KR20160103113A - 적층체, 적층 디바이스 및 이들의 제조 방법 - Google Patents
적층체, 적층 디바이스 및 이들의 제조 방법 Download PDFInfo
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- KR20160103113A KR20160103113A KR1020167020629A KR20167020629A KR20160103113A KR 20160103113 A KR20160103113 A KR 20160103113A KR 1020167020629 A KR1020167020629 A KR 1020167020629A KR 20167020629 A KR20167020629 A KR 20167020629A KR 20160103113 A KR20160103113 A KR 20160103113A
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Abstract
Description
도 2는 적층 세라믹 콘덴서(50)의 개략 단면도이다.
도 3은 실험예 3의 고유전재료의 SEM 사진이다.
도 4는 실험예 42의 고유전재료의 SEM 사진이다.
20a: 고유전체층 20b: 고유전체 더미층
22: 제1 입자부 24: 제1 입계부
30: 제2 재료층 30a: 저유전체층
30b: 저유전체 더미층 32: 제2 입자부
34: 제2 입계부 50: 적층 세라믹 콘덴서
52: 내부 전극 54: 외부 전극
54a: 비아 도체 56: 내부 전극
58: 외부 전극 58a: 비아 도체
Claims (27)
- BaTiO3의 일부에 Ba, Ti 이외의 금속 원소를 포함하는 화합물인 제1 입자부와, 상기 제1 입자부의 입자들 사이에 존재하며 ZnO를 포함하는 제1 입계부(粒界部)를 포함하고, 제1 유전율을 갖는 제1 재료층과,
제2 입자부와, 상기 제2 입자부의 입자들 사이에 존재하는 제2 입계부를 포함하고, 상기 제1 유전율보다 낮은 제2 유전율을 갖는 제2 재료층
을 구비한 적층체. - 제1항에 있어서, 상기 제1 재료층은, Bi2O3, ZnO, Mn3O4, ZrO2, SnO2, Nb2O5, SrO로 이루어지는 군에서 선택되는 하나 이상을 포함하는 것인 적층체.
- 제1항 또는 제2항에 있어서, 상기 제1 재료층은, Bi2O3, ZnO 및 Mn3O4를 포함하는 것인 적층체.
- 제1항 내지 제3항 중 어느 한 항에 있어서, BaTiO3의 일부에 Ba, Ti 이외의 금속 원소를 포함하는 화합물인 제1 입자 원료와 ZnO를 포함하는 제1 입계부 원료를 포함하는 제1 조제 분말을 성형한 제1 성형체와, 제2 입자 원료와 제2 입계부 원료를 포함하는 제2 조제 분말을 성형한 제2 성형체를 적층한 적층 성형체를 소결하여 얻어진 것인 적층체.
- 제4항에 있어서, 상기 제1 입계부 원료는, Zn-B-O계의 유리이고, 상기 제2 입계부 원료는, Zn-B-O계의 유리, B-Si-Ba-Al-O계의 유리, Si-B-Na-O계의 유리로 이루어지는 군에서 선택되는 하나 이상인 것인 적층체.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 상기 제1 재료층은, Bi2O3를 3.5 질량% 이상 11 질량% 이하, ZnO를 0.6 질량% 이상 5.0 질량% 이하, Mn3O4를 0.01 질량% 이상 1.0 질량% 이하의 범위에서 포함하고, CuO의 함유량이 0.4 질량% 이하인 것인 적층체.
- 제1항 내지 제6항 중 어느 한 항에 있어서, 상기 제1 재료층은, SnO2, ZrO2, Nb2O5, SrO로 이루어지는 군에서 선택되는 하나 이상을 포함하고, 상기 SnO2의 함유량은 1.0 질량% 이하, 상기 ZrO2의 함유량은 2.5 질량% 이하, 상기 Nb2O5의 함유량은 1.0 질량% 이하, 상기 SrO의 함유량은 10 질량% 이하인 것인 적층체.
- 제1항 내지 제7항 중 어느 한 항에 있어서, 상기 제1 재료층은, 비유전율이 1000 이상 3000 이하인 것인 적층체.
- 제1항 내지 제8항 중 어느 한 항에 있어서, 상기 제1 재료층은, 유전 정접(tanδ)이 0.05 이하인 것인 적층체.
- 제1항 내지 제9항 중 어느 한 항에 있어서, 상기 제2 입자부는, Ba 및 Ti 중 적어도 한쪽을 포함하는 텅스텐 브론즈 구조를 갖는 복합 산화물을 포함하는 것인 적층체.
- 제1항 내지 제10항 중 어느 한 항에 있어서, 상기 제2 재료층은, 비유전율이 5 이상 200 이하인 것인 적층체.
- 제1항 내지 제11항 중 어느 한 항에 기재된 적층체와,
상기 적층체와 일체화되며 Ag 또는 Ag 합금인 전극
을 구비한 적층 디바이스. - BaTiO3의 일부에 Ba, Ti 이외의 금속 원소를 포함하는 화합물인 제1 입자 원료와 ZnO를 포함하는 제1 입계부 원료를 포함하는 제1 조제 분말을 성형한 제1 성형체와, 상기 제1 입자 원료보다 비유전율이 작은 제2 입자 원료와 제2 입계부 원료를 포함하는 제2 조제 분말을 성형한 제2 성형체를 적층한 적층 성형체를 소결하는 적층 소결 공정
을 포함하는 적층체의 제조 방법. - 제13항에 있어서, 상기 제1 입자 원료는, BaTiO3 원료와 Ba, Ti 이외의 금속 원소를 포함하는 제1 혼합 분말을 소성한 것인 적층체의 제조 방법.
- 제14항에 있어서, 상기 제1 혼합 분말은, Bi2O3, ZnO, Mn3O4, ZrO2, SnO2, Nb2O5, SrTiO3로 이루어지는 군에서 선택되는 하나 이상을 포함하는 것인 적층체의 제조 방법.
- 제14항 또는 제15항에 있어서, 상기 제1 혼합 분말은, Bi2O3, ZnO 및 Mn3O4를 포함하는 것인 적층체의 제조 방법.
- 제14항 내지 제16항 중 어느 한 항에 있어서, 상기 제1 혼합 분말은, Bi2O3를 3.5 질량% 이상 11 질량% 이하, ZnO를 0.6 질량% 이상 5.0 질량% 이하, Mn3O4를 0.01 질량% 이상 1.0 질량% 이하의 범위에서 포함하고, CuO의 함유량이 0.4 질량% 이하인 것인 적층체의 제조 방법.
- 제14항 내지 제17항 중 어느 한 항에 있어서, 상기 제1 혼합 분말은, SnO2, ZrO2, Nb2O5로 이루어지는 군에서 선택되는 하나 이상을 포함하고, 상기 SnO2의 함유량은 15 질량% 이하, 상기 ZrO2의 함유량은 25 질량% 이하, 상기 Nb2O5의 함유량은 1.0 질량% 이하인 것인 적층체의 제조 방법.
- 제13항 내지 제18항 중 어느 한 항에 있어서, 상기 제1 조제 분말은, 상기 제1 입계부 원료를 0.5 체적% 이상 15 체적% 이하의 범위에서 포함하는 것인 적층체의 제조 방법.
- 제13항 내지 제19항 중 어느 한 항에 있어서, 상기 제2 조제 분말은, 상기 제2 입계부 원료를 0.5 체적% 이상 15 체적% 이하의 범위에서 포함하는 것인 적층체의 제조 방법.
- 제13항 내지 제20항 중 어느 한 항에 있어서, 상기 제1 조제 분말은, 상기 제1 입자 원료로서, 조성이 상이한 2종 이상의 입자를 포함하는 것인 적층체의 제조 방법.
- 제13항 내지 제21항 중 어느 한 항에 있어서, 상기 제1 조제 분말은 SrTiO3를 더 포함하는 것인 적층체의 제조 방법.
- 제13항 내지 제22항 중 어느 한 항에 있어서, 상기 적층 소결 공정에서는, 상기 적층 성형체를 800℃ 이상 1000℃ 이하의 소결 온도에서 소결하는 것인 적층체의 제조 방법.
- 제13항 내지 제23항 중 어느 한 항에 있어서, 상기 제2 입자 원료는, Ba 및 Ti 중 적어도 한쪽을 포함하는 텅스텐 브론즈 구조를 갖는 복합 산화물을 포함하는 것인 적층체의 제조 방법.
- 제13항 내지 제24항 중 어느 한 항에 있어서, 상기 제1 입계부 원료는, Zn-B-O계의 유리이고, 상기 제2 입계부 원료는, Zn-B-O계의 유리, B-Si-Ba-Al-O계의 유리, Si-B-Na-O계의 유리로 이루어지는 군에서 선택되는 하나 이상인 것인 적층체의 제조 방법.
- 제13항 내지 제25항 중 어느 한 항에 있어서, 상기 제1 조제 분말에 포함되는 상기 제1 입계부 원료의 비율(체적%)과 상기 제2 조제 분말에 포함되는 상기 제2 입계부 원료의 비율(체적%)의 차가 ±5 체적% 이내인 것인 적층체의 제조 방법.
- BaTiO3의 일부에 Ba, Ti 이외의 금속 원소를 포함하는 화합물인 제1 입자 원료와 ZnO를 포함하는 제1 입계부 원료를 포함하는 제1 조제 분말을 성형한 제1 성형체와, 상기 제1 입자 원료보다 비유전율이 작은 제2 입자 원료와 제2 입계부 원료를 포함하는 제2 조제 분말을 성형한 제2 성형체와, Ag 또는 Ag 합금을 포함하는 전극 재료를 적층한 전극을 갖는 적층 성형체를 소결하는 적층 소결 공정
을 포함하는 적층 디바이스의 제조 방법.
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