JPWO2022070921A1 - - Google Patents

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Publication number
JPWO2022070921A1
JPWO2022070921A1 JP2022553799A JP2022553799A JPWO2022070921A1 JP WO2022070921 A1 JPWO2022070921 A1 JP WO2022070921A1 JP 2022553799 A JP2022553799 A JP 2022553799A JP 2022553799 A JP2022553799 A JP 2022553799A JP WO2022070921 A1 JPWO2022070921 A1 JP WO2022070921A1
Authority
JP
Japan
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Application number
JP2022553799A
Other versions
JP7487326B2 (ja
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Publication of JPWO2022070921A1 publication Critical patent/JPWO2022070921A1/ja
Application granted granted Critical
Publication of JP7487326B2 publication Critical patent/JP7487326B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48—Polymers modified by chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
JP2022553799A 2020-09-30 2021-09-15 変性フェノキシ樹脂、その製造方法、樹脂組成物、硬化物、電気・電子回路用積層板 Active JP7487326B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020165557 2020-09-30
JP2020165557 2020-09-30
PCT/JP2021/033919 WO2022070921A1 (ja) 2020-09-30 2021-09-15 変性フェノキシ樹脂、その製造方法、樹脂組成物、硬化物、電気・電子回路用積層板

Publications (2)

Publication Number Publication Date
JPWO2022070921A1 true JPWO2022070921A1 (ja) 2022-04-07
JP7487326B2 JP7487326B2 (ja) 2024-05-20

Family

ID=80950257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022553799A Active JP7487326B2 (ja) 2020-09-30 2021-09-15 変性フェノキシ樹脂、その製造方法、樹脂組成物、硬化物、電気・電子回路用積層板

Country Status (3)

Country Link
JP (1) JP7487326B2 (ja)
TW (1) TW202214736A (ja)
WO (1) WO2022070921A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI824889B (zh) * 2022-12-18 2023-12-01 台光電子材料股份有限公司 樹脂組合物及其製品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5326188B2 (ja) 2006-04-04 2013-10-30 Ｄｉｃ株式会社 樹脂組成物、フェノキシ樹脂、塗料組成物、接着剤組成物、接着フィルム、プリプレグ、多層プリント配線基板及び樹脂付銅箔
JP6672699B2 (ja) * 2014-10-29 2020-03-25 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法
TW202142585A (zh) 2020-03-19 2021-11-16 日商日鐵化學材料股份有限公司 苯氧基樹脂、樹脂組成物、硬化物、電氣電子電路用積層板、及苯氧基樹脂的製造方法

Also Published As

Publication number Publication date
WO2022070921A1 (ja) 2022-04-07
JP7487326B2 (ja) 2024-05-20
TW202214736A (zh) 2022-04-16

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