JPWO2022209609A1 - - Google Patents
Info
- Publication number
- JPWO2022209609A1 JPWO2022209609A1 JP2023510739A JP2023510739A JPWO2022209609A1 JP WO2022209609 A1 JPWO2022209609 A1 JP WO2022209609A1 JP 2023510739 A JP2023510739 A JP 2023510739A JP 2023510739 A JP2023510739 A JP 2023510739A JP WO2022209609 A1 JPWO2022209609 A1 JP WO2022209609A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021059334 | 2021-03-31 | ||
| PCT/JP2022/009762 WO2022209609A1 (ja) | 2021-03-31 | 2022-03-07 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022209609A1 true JPWO2022209609A1 (ja) | 2022-10-06 |
Family
ID=83458628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023510739A Pending JPWO2022209609A1 (ja) | 2021-03-31 | 2022-03-07 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022209609A1 (ja) |
| WO (1) | WO2022209609A1 (ja) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1050927A (ja) * | 1996-08-06 | 1998-02-20 | Hitachi Chem Co Ltd | マルチチップ実装法 |
| JP2003017658A (ja) * | 2001-06-28 | 2003-01-17 | Toshiba Corp | 電力用半導体装置 |
| JP5098284B2 (ja) * | 2006-10-16 | 2012-12-12 | 富士電機株式会社 | 半導体装置 |
| JP2010219211A (ja) * | 2009-03-16 | 2010-09-30 | Mitsubishi Electric Corp | 電力用半導体装置 |
| JP5840228B2 (ja) * | 2011-12-28 | 2016-01-06 | 三菱電機株式会社 | 炭化珪素半導体素子の製造方法及び炭化珪素半導体モジュールの製造方法 |
| JP2013187494A (ja) * | 2012-03-09 | 2013-09-19 | Hitachi Ltd | 半導体装置 |
| JP5665786B2 (ja) * | 2012-03-26 | 2015-02-04 | 三菱電機株式会社 | 半導体装置 |
| JP6143687B2 (ja) * | 2014-02-18 | 2017-06-07 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| DE102015200980A1 (de) * | 2015-01-22 | 2016-07-28 | Robert Bosch Gmbh | Verbindungsanordnung zwischen einem Trägerelement und einem elektronischen Schaltungsbauteil und elektronische Baugruppe |
| JP6487122B2 (ja) * | 2016-06-14 | 2019-03-20 | 三菱電機株式会社 | 電力用半導体装置 |
| WO2018173511A1 (ja) * | 2017-03-22 | 2018-09-27 | 株式会社デンソー | 半導体装置 |
| JPWO2020012810A1 (ja) * | 2018-07-11 | 2021-07-08 | 住友電気工業株式会社 | 炭化珪素半導体装置 |
-
2022
- 2022-03-07 JP JP2023510739A patent/JPWO2022209609A1/ja active Pending
- 2022-03-07 WO PCT/JP2022/009762 patent/WO2022209609A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022209609A1 (ja) | 2022-10-06 |