KR20160150601A - 웨이퍼 건조 장치 및 웨이퍼 건조 방법 - Google Patents

웨이퍼 건조 장치 및 웨이퍼 건조 방법 Download PDF

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Publication number
KR20160150601A
KR20160150601A KR1020160077579A KR20160077579A KR20160150601A KR 20160150601 A KR20160150601 A KR 20160150601A KR 1020160077579 A KR1020160077579 A KR 1020160077579A KR 20160077579 A KR20160077579 A KR 20160077579A KR 20160150601 A KR20160150601 A KR 20160150601A
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KR
South Korea
Prior art keywords
wafer
inert gas
liquid
nozzle
suction nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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KR1020160077579A
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English (en)
Korean (ko)
Inventor
마사요시 이마이
사토미 하마다
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20160150601A publication Critical patent/KR20160150601A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H10P70/12—
    • H10P72/0408—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
    • F26B15/10—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions
    • F26B15/12—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined
    • F26B21/40—
    • F26B21/50—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/12—Drying solid materials or objects by processes not involving the application of heat by suction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/16—Drying solid materials or objects by processes not involving the application of heat by contact with sorbent bodies, e.g. absorbent mould; by admixture with sorbent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H10P14/6508—
    • H10P72/0402—
    • H10P72/0406—
    • H10P72/0441—
    • H10P72/0448—
    • H10P72/3208—
    • H10P72/3314—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B2200/00—Drying processes and machines for solid materials characterised by the specific requirements of the drying good
    • F26B2200/12—Manure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020160077579A 2015-06-22 2016-06-21 웨이퍼 건조 장치 및 웨이퍼 건조 방법 Ceased KR20160150601A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015124538A JP6367763B2 (ja) 2015-06-22 2015-06-22 ウェーハ乾燥装置およびウェーハ乾燥方法
JPJP-P-2015-124538 2015-06-22

Publications (1)

Publication Number Publication Date
KR20160150601A true KR20160150601A (ko) 2016-12-30

Family

ID=57588384

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160077579A Ceased KR20160150601A (ko) 2015-06-22 2016-06-21 웨이퍼 건조 장치 및 웨이퍼 건조 방법

Country Status (4)

Country Link
US (1) US10229841B2 (enExample)
JP (1) JP6367763B2 (enExample)
KR (1) KR20160150601A (enExample)
SG (1) SG10201605035VA (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210075566A (ko) * 2019-12-13 2021-06-23 세메스 주식회사 박막 식각 방법 및 장치
KR20220000830A (ko) * 2020-06-26 2022-01-04 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치 및 기판 처리 방법

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6367763B2 (ja) * 2015-06-22 2018-08-01 株式会社荏原製作所 ウェーハ乾燥装置およびウェーハ乾燥方法
BR112018013095B1 (pt) * 2016-03-29 2023-04-18 Nippon Steel Corporation Método para remoção de líquidos
JP7370884B2 (ja) * 2020-01-31 2023-10-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN111463152B (zh) * 2020-04-17 2023-03-14 重庆芯洁科技有限公司 半导体衬底的高压水洗设备及其使用方法
CN114496719A (zh) * 2020-11-12 2022-05-13 中国科学院微电子研究所 一种用于干燥晶圆的方法及干燥设备
CN112665324B (zh) * 2020-12-28 2022-04-15 安徽省元进金元钙业有限公司 一种用于生石灰生产的原料干燥流水线
IT202100001577A1 (it) * 2021-01-27 2022-07-27 Cefla Soc Cooperativa Apparato e metodo per l’essiccazione/polimerizzazione di prodotti chimici
JP2023125257A (ja) * 2022-02-28 2023-09-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板検知方法
CN114562874B (zh) * 2022-03-02 2023-07-04 浙江光特科技有限公司 一种用于晶圆清洗后烘干处理装置

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JPH11340184A (ja) 1998-05-22 1999-12-10 Nec Corp 半導体装置の製造方法
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JP2005322936A (ja) 1997-09-10 2005-11-17 Speedfam-Ipec Corp 組み合わせｃｍｐおよびウエハ洗浄器具および関連方法
JP2006073573A (ja) 2004-08-31 2006-03-16 Kazuo Tanabe ストッカ付ウエーハ洗浄装置
JP2006247618A (ja) 2005-03-14 2006-09-21 Dainippon Screen Mfg Co Ltd 二流体ノズルおよび該二流体ノズルを用いた基板処理装置
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JP2010118644A (ja) 2008-10-15 2010-05-27 Dainippon Screen Mfg Co Ltd 基板処理装置

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JP2001501030A (ja) 1996-08-29 2001-01-23 オントラック・システムズ・インコーポレーテッド ブラシ・アセンブリ装置
JPH10270392A (ja) 1997-03-26 1998-10-09 Super Silicon Kenkyusho:Kk ウエハの表面洗浄方法およびウエハの総合研磨洗浄装置
JP2005322936A (ja) 1997-09-10 2005-11-17 Speedfam-Ipec Corp 組み合わせｃｍｐおよびウエハ洗浄器具および関連方法
JPH11340184A (ja) 1998-05-22 1999-12-10 Nec Corp 半導体装置の製造方法
JP2002217151A (ja) 2001-01-16 2002-08-02 Super Silicon Kenkyusho:Kk 半導体ウエハ研磨方法及び装置
JP2004022940A (ja) 2002-06-19 2004-01-22 Tokyo Seimitsu Co Ltd 研磨装置、研磨方法、ウェーハ待避プログラム
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JP2010118644A (ja) 2008-10-15 2010-05-27 Dainippon Screen Mfg Co Ltd 基板処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210075566A (ko) * 2019-12-13 2021-06-23 세메스 주식회사 박막 식각 방법 및 장치
KR20220000830A (ko) * 2020-06-26 2022-01-04 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치 및 기판 처리 방법

Also Published As

Publication number Publication date
JP6367763B2 (ja) 2018-08-01
JP2017011083A (ja) 2017-01-12
SG10201605035VA (en) 2017-01-27
US10229841B2 (en) 2019-03-12
US20160372344A1 (en) 2016-12-22

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