JP7315452B2 - 光センサ装置 - Google Patents
光センサ装置 Download PDFInfo
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- JP7315452B2 JP7315452B2 JP2019230550A JP2019230550A JP7315452B2 JP 7315452 B2 JP7315452 B2 JP 7315452B2 JP 2019230550 A JP2019230550 A JP 2019230550A JP 2019230550 A JP2019230550 A JP 2019230550A JP 7315452 B2 JP7315452 B2 JP 7315452B2
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- 230000003287 optical effect Effects 0.000 title claims description 28
- 239000004065 semiconductor Substances 0.000 claims description 118
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 38
- 229920005591 polysilicon Polymers 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 29
- 239000004020 conductor Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 240
- 239000003990 capacitor Substances 0.000 description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 15
- 229910052814 silicon oxide Inorganic materials 0.000 description 15
- 238000004544 sputter deposition Methods 0.000 description 13
- 229910052581 Si3N4 Inorganic materials 0.000 description 12
- 239000012535 impurity Substances 0.000 description 12
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 11
- 239000001257 hydrogen Substances 0.000 description 11
- 229910052739 hydrogen Inorganic materials 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- 238000000206 photolithography Methods 0.000 description 8
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052795 boron group element Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910007717 ZnSnO Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052800 carbon group element Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 1
- 229910001195 gallium oxide Inorganic materials 0.000 description 1
- 229910001849 group 12 element Inorganic materials 0.000 description 1
- 229910021480 group 4 element Inorganic materials 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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- H01L31/02—Details
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- H01L31/02164—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors for shielding light, e.g. light blocking layers, cold shields for infrared detectors
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- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
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- H01L31/113—Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect phototransistor being of the conductor-insulator-semiconductor type, e.g. metal-insulator-semiconductor field-effect transistor
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
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- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
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- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
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- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
- H01L31/022483—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers composed of zinc oxide [ZnO]
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Description
本実施形態では、本発明の一実施形態に係る光センサ装置100について、図1乃至図10を参照して説明する。
図2は、センサ領域102に配置された複数のセンサ画素110の各々が有する画素回路である。複数のセンサ画素110の各々は、少なくともトランジスタ201~204、及び容量素子205を有する。図2に示すセンサ画素110におけるGate、SVS、DCH、RST、Sig、VR1、SVGはそれぞれ、図1に示す端子領域106に入力される信号が入力される配線に対応する。
図3は、センサ画素110のタイミングチャートである。図3に示すタイミングチャートにおけるGate、SVS、DCH、RST、Sig、VR1、SVGはそれぞれ、図1に示す端子領域106に入力される信号、及び図2に示す第1配線~第7配線に入力される信号に対応する。また、Gate1は、1行目の第3配線Gate1に相当し、Gate84は、84行目の第3配線Gate84に相当する。
次に、光センサ装置100の構造について、図4乃至図7を参照して詳細に説明する。図4は、光センサ装置100の平面レイアウト図である。図5は、光センサ装置100のポリシリコンを用いたトランジスタの平面レイアウトである。図6は、光センサ装置100の酸化物半導体を用いたトランジスタの平面レイアウトである。なお、図4~図6において、半導体層及び導電層のみを図示し、絶縁膜については図示を省略している。
図7は、図4に示すセンサ画素110をA1-A2線で切断した断面と、B1-B2線で切断した断面と、を合わせて図示したものである。また、図7には、図4で図示されていない駆動回路104_Rの断面も示している。図7では、センサ画素110として、トランジスタ201、トランジスタ203、及び容量素子205の断面図を示し、周辺領域103として、駆動回路104_Rにおけるトランジスタ210の断面図を示す。なお、駆動回路104_L、及び保護回路105_R、105_Lを構成するトランジスタの構成も、トランジスタ210と同様である。センサ画素110には、基板211の裏面側から光が照射される。
本発明の一実施形態に係る光センサ装置100の製造方法について、図8乃至図10を参照して説明する。図8乃至図10に示す断面図は、図7に示す断面図に対応する。
Claims (9)
- 基板と、
基板上に設けられた画素領域に第1トランジスタ、第2トランジスタ、及び第1遮光層と、
前記基板上に設けられた容量素子と、を含み、
前記第1トランジスタは、
前記基板上に設けられた第1ポリシリコン層と、
前記第1ポリシリコン層上に設けられた第1絶縁膜と、
前記第1絶縁膜上に設けられ前記第1ポリシリコン層と重なる領域を有する第1ゲート電極と、
前記第1ゲート電極上に設けられた第2絶縁膜及び第3絶縁膜と、
前記第2絶縁膜及び前記第3絶縁膜に設けられた開口部を介して、前記第1ポリシリコン層と電気的に接続する第1ソース電極及び第1ドレイン電極と、を含み、
前記第2トランジスタは、
前記第2絶縁膜上に設けられた酸化物半導体層と、
前記酸化物半導体層上に設けられた前記第3絶縁膜と、
前記第3絶縁膜上に設けられた第2ゲート電極と、
前記第2ゲート電極上に設けられた第4絶縁膜と、
前記第4絶縁膜に設けられた開口部を介して、前記酸化物半導体層と電気的に接続する第2ソース電極及び第2ドレイン電極と、を含み、
前記第1遮光層は、前記第1絶縁膜と前記第2絶縁膜との間に設けられ、前記酸化物半導体層と重畳する領域を有し、
前記第1トランジスタ及び前記第2トランジスタがオフ状態の場合に、前記基板側から前記第1ポリシリコン層に入射される光の光量に応じて、前記容量素子に蓄積する電荷の量を制御するように構成される、光センサ装置。 - 前記第1ソース電極及び前記第1ドレイン電極の一方は、前記第2ソース電極及び前記第2ドレイン電極の一方と電気的に接続される、請求項1に記載の光センサ装置。
- 前記容量素子は、前記第3絶縁膜上に設けられた第1電極と、前記第4絶縁膜と、前記第4絶縁膜上に設けられた第2電極と、で構成される、請求項1に記載の光センサ装置。
- 前記第2ソース電極及び前記第2ドレイン電極の他方は、前記第2電極と、電気的に接続される、請求項3に記載の光センサ装置。
- 前記第1ゲート電極は、前記第1遮光層と同じ導電材料で構成される、請求項1に記載の光センサ装置。
- 前記第1ソース電極及び前記第1ドレイン電極は、前記第2ゲート電極と、同じ導電材料で構成される、請求項1に記載の光センサ装置。
- 前記第1トランジスタがオフ状態の場合に、前記第2トランジスタをオフ状態からオン状態に変化させることで、前記容量素子に蓄積された電荷を読み出すように構成される、請求項1に記載の光センサ装置。
- 前記基板上に設けられ、前記画素領域の周辺に設けられた駆動回路に、第3トランジスタをさらに有し、
前記第3トランジスタは、
前記基板上に設けられた第2遮光層と、
前記第2遮光層上に設けられた第5絶縁膜と、
前記第5絶縁膜上に設けられ前記第2遮光層と重なる領域を有する第2ポリシリコン層と、
前記第2ポリシリコン層上に設けられた前記第1絶縁膜と、
前記第1絶縁膜上に設けられ前記第2ポリシリコン層と重なる領域を有する第3ゲート電極と、
前記第3ゲート電極上に設けられた前記第2絶縁膜及び前記第3絶縁膜と、
前記第2絶縁膜及び前記第3絶縁膜に設けられた開口部を介して、前記第2ポリシリコン層と電気的に接続する第3ソース電極及び第3ドレイン電極と、を含む、請求項4に記載の光センサ装置。 - 前記第2遮光層は、前記第1遮光層よりも下層に設けられる、請求項8に記載の光センサ装置。
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