JPWO2022255122A1 - - Google Patents

Info

Publication number
JPWO2022255122A1
JPWO2022255122A1 JP2023525725A JP2023525725A JPWO2022255122A1 JP WO2022255122 A1 JPWO2022255122 A1 JP WO2022255122A1 JP 2023525725 A JP2023525725 A JP 2023525725A JP 2023525725 A JP2023525725 A JP 2023525725A JP WO2022255122 A1 JPWO2022255122 A1 JP WO2022255122A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023525725A
Other versions
JPWO2022255122A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022255122A1 publication Critical patent/JPWO2022255122A1/ja
Publication of JPWO2022255122A5 publication Critical patent/JPWO2022255122A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
JP2023525725A 2021-06-04 2022-05-19 Pending JPWO2022255122A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021094424 2021-06-04
PCT/JP2022/020887 WO2022255122A1 (ja) 2021-06-04 2022-05-19 リン含有変性エポキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びリン含有変性エポキシ樹脂の製造方法

Publications (2)

Publication Number Publication Date
JPWO2022255122A1 true JPWO2022255122A1 (ja) 2022-12-08
JPWO2022255122A5 JPWO2022255122A5 (ja) 2024-02-01

Family

ID=84323263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023525725A Pending JPWO2022255122A1 (ja) 2021-06-04 2022-05-19

Country Status (3)

Country Link
JP (1) JPWO2022255122A1 (ja)
TW (1) TW202248266A (ja)
WO (1) WO2022255122A1 (ja)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3268498B2 (ja) * 1990-05-01 2002-03-25 東都化成株式会社 リン含有難燃性エポキシ樹脂
JPH10168287A (ja) * 1996-12-06 1998-06-23 Dainippon Ink & Chem Inc エポキシ樹脂組成物
TW202142584A (zh) * 2020-03-27 2021-11-16 日商日鐵化學材料股份有限公司 含磷的苯氧基樹脂、樹脂組成物、硬化物、電氣電子電路用積層板、及含磷的苯氧基樹脂的製造方法

Also Published As

Publication number Publication date
TW202248266A (zh) 2022-12-16
WO2022255122A1 (ja) 2022-12-08

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231024

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231102