JPWO2023042650A1 - - Google Patents
Info
- Publication number
- JPWO2023042650A1 JPWO2023042650A1 JP2023548390A JP2023548390A JPWO2023042650A1 JP WO2023042650 A1 JPWO2023042650 A1 JP WO2023042650A1 JP 2023548390 A JP2023548390 A JP 2023548390A JP 2023548390 A JP2023548390 A JP 2023548390A JP WO2023042650 A1 JPWO2023042650 A1 JP WO2023042650A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021149238 | 2021-09-14 | ||
| PCT/JP2022/032493 WO2023042650A1 (ja) | 2021-09-14 | 2022-08-30 | 変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及び変性エポキシ樹脂の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023042650A1 true JPWO2023042650A1 (ja) | 2023-03-23 |
Family
ID=85602167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023548390A Pending JPWO2023042650A1 (ja) | 2021-09-14 | 2022-08-30 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023042650A1 (ja) |
| TW (1) | TW202311337A (ja) |
| WO (1) | WO2023042650A1 (ja) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3642353B2 (ja) * | 1995-06-07 | 2005-04-27 | 大日本インキ化学工業株式会社 | エポキシ樹脂組成物及びエポキシ樹脂の製造法 |
| JPH10168287A (ja) * | 1996-12-06 | 1998-06-23 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物 |
| JP6672699B2 (ja) * | 2014-10-29 | 2020-03-25 | 三菱ケミカル株式会社 | エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法 |
| JP6686666B2 (ja) * | 2016-04-21 | 2020-04-22 | 三菱ケミカル株式会社 | エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法 |
| JP7069613B2 (ja) * | 2017-09-19 | 2022-05-18 | 三菱ケミカル株式会社 | エポキシ樹脂、エポキシ樹脂組成物、硬化物、及び電気・電子回路用積層板 |
| JP2019059867A (ja) * | 2017-09-27 | 2019-04-18 | 三菱ケミカル株式会社 | エポキシ樹脂、エポキシ樹脂組成物及び硬化物 |
| JP2019172996A (ja) * | 2018-03-28 | 2019-10-10 | 三菱ケミカル株式会社 | エポキシ樹脂、エポキシ樹脂組成物及び硬化物 |
| CN113227191A (zh) * | 2019-01-10 | 2021-08-06 | 三菱化学株式会社 | 改性环氧树脂、环氧树脂组合物、固化物及电气/电子电路用层叠板 |
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2022
- 2022-08-30 TW TW111132641A patent/TW202311337A/zh unknown
- 2022-08-30 WO PCT/JP2022/032493 patent/WO2023042650A1/ja active Application Filing
- 2022-08-30 JP JP2023548390A patent/JPWO2023042650A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202311337A (zh) | 2023-03-16 |
| WO2023042650A1 (ja) | 2023-03-23 |