KR20020011440A - 가요성 접점을 구비한 전자 소자 및 그 전자 소자의 제조방법 - Google Patents

가요성 접점을 구비한 전자 소자 및 그 전자 소자의 제조방법 Download PDF

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Publication number
KR20020011440A
KR20020011440A KR1020017016160A KR20017016160A KR20020011440A KR 20020011440 A KR20020011440 A KR 20020011440A KR 1020017016160 A KR1020017016160 A KR 1020017016160A KR 20017016160 A KR20017016160 A KR 20017016160A KR 20020011440 A KR20020011440 A KR 20020011440A
Authority
KR
South Korea
Prior art keywords
flexible
electronic device
protrusions
conductive
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020017016160A
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English (en)
Korean (ko)
Inventor
헤들러하리
하이멜알프레드
Original Assignee
마이클 골위저, 호레스트 쉐퍼
인피네온 테크놀로지스 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 마이클 골위저, 호레스트 쉐퍼, 인피네온 테크놀로지스 아게 filed Critical 마이클 골위저, 호레스트 쉐퍼
Publication of KR20020011440A publication Critical patent/KR20020011440A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020017016160A 1999-06-17 2000-04-11 가요성 접점을 구비한 전자 소자 및 그 전자 소자의 제조방법 Ceased KR20020011440A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19927750.8 1999-06-17
DE19927750 1999-06-17
PCT/DE2000/001123 WO2000079589A1 (de) 1999-06-17 2000-04-11 Elektronisches bauelement mit flexiblen kontaktierungsstellen und verfahren zum herstellen eines derartigen bauelements

Publications (1)

Publication Number Publication Date
KR20020011440A true KR20020011440A (ko) 2002-02-08

Family

ID=7911618

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020017016160A Ceased KR20020011440A (ko) 1999-06-17 2000-04-11 가요성 접점을 구비한 전자 소자 및 그 전자 소자의 제조방법

Country Status (5)

Country Link
US (2) US6956287B2 (https=)
EP (1) EP1186035A1 (https=)
JP (2) JP2003502866A (https=)
KR (1) KR20020011440A (https=)
WO (1) WO2000079589A1 (https=)

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US8680534B2 (en) 2005-01-11 2014-03-25 Semileds Corporation Vertical light emitting diodes (LED) having metal substrate and spin coated phosphor layer for producing white light
US8012774B2 (en) * 2005-01-11 2011-09-06 SemiLEDs Optoelectronics Co., Ltd. Coating process for a light-emitting diode (LED)
WO2006091793A1 (en) * 2005-02-25 2006-08-31 Tessera, Inc. Microelectronic assemblies having compliancy
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TWI381464B (zh) * 2008-08-29 2013-01-01 瀚宇彩晶股份有限公司 The bump structure and its making method
JP5149876B2 (ja) * 2009-07-23 2013-02-20 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US8912021B2 (en) 2011-09-12 2014-12-16 SemiLEDs Optoelectronics Co., Ltd. System and method for fabricating light emitting diode (LED) dice with wavelength conversion layers
US8841146B2 (en) 2011-09-12 2014-09-23 SemiLEDs Optoelectronics Co., Ltd. Method and system for fabricating light emitting diode (LED) dice with wavelength conversion layers having controlled color characteristics
US8410508B1 (en) 2011-09-12 2013-04-02 SemiLEDs Optoelectronics Co., Ltd. Light emitting diode (LED) package having wavelength conversion member and wafer level fabrication method
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Also Published As

Publication number Publication date
WO2000079589A1 (de) 2000-12-28
EP1186035A1 (de) 2002-03-13
JP2006108705A (ja) 2006-04-20
JP4226589B2 (ja) 2009-02-18
US6956287B2 (en) 2005-10-18
US7820482B2 (en) 2010-10-26
US20050208703A1 (en) 2005-09-22
US20020089058A1 (en) 2002-07-11
JP2003502866A (ja) 2003-01-21

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