KR20230135175A - 반도체 장치 및 발광 장치 - Google Patents

반도체 장치 및 발광 장치 Download PDF

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Publication number
KR20230135175A
KR20230135175A KR1020237031364A KR20237031364A KR20230135175A KR 20230135175 A KR20230135175 A KR 20230135175A KR 1020237031364 A KR1020237031364 A KR 1020237031364A KR 20237031364 A KR20237031364 A KR 20237031364A KR 20230135175 A KR20230135175 A KR 20230135175A
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South Korea
Prior art keywords
film
oxide semiconductor
insulating film
transistor
low
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KR1020237031364A
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Korean (ko)
Inventor
쥰이치 고에즈카
마사미 진츄
유키노리 시마
다이스케 구로사키
마사타카 나카다
슌페이 야마자키
šœ페이 야마자키
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가부시키가이샤 한도오따이 에네루기 켄큐쇼
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Priority to KR1020257011338A priority Critical patent/KR20250050141A/ko
Publication of KR20230135175A publication Critical patent/KR20230135175A/ko
Ceased legal-status Critical Current

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    • H01L27/1225
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H01L29/7869
    • H01L29/78696
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733Multi-gate TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733Multi-gate TFTs
    • H10D30/6734Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6757Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6758Thin-film transistors [TFT] characterised by the insulating substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/411Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/431Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having different compositions, shapes, layouts or thicknesses of gate insulators in different TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441Interconnections, e.g. scanning lines
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/471Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having different architectures, e.g. having both top-gate and bottom-gate TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/121Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs

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  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thin Film Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Devices (AREA)
  • Bipolar Transistors (AREA)
  • Noodles (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020237031364A 2014-02-07 2015-02-05 반도체 장치 및 발광 장치 Ceased KR20230135175A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020257011338A KR20250050141A (ko) 2014-02-07 2015-02-05 반도체 장치 및 발광 장치

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JPJP-P-2014-022864 2014-02-07
JP2014022865 2014-02-07
JPJP-P-2014-022865 2014-02-07
JP2014022864 2014-02-07
JP2014051138 2014-03-14
JPJP-P-2014-051138 2014-03-14
JP2014051134 2014-03-14
JPJP-P-2014-051134 2014-03-14
KR1020227031471A KR102579894B1 (ko) 2014-02-07 2015-02-05 반도체 장치 및 발광 장치
PCT/IB2015/050867 WO2015118472A1 (en) 2014-02-07 2015-02-05 Semiconductor device

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Publications (1)

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KR20230135175A true KR20230135175A (ko) 2023-09-22

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KR1020207024806A Active KR102357805B1 (ko) 2014-02-07 2015-02-05 반도체 장치
KR1020257011338A Pending KR20250050141A (ko) 2014-02-07 2015-02-05 반도체 장치 및 발광 장치
KR1020227031471A Active KR102579894B1 (ko) 2014-02-07 2015-02-05 반도체 장치 및 발광 장치
KR1020227002993A Active KR102443720B1 (ko) 2014-02-07 2015-02-05 반도체 장치 및 발광 장치
KR1020237031364A Ceased KR20230135175A (ko) 2014-02-07 2015-02-05 반도체 장치 및 발광 장치
KR1020167024172A Active KR102151108B1 (ko) 2014-02-07 2015-02-05 반도체 장치

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KR1020207024806A Active KR102357805B1 (ko) 2014-02-07 2015-02-05 반도체 장치
KR1020257011338A Pending KR20250050141A (ko) 2014-02-07 2015-02-05 반도체 장치 및 발광 장치
KR1020227031471A Active KR102579894B1 (ko) 2014-02-07 2015-02-05 반도체 장치 및 발광 장치
KR1020227002993A Active KR102443720B1 (ko) 2014-02-07 2015-02-05 반도체 장치 및 발광 장치

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US (7) US9530894B2 (enExample)
JP (7) JP2015188062A (enExample)
KR (6) KR102357805B1 (enExample)
CN (2) CN105960712B (enExample)
DE (1) DE112015000676T5 (enExample)
TW (7) TW202526457A (enExample)
WO (1) WO2015118472A1 (enExample)

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Publication number Priority date Publication date Assignee Title
EP3229066A1 (en) 2005-12-05 2017-10-11 Semiconductor Energy Laboratory Co., Ltd. Transflective liquid crystal display with a horizontal electric field configuration
US9882014B2 (en) 2013-11-29 2018-01-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR102705567B1 (ko) * 2013-12-02 2024-09-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
JP6506545B2 (ja) 2013-12-27 2019-04-24 株式会社半導体エネルギー研究所 半導体装置
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TWI663726B (zh) 2014-05-30 2019-06-21 Semiconductor Energy Laboratory Co., Ltd. 半導體裝置、模組及電子裝置
WO2015182999A1 (ko) * 2014-05-30 2015-12-03 네오뷰코오롱 주식회사 원형 표시장치 및 그 제조방법
CN110246850B (zh) * 2014-07-23 2022-12-02 索尼公司 显示装置
JP5790893B1 (ja) * 2015-02-13 2015-10-07 日新電機株式会社 膜形成方法および薄膜トランジスタの作製方法
KR20160114511A (ko) 2015-03-24 2016-10-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
US9806200B2 (en) 2015-03-27 2017-10-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10002970B2 (en) * 2015-04-30 2018-06-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method of the same, or display device including the same
KR20180010205A (ko) 2015-05-22 2018-01-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 및 상기 반도체 장치를 포함하는 표시 장치
US11024725B2 (en) * 2015-07-24 2021-06-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including metal oxide film
JP2017041596A (ja) * 2015-08-21 2017-02-23 株式会社Joled 薄膜トランジスタ、半導体装置および電子機器
TWI650817B (zh) * 2015-08-28 2019-02-11 聯華電子股份有限公司 半導體元件及其製作方法
WO2017064590A1 (en) 2015-10-12 2017-04-20 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US10297331B2 (en) 2015-10-30 2019-05-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
CN108352410B (zh) * 2015-11-25 2021-06-29 株式会社爱发科 薄膜晶体管、氧化物半导体膜以及溅射靶材
JP2018032839A (ja) * 2015-12-11 2018-03-01 株式会社半導体エネルギー研究所 トランジスタ、回路、半導体装置、表示装置および電子機器
US10714633B2 (en) * 2015-12-15 2020-07-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
KR20180123028A (ko) 2016-03-11 2018-11-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장비, 상기 반도체 장치의 제작 방법, 및 상기 반도체 장치를 포함하는 표시 장치
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US11302717B2 (en) * 2016-04-08 2022-04-12 Semiconductor Energy Laboratory Co., Ltd. Transistor and method for manufacturing the same
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US10217678B2 (en) * 2016-06-14 2019-02-26 Innolux Corporation Display device and method of manufacturing the display device
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TWI729030B (zh) * 2016-08-29 2021-06-01 日商半導體能源研究所股份有限公司 顯示裝置及控制程式
WO2018073689A1 (en) * 2016-10-21 2018-04-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10147681B2 (en) * 2016-12-09 2018-12-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR20180066848A (ko) 2016-12-09 2018-06-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 및 반도체 장치의 제작 방법
CN107046002B (zh) * 2017-03-24 2019-11-01 京东方科技集团股份有限公司 薄膜晶体管及其制备方法、阵列基板、显示装置
CN106847834B (zh) * 2017-03-30 2019-05-10 京东方科技集团股份有限公司 一种阵列基板及其制备方法、显示面板
CN107104151A (zh) * 2017-05-10 2017-08-29 陕西师范大学 一种双栅电极金属氧化物薄膜晶体管及其制备方法
JP6844845B2 (ja) 2017-05-31 2021-03-17 三国電子有限会社 表示装置
CN107293553B (zh) * 2017-06-19 2020-11-24 京东方科技集团股份有限公司 阵列基板及其制备方法、显示面板和显示装置
JP6536634B2 (ja) * 2017-07-28 2019-07-03 セイコーエプソン株式会社 電気光学装置および電子機器
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JP7167038B2 (ja) * 2017-09-15 2022-11-08 株式会社半導体エネルギー研究所 半導体装置
JP2019078788A (ja) * 2017-10-20 2019-05-23 シャープ株式会社 有機el表示装置およびアクティブマトリクス基板
US10490756B2 (en) * 2017-11-06 2019-11-26 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Method for fabricating flexible OLED panel and flexible OLED panel
JP7194122B2 (ja) 2018-01-05 2022-12-21 株式会社半導体エネルギー研究所 半導体装置
JP7161529B2 (ja) * 2018-06-08 2022-10-26 株式会社半導体エネルギー研究所 半導体装置
CN110649003A (zh) * 2018-06-26 2020-01-03 鸿富锦精密工业(深圳)有限公司 半导体基板、阵列基板、逆变器电路及开关电路
CN110190063B (zh) * 2018-07-02 2021-10-12 京东方科技集团股份有限公司 阵列基板及其制作方法、显示装置
WO2020026308A1 (ja) * 2018-07-30 2020-02-06 シャープ株式会社 表示デバイス
WO2020031031A1 (ja) * 2018-08-09 2020-02-13 株式会社半導体エネルギー研究所 半導体装置および半導体装置の作製方法
JP7190729B2 (ja) 2018-08-31 2022-12-16 三国電子有限会社 キャリア注入量制御電極を有する有機エレクトロルミネセンス素子
JP7246681B2 (ja) 2018-09-26 2023-03-28 三国電子有限会社 トランジスタ及びトランジスタの製造方法、並びにトランジスタを含む表示装置
CN109728003B (zh) * 2019-01-03 2020-12-01 合肥鑫晟光电科技有限公司 显示基板、显示装置和显示基板的制造方法
JP7190740B2 (ja) 2019-02-22 2022-12-16 三国電子有限会社 エレクトロルミネセンス素子を有する表示装置
US11342364B2 (en) * 2019-07-11 2022-05-24 Tianma Japan. Ltd. Thin-film transistor substrate
KR102871919B1 (ko) * 2019-12-16 2025-10-15 엘지디스플레이 주식회사 트랜지스터 어레이 기판 및 이를 포함하는 전자장치
JP7315452B2 (ja) * 2019-12-20 2023-07-26 株式会社ジャパンディスプレイ 光センサ装置
JP7444436B2 (ja) 2020-02-05 2024-03-06 三国電子有限会社 液晶表示装置
KR102735959B1 (ko) * 2020-04-20 2024-12-03 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
US11916121B2 (en) * 2020-06-29 2024-02-27 Taiwan Semiconductor Manufacturing Company Limited Tri-gate orthogonal channel transistor and methods of forming the same
JP7610936B2 (ja) 2020-08-07 2025-01-09 株式会社ジャパンディスプレイ 表示装置
KR102835255B1 (ko) * 2020-10-12 2025-07-16 엘지디스플레이 주식회사 박막 트랜지스터, 박막 트랜지스터의 제조방법 및 이를 포함하는 표시장치
CN112542516B (zh) * 2020-11-03 2024-01-30 北海惠科光电技术有限公司 一种主动开关及其制作方法和显示面板
CN112530978B (zh) * 2020-12-01 2024-02-13 京东方科技集团股份有限公司 开关器件结构及其制备方法、薄膜晶体管膜层、显示面板
CN112864280A (zh) * 2021-01-29 2021-05-28 通威太阳能(安徽)有限公司 一种高可靠性的双面电池及其制备方法
CN112939156A (zh) * 2021-02-05 2021-06-11 西安交通大学 一种具有电极自我修复功能的电化学反应系统及方法
JP2023007092A (ja) * 2021-07-01 2023-01-18 シャープディスプレイテクノロジー株式会社 アクティブマトリクス基板およびその製造方法
KR20230038357A (ko) * 2021-09-10 2023-03-20 삼성전자주식회사 반도체 소자 및 그의 제조방법
CN113809163B (zh) * 2021-09-17 2023-11-24 武汉天马微电子有限公司 金属氧化物晶体管、显示面板及显示装置
KR20240126217A (ko) * 2023-02-13 2024-08-20 에스케이하이닉스 주식회사 산화물 반도체를 포함하는 반도체 장치 및 그 제조 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165529A (ja) 2004-11-10 2006-06-22 Canon Inc 非晶質酸化物、及び電界効果型トランジスタ

Family Cites Families (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5140391A (en) 1987-08-24 1992-08-18 Sony Corporation Thin film MOS transistor having pair of gate electrodes opposing across semiconductor layer
JPS6453460A (en) 1987-08-24 1989-03-01 Sony Corp Mos transistor
JPH07294961A (ja) 1994-04-22 1995-11-10 Semiconductor Energy Lab Co Ltd アクティブマトリクス型表示装置の駆動回路および設計方法
JP3883706B2 (ja) 1998-07-31 2007-02-21 シャープ株式会社 エッチング方法、及び薄膜トランジスタマトリックス基板の製造方法
JP2001007342A (ja) 1999-04-20 2001-01-12 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP5046439B2 (ja) 2000-05-12 2012-10-10 株式会社半導体エネルギー研究所 半導体装置の作製方法
TWI224806B (en) 2000-05-12 2004-12-01 Semiconductor Energy Lab Semiconductor device and manufacturing method thereof
TW501282B (en) 2000-06-07 2002-09-01 Semiconductor Energy Lab Method of manufacturing semiconductor device
JP4064075B2 (ja) * 2000-06-07 2008-03-19 株式会社半導体エネルギー研究所 半導体装置の作製方法
US7105048B2 (en) 2001-11-30 2006-09-12 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus
JP4021194B2 (ja) 2001-12-28 2007-12-12 シャープ株式会社 薄膜トランジスタ装置の製造方法
US7521368B2 (en) 2004-05-07 2009-04-21 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP5025095B2 (ja) * 2004-05-07 2012-09-12 株式会社半導体エネルギー研究所 半導体装置の作製方法
EP2453480A2 (en) 2004-11-10 2012-05-16 Canon Kabushiki Kaisha Amorphous oxide and field effect transistor
JP2007220818A (ja) 2006-02-15 2007-08-30 Kochi Prefecture Sangyo Shinko Center 薄膜トランジスタ及びその製法
JP5015471B2 (ja) 2006-02-15 2012-08-29 財団法人高知県産業振興センター 薄膜トランジスタ及びその製法
JP5110803B2 (ja) 2006-03-17 2012-12-26 キヤノン株式会社 酸化物膜をチャネルに用いた電界効果型トランジスタ及びその製造方法
WO2007142167A1 (en) 2006-06-02 2007-12-13 Kochi Industrial Promotion Center Semiconductor device including an oxide semiconductor thin film layer of zinc oxide and manufacturing method thereof
JP5164357B2 (ja) 2006-09-27 2013-03-21 キヤノン株式会社 半導体装置及び半導体装置の製造方法
US7827800B2 (en) * 2006-10-19 2010-11-09 Pratt & Whitney Canada Corp. Combustor heat shield
JP5704790B2 (ja) 2008-05-07 2015-04-22 キヤノン株式会社 薄膜トランジスタ、および、表示装置
KR101496148B1 (ko) 2008-05-15 2015-02-27 삼성전자주식회사 반도체소자 및 그 제조방법
JP5430248B2 (ja) * 2008-06-24 2014-02-26 富士フイルム株式会社 薄膜電界効果型トランジスタおよび表示装置
JP2010114160A (ja) * 2008-11-04 2010-05-20 Sharp Corp 半導体素子およびその製造方法並びに表示装置
EP2515337B1 (en) 2008-12-24 2016-02-24 Semiconductor Energy Laboratory Co., Ltd. Driver circuit and semiconductor device
TWI501319B (zh) 2008-12-26 2015-09-21 半導體能源研究所股份有限公司 半導體裝置及其製造方法
JP5728171B2 (ja) 2009-06-29 2015-06-03 株式会社半導体エネルギー研究所 半導体装置
CN102576732B (zh) 2009-07-18 2015-02-25 株式会社半导体能源研究所 半导体装置与用于制造半导体装置的方法
CN105097946B (zh) 2009-07-31 2018-05-08 株式会社半导体能源研究所 半导体装置及其制造方法
KR102097932B1 (ko) 2009-07-31 2020-04-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 디바이스 및 그 형성 방법
JP5642447B2 (ja) 2009-08-07 2014-12-17 株式会社半導体エネルギー研究所 半導体装置
TWI528527B (zh) 2009-08-07 2016-04-01 半導體能源研究所股份有限公司 半導體裝置及半導體裝置之製造方法
WO2011027676A1 (en) 2009-09-04 2011-03-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR20120084751A (ko) 2009-10-05 2012-07-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
KR101876473B1 (ko) 2009-11-06 2018-07-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
KR20170142998A (ko) 2009-12-25 2017-12-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 제작 방법
WO2011081041A1 (en) 2009-12-28 2011-07-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the semiconductor device
KR101829309B1 (ko) * 2010-01-22 2018-02-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101817054B1 (ko) 2010-02-12 2018-01-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 이를 포함한 표시 장치
US8664658B2 (en) 2010-05-14 2014-03-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2011145467A1 (en) 2010-05-21 2011-11-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8519387B2 (en) 2010-07-26 2013-08-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing
JP2012033836A (ja) 2010-08-03 2012-02-16 Canon Inc トップゲート型薄膜トランジスタ及びこれを備えた表示装置
WO2012035984A1 (en) * 2010-09-15 2012-03-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
US8530273B2 (en) 2010-09-29 2013-09-10 Guardian Industries Corp. Method of making oxide thin film transistor array
TWI654764B (zh) * 2010-11-11 2019-03-21 日商半導體能源研究所股份有限公司 半導體裝置及其製造方法
US8823092B2 (en) * 2010-11-30 2014-09-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
CN102130009B (zh) * 2010-12-01 2012-12-05 北京大学深圳研究生院 一种晶体管的制造方法
US8883556B2 (en) 2010-12-28 2014-11-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP5784479B2 (ja) 2010-12-28 2015-09-24 株式会社半導体エネルギー研究所 半導体装置
US9443984B2 (en) 2010-12-28 2016-09-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2012160679A (ja) 2011-02-03 2012-08-23 Sony Corp 薄膜トランジスタ、表示装置および電子機器
KR102546888B1 (ko) 2011-06-17 2023-06-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 액정 디스플레이 장치
US8673426B2 (en) 2011-06-29 2014-03-18 Semiconductor Energy Laboratory Co., Ltd. Driver circuit, method of manufacturing the driver circuit, and display device including the driver circuit
US8952377B2 (en) 2011-07-08 2015-02-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8643008B2 (en) 2011-07-22 2014-02-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI567985B (zh) 2011-10-21 2017-01-21 半導體能源研究所股份有限公司 半導體裝置及其製造方法
JP2013105754A (ja) 2011-11-10 2013-05-30 Sharp Corp 半導体素子基板の製造方法および半導体素子基板並びに表示装置
US8796682B2 (en) 2011-11-11 2014-08-05 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device
TWI580047B (zh) * 2011-12-23 2017-04-21 半導體能源研究所股份有限公司 半導體裝置
US9859114B2 (en) 2012-02-08 2018-01-02 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor device with an oxygen-controlling insulating layer
JP6148024B2 (ja) * 2012-02-09 2017-06-14 株式会社半導体エネルギー研究所 半導体装置
US9735280B2 (en) 2012-03-02 2017-08-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for manufacturing semiconductor device, and method for forming oxide film
JP6168795B2 (ja) 2012-03-14 2017-07-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP6087672B2 (ja) * 2012-03-16 2017-03-01 株式会社半導体エネルギー研究所 半導体装置
JP6035195B2 (ja) * 2012-05-01 2016-11-30 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR20130136063A (ko) 2012-06-04 2013-12-12 삼성디스플레이 주식회사 박막 트랜지스터, 이를 포함하는 박막 트랜지스터 표시판 및 그 제조 방법
KR102099445B1 (ko) 2012-06-29 2020-04-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
KR102161077B1 (ko) 2012-06-29 2020-09-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP2014042004A (ja) * 2012-07-26 2014-03-06 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
JP6134598B2 (ja) 2012-08-02 2017-05-24 株式会社半導体エネルギー研究所 半導体装置
WO2014021356A1 (en) 2012-08-03 2014-02-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9287411B2 (en) 2012-10-24 2016-03-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2016001712A (ja) 2013-11-29 2016-01-07 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2016027597A (ja) 2013-12-06 2016-02-18 株式会社半導体エネルギー研究所 半導体装置
US9577110B2 (en) 2013-12-27 2017-02-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including an oxide semiconductor and the display device including the semiconductor device
DE112014006046T5 (de) 2013-12-27 2016-09-15 Semiconductor Energy Laboratory Co., Ltd. Licht emittierende Vorrichtung
JP6506545B2 (ja) 2013-12-27 2019-04-24 株式会社半導体エネルギー研究所 半導体装置
JP6523695B2 (ja) 2014-02-05 2019-06-05 株式会社半導体エネルギー研究所 半導体装置
US9443876B2 (en) 2014-02-05 2016-09-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device including the semiconductor device, display module including the display device, and electronic device including the semiconductor device, the display device, and the display module
TWI665778B (zh) 2014-02-05 2019-07-11 日商半導體能源研究所股份有限公司 半導體裝置、模組及電子裝置
US9929279B2 (en) 2014-02-05 2018-03-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
TWI685116B (zh) 2014-02-07 2020-02-11 日商半導體能源研究所股份有限公司 半導體裝置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165529A (ja) 2004-11-10 2006-06-22 Canon Inc 非晶質酸化物、及び電界効果型トランジスタ

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