KR20120137238A - 반도체 장치 및 반도체 장치의 제조 방법 - Google Patents

반도체 장치 및 반도체 장치의 제조 방법 Download PDF

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KR20120137238A
KR20120137238A KR1020120058005A KR20120058005A KR20120137238A KR 20120137238 A KR20120137238 A KR 20120137238A KR 1020120058005 A KR1020120058005 A KR 1020120058005A KR 20120058005 A KR20120058005 A KR 20120058005A KR 20120137238 A KR20120137238 A KR 20120137238A
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semiconductor device
alignment mark
alignment
semiconductor
layer
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KR1020120058005A
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Korean (ko)
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사토루 와키야마
마사키 미나미
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소니 주식회사
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    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
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    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
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    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
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    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
    • H10W72/01233—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01235—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
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    • H10W72/01251—Changing the shapes of bumps
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    • H10W72/01251—Changing the shapes of bumps
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    • H10W72/01271—Cleaning, e.g. oxide removal or de-smearing
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    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H10W72/01333—Manufacture or treatment of die-attach connectors using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
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    • H10W72/01336—Manufacture or treatment of die-attach connectors using blanket deposition in solid form, e.g. by using a powder or by laminating a foil
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    • H10W72/07221—Aligning
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    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
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    • H10W72/222—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core
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    • H10W72/242—Dispositions, e.g. layouts relative to the surface, e.g. recessed, protruding
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    • H10W72/247—Dispositions of multiple bumps
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    • H10W90/791—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads
    • H10W90/792—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads between multiple chips

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  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
KR1020120058005A 2011-06-09 2012-05-31 반도체 장치 및 반도체 장치의 제조 방법 Ceased KR20120137238A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011129192A JP2012256737A (ja) 2011-06-09 2011-06-09 半導体装置及び半導体装置の製造方法
JPJP-P-2011-129192 2011-06-09

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020190054795A Division KR102071823B1 (ko) 2011-06-09 2019-05-10 반도체 장치 및 반도체 장치의 제조 방법

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