CN1277736A - 在基片上的两层布线之间制作电学上导电的交叉连接的方法 - Google Patents

在基片上的两层布线之间制作电学上导电的交叉连接的方法 Download PDF

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CN1277736A
CN1277736A CN98810524A CN98810524A CN1277736A CN 1277736 A CN1277736 A CN 1277736A CN 98810524 A CN98810524 A CN 98810524A CN 98810524 A CN98810524 A CN 98810524A CN 1277736 A CN1277736 A CN 1277736A
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substrate
sawtooth
metal layer
mold pressing
injection moulding
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M·赫尔曼
J·范普伊姆布勒克
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SIEMENS SA
Siemens NV SA
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SIEMENS SA
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Abstract

在三维的注塑模压基片(S)上,锯齿(Z)在注塑模压工序期间在外侧面区域和/或切口区域内被同时形成。在镀覆一个金属化层(M)到基片(S)上之后,通过除去锯齿区域内的金属化层(M),特别是在锯齿(Z)被研磨掉或者被切削掉之后,形成非常精密的导电的交叉连接。

Description

在基片上的两层布线之间制作电学上导电的交叉连接的方法
集成电路连接端的数目越来越多，同时集成电路被小型化的程度越来越高。在这种增进小型化的过程中，在应用焊膏和元件安装方面所预料到的困难应通过新型框架结构来克服，在这方面尤其要着重提到在一种球顶篦条阵列封装中的单个芯片，少数芯片或多个芯片模块(DE-Z Productronic 5，1994，54和55页)。这些模块以全部被电镀的基片为基础，在它上面例如通过接触线或者倒装技术制作与芯片的接触。球顶篦条阵列(BGA)位于基片的下面，并且也常被称做焊锡篦条阵列，焊盘篦条阵列或者焊锡包阵列。球顶篦条阵列含有在基片下面沿平面排列的焊锡凸起，它可实现在印刷电路板上或者装配部件上的表面装架。焊锡凸起的平面排布允许实现例如一种1.27mm的粗篦条的大数量连接端。
在所谓的MID技术(MID＝模压互连器件)的情况下，使用模压注塑部件代替常规印刷电路，此模压注塑部件有集成导体布线。适合于三维基片的注塑模压的高质量的热塑性塑料形成了这一技术的基础。与通常用于印刷电路基片的材料相比，这种热塑性塑料具有更好的机械性能，化学性能，电学性能及环保性能。在MID技术的一个特定方面的情况下，即在所谓的SIL技术(SIL＝Spitzgiessteile mitintegrierten Leiterzuegen[有集成导体布线的模压注塑部件])的情况下，被加到模压注塑部件上的一个金属层被成形，成形时没有使用在其他方面通常用的掩膜技术，而是用一个特殊的激光成形方法。在这种情况下，诸多的机械的和电学的功能可以被集成在有着已成形的金属化层的三维模压注塑部件中。框架支撑功能通过支撑和紧压连接同时得到保证，而金属化层，除了布线和连接功能外，也作为电磁屏蔽并提供良好的散热条件。为了在模压注塑部件的两个相对表面上的两套布线设置之间制作导电的交叉连接，早在注塑模压工序期间就制作了相应的接触通孔。在模压注塑部件的金属化期间这些接触通孔的内壁因此也同样被覆盖上一个金属层。有关有集成导体布线的三维模压注塑部件的制作的更进一步的细节例如在DE-A-37 32 249或DE-A-0 361 192中被透露。
根据在EP-A-0 645 953中所揭示的MID技术的一个变形，通过注塑模压一种基片被制作，并且被提供有一个槽以及而后一个第一导体平面，一个介质层和一个第二导体平面相继在所说的基片上被制作，随后一个电子元件被放入到这个槽内，该元件的连接，最好通过压焊，在导电地连接到基片上的指定的连接区域，并且通过用塑料充满槽对该元件形成密封。一个紧密的，薄的有高布线密度的结构被制作。在模压注塑基片的槽中的元件的隐藏封装和密封不仅减小了厚度而且也获得了元件及连接布线本身的最佳保护。
WO-A-96 096 46揭示了一种所谓的聚合物凸起篦条阵列(PSGA)，它结合了球顶篦条阵列(BGA)和MID技术两者的优点。依据球顶篦条阵列(BGA)的叫法，新结构被称为聚合物凸起篦条阵列(PSGA)，术语“聚合物凸起”意思是要表示在基片的注塑模压期间被同时形成的那些聚合物凸起。新结构适用于单芯片，少数芯片或者多个芯片模块，并且含有
—用一种电绝缘聚合物制成的模压注塑三维基片，
—聚合物凸起，它们平面排布在基片的下侧，并且在模压注塑期间被同时形成，
—外部连接，通过可焊接端面它们被形成在聚合物凸起上，
—导体布线，它们至少在基片的下侧被形成，并且把外部连接与内部连接线相联，以及
—至少一个芯片，它被安放在基片上，并且它的连接端导电地被连接到内部连接线上。
除了在基片的注塑模压期间聚合物凸起的制作简单和价格低廉之外，在聚合物凸起上的外部连接的制作也可以最小费用与导体布线的制作同时完成，对于MID技术或SIL技术来说这是常规。在SIL技术中被推荐的激光精密成形使得外部连接能够以一种非常精致的篦条在有大量连接的聚合物凸起上被实现。此外，应该强调的是，聚合物凸起的热膨胀与基片的热膨胀相适应并且与容纳模块的印刷电路板的热膨胀相适应。假如出现任何应力，那么聚合物凸起的弹性特性至少提供部分补偿。在聚合物凸起上形成的外部连接的形状的稳定性，对于修理和更换而言与球顶篦条阵列相比较也使可靠性得到显著提高，球顶篦条阵列的连接是由焊锡凸起形成的。在聚合物凸起篦条阵列的情况下，聚合物凸起和芯片或一些芯片通常被布置在基片的同一面上。在提供有接触通孔的基片的情况下，聚合物凸起和芯片或一些芯片也完全可以被布置在基片的不同的面上。聚合物凸起和芯片在基片的相对面上的这种排布特别是对大芯片来说是非常有利的，它们要求大量的指定的外部连接。
WO-A-89 00346揭示了单芯片模块，它们适合于表面封装，并且是以一种带有被全部电镀的通孔的模压注塑三维基片为基础的。除了这些被全部电镀的通孔之外，在注塑模压工序过程中，基片还获得一个槽，被安置在上侧的中央，以及获得大量的聚合物凸起，它们以一排或以两排被安置在底侧的周边部位。被安置在上侧的槽中的芯片经过良好的接触导线被连接到指定的引向外部的带状导线。这些带状导线而后经布置在外部区域的被全部电镀的孔被导电地连接到指定的表面金属化了的聚合物凸起上。如果而后用剖面线把基片的边缘区域分开-剖线经过这些被全部电镀的通孔的中心，那么就形成半圆形截面的导电的交叉连接，这种交叉连接就导电地把排布在基片表面上的带状导线的外端连接到被布置在基片下侧的指定的聚合物凸起上。
在权利要求1中给定的本发明是基于这样一个问题，在MID技术情况下，简化在模压注塑基片的上侧和下侧上的两层布线之间导电的交叉连接的制作。在这种情况下，这些交叉连接，特别是，也应适合于上面说明的聚合物凸起篦条阵列。
借助本发明所获得的特殊优点是，在与通常的有金属化孔的导通接触技术相比较，它可以实质上实现有更高可靠性的交叉连接的更精细的结构。基片的这种向外敞开的锯齿，与窄小的被全部电镀的通孔的内壁相比可以被金属化成有非常好的金属层厚度的分布。在这种情况下，通过至少部分地去除锯齿区域中的金属化层，以使金属化层结构化形成各个交叉连接区只需要少量的工作。
依据本发明的方法的有利改进在权利要求2到9中给出。这种方法的一种特别有利的应用在权利要求10中给出。
依据权利要求2的扩展能够使锯齿在注塑模压工序过程中被特别精细的结构。
依据权利要求3的改进允许在聚合物凸起篦条阵列中应用依据本发明的交叉连接。在这种情况下，应该强调的是，在注塑模压工序过程中以同样的工艺过程制作锯齿和聚合物凸起或聚合物柱。
依据权利要求4的改进有这样的优点，在制作金属化层时，利用在印刷电路制作中久已证明它们的价值的那些技术是可能的。
虽然依据本发明的方法使用部分添加技术原则上也可以被实现，但是依据权利要求5的减掉技术提供了许多的优点。除了所希望的导体图案制作简单和经济之外，这里着重强调精密的激光成形的可靠性，它不利用费用大的通常的光刻技术就能使极精密的成形乃至三维基片被制作出来。依据权利要求6，抗腐蚀层在这种情况下可以以简单的方式通过电镀锡或锡-铅被提供，并且而后通过利用激光束加工成形。
依据权利要求7的扩展，尤其使得金属化层简单的且可靠的机械成形能够用于制作交叉连接的目的。特别是在基片的端面区域内，这种机械成形可以特别快捷和简单地通过依据权利要求8的研磨去掉锯齿，或者依据权利要求9的切削去掉锯齿来完成。
依据权利要求10，依据本发明的方法是特别适用于基片上侧安置有一个芯片的一种聚合物凸起篦条阵列的制作的。在基片的上侧排布芯片而在基片的下侧排布这些凸起或者这些聚合物凸起，在这种情况下就形成了对于所谓的芯片规模封装的理想的先决条件，在这种情况下阵列的尺寸基本上相当于芯片的尺寸。
图中给出了本发明的一个实施例并将在下面给予详细说明。
在图中
图1给出了一个基片的局部平面视图，在外端面区域有集成的锯齿，
图2给出了一个依据图1的锯齿的三维图示，
图3给出了一个基片的局部平面视图，在基片的一个切口区域有集成的锯齿，
图4给出了依据图1的基片在加上金属化层和抗腐蚀层之后的局部平面视图，
图5给出了依据图4的基片在激光成形之后的局部平面视图，
图6给出了依据图4的基片在锯齿被研磨掉以形成交叉连接之后的一个局部平面视图，以及
图7给出了以聚合物凸起篦条阵列形式所形成的基片的一个侧视图。
依据图1，起点是一个基片S，它在外端面区域有许多彼此间以均一的距离被安置的锯齿Z，包括有锯齿Z和凸起H的基片，稍后将参照图7予以更详细的说明，合适的基片材料是耐高温的热塑塑料如聚醚亚胺，聚醚砜或者聚酰胺通过注塑模压被形成。依据图2的三维视图显示出，锯齿Z被制成有平面基面的波浪外形的形状，并且在基片S的上侧O和下侧U之间延伸。在示出的实施例中，上侧O和下侧U被制成是彼此平行的，就是说所有的锯齿Z有同样的长度，当然锯齿也可以在基片S的其它三个端面上被集成。图3显示出，在基片S中一个切口部分A的范围内，同样，锯齿Z原则上可以在这个切口A的端面上被集成。除了这里给出的矩形切口A之外，其它形状例如园形成者狭槽形也可以是适合的。
通过注塑模压制成的基片S要首先经过一系列常规的预处理，尤其是浸蚀，清洗，种晶及种晶激活。以后，依据图4，通过无外部电流的化学镀铜和相继的电镀铜，一个金属化层M被加到基片S上的整个表面。而后抗腐蚀层AR通过无电流镀锡或电镀锡被加到金属化层M上。因为图4表示的仅是这里感兴趣的有锯齿Z的基片端面部分，所以必须指出的是，金属化层M和抗腐蚀层AR两者都覆盖在基片S的整个表面。
在加上了抗腐蚀层AR之后，金属化层，按照图5，在基片S的上侧O和下侧U上(参看图2)被成形。在这里给出的实施例的情况下，激光照射的所有那些区域是与将被形成的布线层所要求的导体图形不相对应的区域。通过激光照射这些区域的抗腐蚀层AR被去掉，这种激光成形更进一步的细节例如在DE-A-37 32 249中被透露。金属化层M的没被保护的区域而后通过被腐蚀到基片S的表面而被去掉。从图5可以明显的看出，通过这种成形工序印刷导线L在基片S的两个面上被制成，所说的这些印刷导线L都在两个锯齿Z之间的区域延伸到基片S的边上。在图5中示出的区分线T仅用来区别有印刷导线L的表面金属化层M和在端面上的金属化层M。然而，事实上，金属化层M延伸在整个基片S上并没有任何分离。
在布线层按照所叙述的在基片S的上侧O和下侧U(参看图2)被形成之后，锯齿Z通过研磨或通过切削被去掉。依据图6，交叉连接Q因此在以前的锯齿之间的成形间隙的端面内被形成，交叉连接Q在电学上彼此被绝缘。
图7给出了基片S的一个侧视图，有印刷导线L，交叉连接Q和已经提到过的那些凸起H，那些凸起被平面地安排在下侧U上。一个芯片C被加到基片S的上侧O上，与所说的芯片的接触或者如在左边示出的那样利用引线-压焊技术用压焊线B来实现，或者在右边示出的那样利用倒装技术用连接A来实现。在引线-压焊技术的情况下，芯片C通过一个粘接层K被结合到基片S的上侧O上。
图7清楚地显示出，芯片C各个的连接经过上侧O上的印刷导线L，经过端面上的交叉连接Q并经过下侧U上的印刷导线L被导电地连接到指定的凸起H。一个可焊接的端面E被加到金属化的凸起H的下侧，所说的端面例如通过一个镍和金序列层来形成。
图7给出的结构是一个聚合物凸起篦条阵列，它是完全由PSGA表示的。这种聚合物凸起篦条阵列的进一步的细节例如在WO-A-9609646中被透露出来。
在图7中所示出的聚合物凸起篦条阵列PSGA的情况下，芯片C和基片S的外部尺寸是近似同样的大小。因而，涉及一种框架结构，它通常被看作是一个芯片大小的封装。也可以被清楚的看出的是，被非常紧密的成形在端面上的交叉连接Q使得整个聚合物凸起篦条阵列PSGA能被非常紧密的成形，并因此对实现芯片大小的封装起决定性的作用。

Claims (10)

1.用于在一个基片(S)的上侧(O)和下侧(U)上的两层布线之间制作导电的交叉连接(Q)的一种方法，有下列步骤：
a)由一种电学上绝缘的塑料通过注塑模压制作基片(S)，许多集成的锯齿(Z)在注塑模压工序过程中共同被形成在基片(S)的外端面区域内和/或在基片(S)中的一个切口(A)的区域内，所说的锯齿彼此间以一定间距被排布，并在上侧(O)和下侧(U)之间延伸；
b)对基片(S)镀覆一个金属化层(M)；
c)以这样的一种方式，即以在锯齿(Z)之间形成彼此间电学上绝缘的交叉连接(Q)的方式，至少在邻接所要求的导体图形的那些区域内，及锯齿(Z)的端面区域内去除掉金属化层(M)。
2.按权利要求1的方法，其特征为，在步骤a)中，在基片(S)的注塑模压期间按照一种波浪形断面的锯齿(Z)被成形。
3.按权利要求1或2的方法，其特征为，在步骤a)中，被安排在基片(S)的下侧(U)上的聚合物凸起(H)在基片的注塑模压期间同时被形成，并且在镀覆金属化层(M)之后，一种可焊接的端表面(E)被加到聚合物凸起(H)上。
4.按上述权利要求之一的方法，其特征为，通过无电流镀铜和电镀铜，一个金属化层(M)被加到基片(S)上。
5.按上述权利要求之一的方法，其特征为，在步骤b)之后，一个抗腐蚀层(AR)被加到金属化层上，利用激光照射至少在邻接所要求的导体图形的那些区域内的抗腐蚀层(AR)重新被去除，并且随后，金属化层(M)的未被覆盖的区域被腐蚀到基片(S)的表面。
6.按权利要求5的方法，其特征为，通过电镀锡或者电镀锡-铅，抗腐蚀层(AR)被加上。
7.按上述权利要求之一的方法，其特征为，在锯齿(Z)的端面区域内的金属化层(M)用机械的方式被除掉。
8.按权利要求7的方法，其特征为，在锯齿(Z)的端面区域内的金属化层(M)通过研磨掉锯齿(Z)被去除。
9.按权利要求7的方法，其特征为，在锯齿(Z)的端面区域内的金属化层(M)通过切削掉锯齿(Z)被去除。
10.按权利要求3到9之一的方法的应用，在有一个使用引线压焊技术或使用倒装技术被安排在基片(S)上侧的芯片的聚合物凸起篦条阵列(PSGA)的制作中。
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* Cited by examiner, † Cited by third party
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CN101815409A (zh) * 2010-04-23 2010-08-25 陈国富 用注塑成型制作线路板的方法
CN101815409B (zh) * 2010-04-23 2012-05-02 陈国富 用注塑成型制作线路板的方法
CN102630125A (zh) * 2011-02-07 2012-08-08 索尼公司 导电元件及其制造方法、配线元件、信息输入装置

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