KR20080057325A - 금속 배선 부착 기판의 제조 방법 - Google Patents

금속 배선 부착 기판의 제조 방법 Download PDF

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Publication number
KR20080057325A
KR20080057325A KR1020087010394A KR20087010394A KR20080057325A KR 20080057325 A KR20080057325 A KR 20080057325A KR 1020087010394 A KR1020087010394 A KR 1020087010394A KR 20087010394 A KR20087010394 A KR 20087010394A KR 20080057325 A KR20080057325 A KR 20080057325A
Authority
KR
South Korea
Prior art keywords
substrate
resist pattern
pattern
board
metal
Prior art date
Application number
KR1020087010394A
Other languages
English (en)
Korean (ko)
Inventor
도모히코 우시지마
다케오 후지노
Original Assignee
제온 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제온 코포레이션 filed Critical 제온 코포레이션
Publication of KR20080057325A publication Critical patent/KR20080057325A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0594—Insulating resist or coating with special shaped edges

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
KR1020087010394A 2005-09-30 2006-09-29 금속 배선 부착 기판의 제조 방법 KR20080057325A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005288721 2005-09-30
JPJP-P-2005-00288721 2005-09-30

Publications (1)

Publication Number Publication Date
KR20080057325A true KR20080057325A (ko) 2008-06-24

Family

ID=37899946

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087010394A KR20080057325A (ko) 2005-09-30 2006-09-29 금속 배선 부착 기판의 제조 방법

Country Status (5)

Country Link
JP (1) JP4978800B2 (ja)
KR (1) KR20080057325A (ja)
CN (1) CN101278239B (ja)
TW (1) TW200731027A (ja)
WO (1) WO2007037553A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110076578A (ko) * 2009-12-29 2011-07-06 엘지디스플레이 주식회사 배선 형성 방법 및 이를 이용한 액정표시장치 제조방법
KR101159514B1 (ko) * 2007-05-24 2012-06-26 프린코 코포레이션 다층기판 금속배선 제조방법 및 그 구조

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CN101312620B (zh) * 2007-05-24 2011-06-22 巨擘科技股份有限公司 多层基板金属线路制造方法及其结构
TWI354523B (en) 2007-05-25 2011-12-11 Princo Corp Method for manufacturing metal lines in multi-laye
US8815333B2 (en) 2007-12-05 2014-08-26 Princo Middle East Fze Manufacturing method of metal structure in multi-layer substrate
KR101920766B1 (ko) 2011-08-09 2018-11-22 엘지디스플레이 주식회사 유기 발광 표시 장치의 제조 방법
JP6056294B2 (ja) * 2011-09-28 2017-01-11 大日本印刷株式会社 パターンの形成方法
DE102013105972B4 (de) * 2012-06-20 2016-11-03 Lg Display Co., Ltd. Verfahren zum Herstellen einer organischen lichtemittierenden Dioden-Anzeigevorrichtung
JPWO2014050421A1 (ja) * 2012-09-25 2016-08-22 東レ株式会社 配線パターンの形成方法および配線パターン形成物
US9568362B2 (en) 2012-12-19 2017-02-14 Viavi Solutions Inc. Spectroscopic assembly and method
US9448346B2 (en) 2012-12-19 2016-09-20 Viavi Solutions Inc. Sensor device including one or more metal-dielectric optical filters
US10197716B2 (en) 2012-12-19 2019-02-05 Viavi Solutions Inc. Metal-dielectric optical filter, sensor device, and fabrication method
CN103839794B (zh) * 2014-02-25 2016-08-17 京东方科技集团股份有限公司 透明导电电极及阵列基板的制备方法
EP3158371A4 (en) * 2014-06-18 2018-05-16 Viavi Solutions Inc. Metal-dielectric optical filter, sensor device, and fabrication method
CN104319293A (zh) * 2014-11-10 2015-01-28 京东方科技集团股份有限公司 金属氧化物薄膜晶体管、阵列基板及制作方法、显示装置
CN106711017B (zh) * 2015-07-20 2020-08-04 潍坊星泰克微电子材料有限公司 利用光刻胶沉积金属构形的方法
CN107731883A (zh) * 2017-11-17 2018-02-23 深圳市华星光电半导体显示技术有限公司 Oled显示器及其制作方法
CN108389784B (zh) * 2018-02-26 2019-04-30 清华大学 图案化的金属层的制备方法
CN108585540A (zh) * 2018-04-17 2018-09-28 信利光电股份有限公司 一种玻璃材料表面图案制作方法、玻璃板及电子装置

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US4115120A (en) * 1977-09-29 1978-09-19 International Business Machines Corporation Method of forming thin film patterns by differential pre-baking of resist
JPS6119128A (ja) * 1984-07-05 1986-01-28 Sony Corp パタ−ン形成方法
JPS61103151A (ja) * 1984-10-27 1986-05-21 Dainippon Printing Co Ltd 多層誘電体薄膜のパタ−ニング方法
JPS61221747A (ja) * 1985-03-27 1986-10-02 Mitsubishi Electric Corp 感光性樹脂膜の形成方法
JPH03235322A (ja) * 1990-02-13 1991-10-21 Nec Corp レジストパターン形成方法
JPH06275510A (ja) * 1993-03-23 1994-09-30 Matsushita Electric Ind Co Ltd 微細パターン形成方法
JP2973874B2 (ja) * 1994-06-23 1999-11-08 信越化学工業株式会社 パターン形成方法
JP3287234B2 (ja) * 1996-09-19 2002-06-04 信越化学工業株式会社 リフトオフ法用ポジ型レジスト組成物及びパターン形成方法
JP2002267833A (ja) * 2001-03-14 2002-09-18 Toray Ind Inc 液晶ディスプレイ用カラーフィルタの製造方法。
JP2003198009A (ja) * 2001-12-28 2003-07-11 Sharp Corp 電極の形成方法、液晶表示装置の製造方法及び液晶表示装置
JP2005338831A (ja) * 2004-05-25 2005-12-08 Samsung Electronics Co Ltd 液晶表示装置の有機膜フォトレジスト組成物、そのスピンレスコーティング方法、これを用いた有機膜パターン形成方法及びこれにより製造された液晶表示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101159514B1 (ko) * 2007-05-24 2012-06-26 프린코 코포레이션 다층기판 금속배선 제조방법 및 그 구조
KR20110076578A (ko) * 2009-12-29 2011-07-06 엘지디스플레이 주식회사 배선 형성 방법 및 이를 이용한 액정표시장치 제조방법

Also Published As

Publication number Publication date
JPWO2007037553A1 (ja) 2009-04-16
JP4978800B2 (ja) 2012-07-18
TW200731027A (en) 2007-08-16
CN101278239B (zh) 2011-11-16
CN101278239A (zh) 2008-10-01
WO2007037553A9 (ja) 2007-05-31
WO2007037553A1 (ja) 2007-04-05

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