KR20060078116A - 스파이럴 3차원 인덕터를 내장한 인쇄회로기판 및 그제조방법 - Google Patents
스파이럴 3차원 인덕터를 내장한 인쇄회로기판 및 그제조방법 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
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- Production Of Multi-Layered Print Wiring Board (AREA)
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Abstract
Description
인덕턴스(nH) | 커패시턴스(pF) | |
종래 스파이럴 인덕터 | 9.06 | 0.0566 |
본 발명의 3차원스파이럴인덕터 | 20.78 | 0.0673 |
증가분 | 129%증가 | 19%증가 |
인덕턴스(nH) | 커패시턴스(pF) | 면적(mm2) | |
종래 기술에 의한 스파이럴 인덕터 | 9.06 | 0.0566 | 1.21 |
본 발명에 의한 3차원 스파이럴 인덕터 | 9.93 | 0.0540 | 0.44 |
증가분 | 109% | 5%감소 | 63.6% |
Claims (8)
- 복수의 절연층과 도체층을 포함하여 이루어진 인쇄회로기판에 있어서,복수의 도체층에 각각 위치하고 있으며, 스트립형상으로 패터닝되어 있고, 서로간에 평행하며, 동일 수직면에 위치하고, 중심층에서 외층으로 진행하면서 길이가 증가하는 전도성 물질로 이루어진 복수의 코일 도체 패턴;상기 중심층을 기준층으로 하여 대칭되는 도체층에 위치하는 코일 도체 패턴간을 전기적으로 접속시켜 스파이럴 구조의 인덕터를 형성하는 복수의 도통홀; 및상기 복수의 코일 도체 패턴과 복수의 도통홀로 형성된 스파이럴 구조의 인덕터의 시작점과 끝점에 각각 접속되어 외부로부터 입력되는 전원을 공급하기 위한 한 쌍의 리드 아웃 패턴을 포함하여 이루어진 스파이럴 3차원 인덕터를 내장한 인쇄회로기판.
- 제 1 항에 있어서,상기 복수의 도통홀의 내부가 전도성 물질로 충진되어 있는 것을 특징으로 하는 스파이럴 3차원 인덕터를 내장한 인쇄회로기판.
- 제 1 항에 있어서,상기 복수의 도통홀의 내벽에 도금층이 형성되어 있는 것을 특징으로 하는 스파이럴 3차원 인덕터를 내장한 인쇄회로기판.
- 제 1 항에 있어서,상기 코일 도체 패턴이 중심층에서 외층으로 진행하면서 폭이 넓어지는 것을 특징으로 하는 스파이럴 3차원 인덕터를 내장한 인쇄회로기판.
- 제 1 항에 있어서,상기 코일 도체 패턴이 상기 각각의 도체층의 상기 수직면에 평행한 복수의 수직면상에 각각 복수 형성되어 있고, 상기 코일 비아홀이 상기 수직면상에 복수 형성되어 각 수직면상에 위치하는 상기 중심층을 기준층으로 하여 대칭되는 도체층에 위치하는 코일 도체 패턴간을 전기적으로 접속시켜 각 수직면상에 스파이럴 구조의 인덕터를 하나의 수직면에 존재하는 스파이럴 구조와 그에 인접한 스파이럴 구조의 회전방향이 반대가 되도록 형성하는 것을 특징으로 하는 스파이럴 3차원 인덕터를 내장한 인쇄회로기판.
- 절연층과 양측이 도체층으로 이루어진 원판을 준비하여, 코일 비아홀을 형성 하기 위한 복수의 관통홀을 형성하는 제 1 단계;상기 동박적층판에 도금층를 형성하며, 상기 원판의 도체층과 도금층에 스트립 형상의 제한된 길이를 가지는 코일 도체 패턴을 서로 평행하게 그리고 상기 관통홀에 일끝단이 접속되도록 복수개 형성하는 제 2 단계;양측에 절연층을 적층하고 도체층을 적층하는 제 3 단계; 및상기 절연층에 상기 코일 도체 패턴의 다른 끝단에 접속된 관통홀을 복수개 형성한 후에 도금층을 형성하고 상기 도체층과 도금층에 상기 동박적층판에 형성된 코일 도체 패턴에 평행한 스트립 형상의 코일 도체 패턴을 복수개 형성하는 제 4 단계를 포함하여 이루어진 스파이럴 3차원 인덕터가 내장된 인쇄회로기판의 제조방법.
- 제 6 항에 있어서,상기 제 3 단계와 상기 제 4 단계를 반복 수행하면서 권선수를 증가시키는 제 5 단계를 더 포함하여 이루어진 스파이럴 3차원 인덕터가 내장된 인쇄회로기판의 제조방법.
- 제 6 항에 있어서,상기 코일 도체 패턴이 외층으로 진행할 수록 폭이 넓어지도록 형성하는 것 을 특징으로 하는 스파이럴 3차원 인덕터가 내장된 인쇄회로기판의 제조방법.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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KR1020040116806A KR100688858B1 (ko) | 2004-12-30 | 2004-12-30 | 스파이럴 3차원 인덕터를 내장한 인쇄회로기판 및 그 제조방법 |
JP2005147085A JP3920294B2 (ja) | 2004-12-30 | 2005-05-19 | 3次元スパイラルインダクタを内蔵したプリント基板およびその製造方法 |
US11/140,680 US7170384B2 (en) | 2004-12-30 | 2005-05-27 | Printed circuit board having three-dimensional spiral inductor and method of fabricating same |
CNB2005100780945A CN100502619C (zh) | 2004-12-30 | 2005-06-16 | 具有三维螺旋电感器的印刷电路板及其制造方法 |
DE102005031165A DE102005031165A1 (de) | 2004-12-30 | 2005-07-04 | Leiterplatte mit dreidimensionalem, spiralförmigen, induktivem Bauelement und Verfahren zur Herstellung davon |
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KR1020040116806A KR100688858B1 (ko) | 2004-12-30 | 2004-12-30 | 스파이럴 3차원 인덕터를 내장한 인쇄회로기판 및 그 제조방법 |
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KR20060078116A true KR20060078116A (ko) | 2006-07-05 |
KR100688858B1 KR100688858B1 (ko) | 2007-03-02 |
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US (1) | US7170384B2 (ko) |
JP (1) | JP3920294B2 (ko) |
KR (1) | KR100688858B1 (ko) |
CN (1) | CN100502619C (ko) |
DE (1) | DE102005031165A1 (ko) |
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KR20140143274A (ko) * | 2013-06-05 | 2014-12-16 | 삼성전자주식회사 | 인덕터를 포함하는 인쇄 회로 기판 |
KR20180082282A (ko) * | 2017-01-09 | 2018-07-18 | 삼성전기주식회사 | 인쇄회로기판 |
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KR101444708B1 (ko) * | 2009-12-15 | 2014-09-26 | 한국전자통신연구원 | 인덕터 |
KR20140143274A (ko) * | 2013-06-05 | 2014-12-16 | 삼성전자주식회사 | 인덕터를 포함하는 인쇄 회로 기판 |
US10553671B2 (en) | 2014-03-28 | 2020-02-04 | Qualcomm Incorporated | 3D pillar inductor |
KR20180082282A (ko) * | 2017-01-09 | 2018-07-18 | 삼성전기주식회사 | 인쇄회로기판 |
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CN100502619C (zh) | 2009-06-17 |
CN1798474A (zh) | 2006-07-05 |
US20060145805A1 (en) | 2006-07-06 |
JP3920294B2 (ja) | 2007-05-30 |
US7170384B2 (en) | 2007-01-30 |
JP2006190934A (ja) | 2006-07-20 |
DE102005031165A1 (de) | 2006-07-27 |
KR100688858B1 (ko) | 2007-03-02 |
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