Publication number Publication date
AU8124287A (en) 1988-05-26
US4908409A (en) 1990-03-13
JPS63128025A (ja) 1988-05-31
EP0269319A2 (en) 1988-06-01
CA1295776C (en) 1992-02-11
EP0269319A3 (en) 1989-09-27
JP2585552B2 (ja) 1997-02-26
EP0269319B1 (en) 1994-01-26
DE3788937T2 (de) 1994-07-14
KR910005344B1 (ko) 1991-07-25
DE3788937D1 (de) 1994-03-10
AU579777B2 (en) 1988-12-08

Similar Documents

Publication Publication Date Title
KR880006294A (ko) 폴리이미드
KR880700005A (ko) 폴리이미드 및 폴리이미드로 이루어진 내열성접착제
KR870004099A (ko) 실리콘 조성물
KR890002279A (ko) 폴리이미드 및 폴리이미드로 이루어진 내열성접착제
KR890011761A (ko) 배추묵는 원형 고무밴드
KR890008086A (ko) 사이클로헥산 유도체
KR880701266A (ko) 폴리이미드 수지조성물
KR870004113A (ko) 도료용 조성물
KR890016086A (ko) 고도의 용해성 방향족 폴리이미드
KR900701886A (ko) 말단부가 종결된 코폴리(아릴렌 설파이드)
KR920014853A (ko) 실록산 변성 폴리이미드 수지의 제조방법
KR890000596A (ko) 폴리이미드 수지조성물
KR890014687A (ko) 폴리이미드계 수지조성물
KR890016922A (ko) 복합 감미료
KR920018183A (ko) 감광성 중합체 재료
KR890000601A (ko) 실리콘 조성물
KR920702700A (ko) 저분자량의 종결된 코폴리(아릴렌 설파이드)
KR860007272A (ko) 실온 경화성 오르가노폴리실록산 조성물
KR880001754A (ko) 열경화성 수지조성물
KR920000892A (ko) 도막 형성용 재료
KR880014062A (ko) 열경화성 수지조성물
KR890017309A (ko) 실온 경화성 조성물
KR910700283A (ko) 모노이소시아네이트 캡핑된 에폭시 수지
KR830006189A (ko) 이소시아네이트 조성물
KR910009778A (ko) 폴리이미드

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
O035 Opposition [patent]: request for opposition

Free format text: OPPOSITION NUMBER: 001991000289; OPPOSITION DATE: 19910925

E902 Notification of reason for refusal
E601 Decision to refuse application
O063 Decision on refusal after opposition [patent]: decision to refuse application