KR20070054719A - 낮은 나선 전위 밀도를 가지는 3인치 실리콘 카바이드웨이퍼 - Google Patents
낮은 나선 전위 밀도를 가지는 3인치 실리콘 카바이드웨이퍼 Download PDFInfo
- Publication number
- KR20070054719A KR20070054719A KR1020077007696A KR20077007696A KR20070054719A KR 20070054719 A KR20070054719 A KR 20070054719A KR 1020077007696 A KR1020077007696 A KR 1020077007696A KR 20077007696 A KR20077007696 A KR 20077007696A KR 20070054719 A KR20070054719 A KR 20070054719A
- Authority
- KR
- South Korea
- Prior art keywords
- silicon carbide
- wafer
- helix
- dislocation density
- bowl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 103
- 229910010271 silicon carbide Inorganic materials 0.000 title claims description 84
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims abstract description 18
- 235000012431 wafers Nutrition 0.000 claims description 67
- 239000013078 crystal Substances 0.000 claims description 61
- 238000000034 method Methods 0.000 claims description 53
- 230000007547 defect Effects 0.000 claims description 31
- 238000000859 sublimation Methods 0.000 claims description 21
- 230000008022 sublimation Effects 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 16
- 238000005530 etching Methods 0.000 claims description 14
- 239000002243 precursor Substances 0.000 claims description 14
- 239000002019 doping agent Substances 0.000 claims description 13
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 230000005669 field effect Effects 0.000 claims description 8
- 229910002804 graphite Inorganic materials 0.000 claims description 7
- 239000010439 graphite Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 238000005498 polishing Methods 0.000 claims description 6
- 238000000407 epitaxy Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229910002704 AlGaN Inorganic materials 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 125000005842 heteroatom Chemical group 0.000 claims description 2
- 239000012535 impurity Substances 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 1
- 239000012080 ambient air Substances 0.000 claims 1
- 238000000137 annealing Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 229910052756 noble gas Inorganic materials 0.000 claims 1
- 239000002994 raw material Substances 0.000 description 12
- 238000005092 sublimation method Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- 239000012212 insulator Substances 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- 125000004429 atom Chemical group 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000005979 thermal decomposition reaction Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005130 seeded sublimation method Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/21—Circular sheet or circular blank
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Junction Field-Effect Transistors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/957,806 US7314520B2 (en) | 2004-10-04 | 2004-10-04 | Low 1c screw dislocation 3 inch silicon carbide wafer |
| US10/957,806 | 2004-10-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20070054719A true KR20070054719A (ko) | 2007-05-29 |
Family
ID=35925857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077007696A Ceased KR20070054719A (ko) | 2004-10-04 | 2005-09-27 | 낮은 나선 전위 밀도를 가지는 3인치 실리콘 카바이드웨이퍼 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US7314520B2 (enExample) |
| EP (2) | EP2584071B1 (enExample) |
| JP (3) | JP2008515748A (enExample) |
| KR (1) | KR20070054719A (enExample) |
| CN (1) | CN101061262B (enExample) |
| TW (1) | TWI313892B (enExample) |
| WO (1) | WO2006041659A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210050856A (ko) | 2019-10-29 | 2021-05-10 | 에스케이씨 주식회사 | 탄화규소 잉곳의 제조방법, 탄화규소 웨이퍼의 제조방법 및 이의 성장 시스템 |
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| US8980445B2 (en) * | 2006-07-06 | 2015-03-17 | Cree, Inc. | One hundred millimeter SiC crystal grown on off-axis seed |
| WO2008033994A1 (en) | 2006-09-14 | 2008-03-20 | Cree, Inc. | Micropipe-free silicon carbide and related method of manufacture |
| JP2010087397A (ja) * | 2008-10-02 | 2010-04-15 | Sumitomo Electric Ind Ltd | 炭化珪素半導体装置 |
| JP2010184833A (ja) * | 2009-02-12 | 2010-08-26 | Denso Corp | 炭化珪素単結晶基板および炭化珪素単結晶エピタキシャルウェハ |
| TW201101484A (en) | 2009-05-11 | 2011-01-01 | Sumitomo Electric Industries | Insulating gate type bipolar transistor |
| CA2759852A1 (en) | 2009-10-30 | 2011-05-05 | Sumitomo Electric Industries, Ltd. | Method for manufacturing silicon carbide substrate and silicon carbide substrate |
| WO2011052321A1 (ja) | 2009-10-30 | 2011-05-05 | 住友電気工業株式会社 | 炭化珪素基板の製造方法および炭化珪素基板 |
| CA2757786A1 (en) | 2009-11-13 | 2011-05-19 | Sumitomo Electric Industries, Ltd. | Method for manufacturing semiconductor substrate |
| CA2758266A1 (en) * | 2009-11-24 | 2011-06-03 | Sumitomo Electric Industries, Ltd. | Method of manufacturing semiconductor substrate |
| KR20120108912A (ko) | 2009-12-16 | 2012-10-05 | 스미토모덴키고교가부시키가이샤 | 탄화규소 기판 |
| JP2011146570A (ja) * | 2010-01-15 | 2011-07-28 | Sumitomo Electric Ind Ltd | 炭化珪素基板 |
| CA2759074A1 (en) | 2010-02-05 | 2011-08-11 | Taro Nishiguchi | Method for manufacturing silicon carbide substrate |
| CA2765310A1 (en) | 2010-03-02 | 2011-09-09 | Sumitomo Electric Industries, Ltd. | Method for manufacturing silicon carbide substrate |
| JP2011210864A (ja) * | 2010-03-29 | 2011-10-20 | Sumitomo Electric Ind Ltd | 半導体基板 |
| JP2011243619A (ja) * | 2010-05-14 | 2011-12-01 | Sumitomo Electric Ind Ltd | 炭化珪素基板の製造方法、半導体装置の製造方法、炭化珪素基板および半導体装置 |
| US8445386B2 (en) * | 2010-05-27 | 2013-05-21 | Cree, Inc. | Smoothing method for semiconductor material and wafers produced by same |
| JP5447206B2 (ja) | 2010-06-15 | 2014-03-19 | 住友電気工業株式会社 | 炭化珪素単結晶の製造方法および炭化珪素基板 |
| JP2012004494A (ja) | 2010-06-21 | 2012-01-05 | Sumitomo Electric Ind Ltd | 炭化珪素基板の製造方法および製造装置 |
| WO2012035880A1 (ja) | 2010-09-16 | 2012-03-22 | 住友電気工業株式会社 | 半導体装置の製造方法 |
| JP2012089613A (ja) | 2010-10-18 | 2012-05-10 | Sumitomo Electric Ind Ltd | 炭化珪素基板を有する複合基板の製造方法 |
| JP2012089612A (ja) | 2010-10-18 | 2012-05-10 | Sumitomo Electric Ind Ltd | 炭化珪素基板を有する複合基板 |
| JP2012089639A (ja) * | 2010-10-19 | 2012-05-10 | Sumitomo Electric Ind Ltd | 単結晶炭化珪素基板を有する複合基板 |
| KR20120101055A (ko) | 2010-12-27 | 2012-09-12 | 스미토모덴키고교가부시키가이샤 | 탄화규소 기판, 반도체 장치, 탄화규소 기판의 제조 방법 및 반도체 장치의 제조 방법 |
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2004
- 2004-10-04 US US10/957,806 patent/US7314520B2/en not_active Expired - Lifetime
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- 2005-09-27 EP EP13151964.7A patent/EP2584071B1/en not_active Expired - Lifetime
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- 2005-09-27 CN CN200580033838XA patent/CN101061262B/zh not_active Expired - Lifetime
- 2005-09-27 EP EP05798669.7A patent/EP1797225B2/en not_active Expired - Lifetime
- 2005-09-27 JP JP2007534681A patent/JP2008515748A/ja active Pending
- 2005-09-27 WO PCT/US2005/034351 patent/WO2006041659A2/en not_active Ceased
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210050856A (ko) | 2019-10-29 | 2021-05-10 | 에스케이씨 주식회사 | 탄화규소 잉곳의 제조방법, 탄화규소 웨이퍼의 제조방법 및 이의 성장 시스템 |
| US11359306B2 (en) | 2019-10-29 | 2022-06-14 | Senic Inc. | Method for preparing a SiC ingot and device for preparing a SiC ingot wherein electrical resistance of crucible body is 2.9 ohms or more |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5572295B2 (ja) | 2014-08-13 |
| US8785946B2 (en) | 2014-07-22 |
| CN101061262A (zh) | 2007-10-24 |
| JP2008515748A (ja) | 2008-05-15 |
| US20080169476A1 (en) | 2008-07-17 |
| JP5410572B2 (ja) | 2014-02-05 |
| CN101061262B (zh) | 2013-06-12 |
| WO2006041659A3 (en) | 2006-06-08 |
| EP1797225B2 (en) | 2017-10-18 |
| JP2009035477A (ja) | 2009-02-19 |
| TWI313892B (en) | 2009-08-21 |
| EP1797225B1 (en) | 2013-03-06 |
| WO2006041659A2 (en) | 2006-04-20 |
| JP2012214379A (ja) | 2012-11-08 |
| EP2584071A1 (en) | 2013-04-24 |
| US20060073707A1 (en) | 2006-04-06 |
| US7314520B2 (en) | 2008-01-01 |
| US8384090B2 (en) | 2013-02-26 |
| EP2584071B1 (en) | 2014-10-22 |
| TW200629390A (en) | 2006-08-16 |
| US20130161651A1 (en) | 2013-06-27 |
| EP1797225A2 (en) | 2007-06-20 |
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