KR20210112306A - 변성 에폭시 수지, 에폭시 수지 조성물, 경화물, 및 전기·전자 회로용 적층판 - Google Patents

변성 에폭시 수지, 에폭시 수지 조성물, 경화물, 및 전기·전자 회로용 적층판 Download PDF

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Publication number
KR20210112306A
KR20210112306A KR1020217018119A KR20217018119A KR20210112306A KR 20210112306 A KR20210112306 A KR 20210112306A KR 1020217018119 A KR1020217018119 A KR 1020217018119A KR 20217018119 A KR20217018119 A KR 20217018119A KR 20210112306 A KR20210112306 A KR 20210112306A
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KR
South Korea
Prior art keywords
epoxy resin
group
substituent
modified
resin composition
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KR1020217018119A
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English (en)
Korean (ko)
Inventor
다카아키 와타나베
Original Assignee
미쯔비시 케미컬 주식회사
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Publication of KR20210112306A publication Critical patent/KR20210112306A/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020217018119A 2019-01-10 2020-01-07 변성 에폭시 수지, 에폭시 수지 조성물, 경화물, 및 전기·전자 회로용 적층판 KR20210112306A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-002733 2019-01-10
JP2019002733 2019-01-10
PCT/JP2020/000152 WO2020145262A1 (ja) 2019-01-10 2020-01-07 変性エポキシ樹脂、エポキシ樹脂組成物、硬化物、及び電気・電子回路用積層板

Publications (1)

Publication Number Publication Date
KR20210112306A true KR20210112306A (ko) 2021-09-14

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Country Status (5)

Country Link
JP (1) JP7338479B2 (ja)
KR (1) KR20210112306A (ja)
CN (1) CN113227191A (ja)
TW (1) TW202031714A (ja)
WO (1) WO2020145262A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202235531A (zh) 2020-12-02 2022-09-16 日商味之素股份有限公司 樹脂組成物
WO2023042650A1 (ja) * 2021-09-14 2023-03-23 日鉄ケミカル＆マテリアル株式会社 変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及び変性エポキシ樹脂の製造方法
WO2023053875A1 (ja) * 2021-09-29 2023-04-06 日鉄ケミカル＆マテリアル株式会社 変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及び変性エポキシ樹脂の製造方法
CN116041670A (zh) * 2022-12-20 2023-05-02 江苏扬农锦湖化工有限公司 一种酸改性环氧树脂及其制备方法和应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08333437A (ja) 1995-06-07 1996-12-17 Dainippon Ink & Chem Inc エポキシ樹脂組成物及びエポキシ樹脂の製造法

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JP3497560B2 (ja) * 1994-04-27 2004-02-16 ジャパンエポキシレジン株式会社 変性エポキシ樹脂の製造方法と製造された変性エポキシ樹脂及びこのエポキシ樹脂の組成物
JP4369559B2 (ja) * 1998-07-15 2009-11-25 三井化学株式会社 ホスフィンスルフィド、その製造方法、およびその用途
JP4241056B2 (ja) * 2003-01-17 2009-03-18 Ｄｉｃ株式会社 エポキシ樹脂組成物、エポキシ樹脂硬化剤
CN101313244B (zh) * 2005-12-27 2010-04-21 三井化学株式会社 液晶密封剂及使用其的液晶面板的制造方法
JP6171274B2 (ja) * 2012-06-27 2017-08-02 日立化成株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
KR101350997B1 (ko) * 2012-08-21 2014-01-14 주식회사 신아티앤씨 전기적 특성이 우수한 에폭시 화합물 및 그 제조방법
JP6672699B2 (ja) * 2014-10-29 2020-03-25 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法
WO2018008414A1 (ja) * 2016-07-06 2018-01-11 Dic株式会社 エポキシ樹脂とその硬化物
JP7292067B2 (ja) 2019-03-15 2023-06-16 日立Astemo株式会社 ボールネジおよびその製造方法ならびにパワーステアリング装置およびその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08333437A (ja) 1995-06-07 1996-12-17 Dainippon Ink & Chem Inc エポキシ樹脂組成物及びエポキシ樹脂の製造法

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JP7338479B2 (ja) 2023-09-05
CN113227191A (zh) 2021-08-06
TW202031714A (zh) 2020-09-01
WO2020145262A1 (ja) 2020-07-16
JP2020111735A (ja) 2020-07-27

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