KR102912082B1 - 안테나 부착 반도체 패키지 및 안테나 부착 반도체 패키지용 수지 조성물 - Google Patents

안테나 부착 반도체 패키지 및 안테나 부착 반도체 패키지용 수지 조성물

Info

Publication number
KR102912082B1
KR102912082B1 KR1020237000117A KR20237000117A KR102912082B1 KR 102912082 B1 KR102912082 B1 KR 102912082B1 KR 1020237000117 A KR1020237000117 A KR 1020237000117A KR 20237000117 A KR20237000117 A KR 20237000117A KR 102912082 B1 KR102912082 B1 KR 102912082B1
Authority
KR
South Korea
Prior art keywords
antenna
semiconductor package
resin composition
styrene
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020237000117A
Other languages
English (en)
Korean (ko)
Other versions
KR20230035029A (ko
Inventor
히로시 타카스기
료 우사미
후미카즈 코마츠
신 테라키
Original Assignee
나믹스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나믹스 가부시끼가이샤 filed Critical 나믹스 가부시끼가이샤
Publication of KR20230035029A publication Critical patent/KR20230035029A/ko
Application granted granted Critical
Publication of KR102912082B1 publication Critical patent/KR102912082B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/18—Homopolymers or copolymers or tetrafluoroethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/442—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H01L2223/6677—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Laminated Bodies (AREA)
  • Organic Insulating Materials (AREA)
KR1020237000117A 2020-07-03 2021-06-17 안테나 부착 반도체 패키지 및 안테나 부착 반도체 패키지용 수지 조성물 Active KR102912082B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020115697 2020-07-03
JPJP-P-2020-115697 2020-07-03
PCT/JP2021/023019 WO2022004409A1 (ja) 2020-07-03 2021-06-17 アンテナ付き半導体パッケージ及びアンテナ付き半導体パッケージ用樹脂組成物

Publications (2)

Publication Number Publication Date
KR20230035029A KR20230035029A (ko) 2023-03-10
KR102912082B1 true KR102912082B1 (ko) 2026-01-13

Family

ID=79316066

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237000117A Active KR102912082B1 (ko) 2020-07-03 2021-06-17 안테나 부착 반도체 패키지 및 안테나 부착 반도체 패키지용 수지 조성물

Country Status (6)

Country Link
US (1) US20230299461A1 (https=)
JP (2) JP7630847B2 (https=)
KR (1) KR102912082B1 (https=)
CN (1) CN115812249A (https=)
TW (1) TWI905217B (https=)
WO (1) WO2022004409A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116867811A (zh) * 2021-02-22 2023-10-10 株式会社力森诺科 树脂组合物、固化物、层叠体、透明天线及其制造方法、以及图像显示装置
US12266618B2 (en) * 2022-02-18 2025-04-01 Advanced Semiconductor Engineering, Inc. Semiconductor device and method of manufacturing the same
US12597706B2 (en) 2022-04-08 2026-04-07 Advanced Semiconductor Engineering, Inc. Electronic device antenna package with multiple antennas
WO2024098356A1 (en) * 2022-11-11 2024-05-16 Innoscience (suzhou) Semiconductor Co., Ltd. Nitride-based semiconductor circuit and method for manufacturing thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015195238A (ja) 2014-03-31 2015-11-05 信越化学工業株式会社 半導体装置、積層型半導体装置、封止後積層型半導体装置、及びこれらの製造方法
WO2018016489A1 (ja) * 2016-07-19 2018-01-25 日立化成株式会社 樹脂組成物、積層板及び多層プリント配線板

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4394266B2 (ja) * 2000-09-18 2010-01-06 カシオ計算機株式会社 半導体装置および半導体装置の製造方法
CN101819648A (zh) * 2004-10-13 2010-09-01 凸版资讯股份有限公司 非接触ic标签及其制造方法和制造装置
JP2006113750A (ja) * 2004-10-13 2006-04-27 Toppan Forms Co Ltd 非接触型データ受送信体
JP2006253953A (ja) * 2005-03-09 2006-09-21 Fujitsu Ltd 通信用高周波モジュールおよびその製造方法
JP4101814B2 (ja) * 2005-03-15 2008-06-18 富士通株式会社 高周波モジュール
JP4732128B2 (ja) * 2005-11-01 2011-07-27 太陽誘電株式会社 高周波無線モジュール
JP5303852B2 (ja) * 2006-04-13 2013-10-02 日立化成株式会社 セミｉｐｎ型複合体の樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP5435685B2 (ja) * 2007-02-28 2014-03-05 ナミックス株式会社 封止用樹脂フィルム
JP5435699B2 (ja) * 2009-03-06 2014-03-05 ナミックス株式会社 配線基板の製造方法、配線基板および半導体装置
JP5731148B2 (ja) * 2010-09-03 2015-06-10 ナミックス株式会社 フィルムアンテナおよびその製造方法、ならびに、それに用いるアンテナ基板用フィルム
JP5919200B2 (ja) * 2011-01-07 2016-05-18 株式会社ダイセル 硬化性エポキシ樹脂組成物
CN103140089A (zh) * 2011-12-05 2013-06-05 深圳富泰宏精密工业有限公司 壳体的制备方法及由该方法制得的壳体
JP5726787B2 (ja) * 2012-02-28 2015-06-03 株式会社東芝 無線装置、それを備えた情報処理装置および記憶装置
KR20170122722A (ko) * 2014-12-25 2017-11-06 리켄 테크노스 가부시키가이샤 전지 팩 보호 부재용 열가소성 엘라스토머 조성물
JP6570259B2 (ja) * 2015-02-11 2019-09-04 ナミックス株式会社 樹脂組成物、絶縁フィルム、および半導体装置
JP6682190B2 (ja) * 2015-04-17 2020-04-15 ナミックス株式会社 金属被膜付絶縁体、半導体装置、および金属被膜付絶縁体の製造方法
JP7148146B2 (ja) * 2017-02-22 2022-10-05 ナミックス株式会社 多層配線基板および半導体装置
KR102460870B1 (ko) * 2017-10-20 2022-10-31 삼성전기주식회사 인쇄회로기판
JP7020332B2 (ja) * 2018-07-26 2022-02-16 味の素株式会社 樹脂組成物
KR102426215B1 (ko) * 2018-12-04 2022-07-28 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015195238A (ja) 2014-03-31 2015-11-05 信越化学工業株式会社 半導体装置、積層型半導体装置、封止後積層型半導体装置、及びこれらの製造方法
WO2018016489A1 (ja) * 2016-07-19 2018-01-25 日立化成株式会社 樹脂組成物、積層板及び多層プリント配線板

Also Published As

Publication number Publication date
TWI905217B (zh) 2025-11-21
JPWO2022004409A1 (https=) 2022-01-06
US20230299461A1 (en) 2023-09-21
TW202220119A (zh) 2022-05-16
CN115812249A (zh) 2023-03-17
JP2025015763A (ja) 2025-01-30
KR20230035029A (ko) 2023-03-10
WO2022004409A1 (ja) 2022-01-06
JP7630847B2 (ja) 2025-02-18

Similar Documents

Publication Publication Date Title
KR102912082B1 (ko) 안테나 부착 반도체 패키지 및 안테나 부착 반도체 패키지용 수지 조성물
JP7378494B2 (ja) 共重合体及びこれを含む積層体
JP7428815B2 (ja) 組成物及びその硬化体
KR100610649B1 (ko) 수지조성물, 그것을 사용한 프리프레그, 적층판 및 다층프린트 배선판
KR101116181B1 (ko) 성형성이 우수한 에폭시수지를 포함한 적층체 및 그 제조방법
KR20090113785A (ko) 박층 석영 유리 크로스를 포함하는 프리프레그, 프리프레그의 경화물을 이용하는 전자부품, 및 그것을 이용한 적층판, 배선판 및 다층 배선판
TWI910362B (zh) 樹脂組成物及其製造方法以及接著薄膜及層間接著用黏合片
JP2022085610A (ja) 組成物及びその硬化物
JP6136348B2 (ja) 多層伝送線路板、該多層伝送線路板を有する電磁結合モジュール、アンテナモジュール
JP2018172529A (ja) 半導体接着用シート及び半導体装置
JP2013000995A (ja) 金属張積層板、及びプリント配線板
JP4988218B2 (ja) 低誘電損失樹脂の製造方法
KR20250055502A (ko) 수지 조성물, 접착 필름, 층간 접착용 본딩 시트, 및 안테나가 형성된 반도체 패키지용 수지 조성물
WO2023053749A1 (ja) 樹脂組成物、接着フィルム、層間接着用ボンディングシート、アンテナ付き半導体パッケージ用樹脂組成物及びアンテナ付き半導体パッケージ
JP2023013224A (ja) アンテナモジュール用積層板の製造方法、アンテナ装置の製造方法、アンテナモジュールの製造方法及び通信装置の製造方法
JP7569954B1 (ja) 熱硬化性接着剤組成物、熱硬化性接着シート及びプリント配線板
KR100994965B1 (ko) 이산화티타늄 충전재를 이용한 반도체 패키징용 재료
JP2023013229A (ja) 樹脂組成物、プリプレグ、積層板、樹脂フィルム、多層プリント配線板、アンテナ装置及びアンテナモジュール
TWI843644B (zh) 樹脂組合物
JP2003060359A (ja) 多層回路基板
JP2021181505A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ並びに多層プリント配線板の製造方法
WO2025187225A1 (ja) 接着層用フィルム、配線基板、多層配線基板、及び半導体装置。
KR20010089948A (ko) 동박용 접착제 조성물 및 이를 이용한 동박 적층판
US20250066609A1 (en) Resin composition
KR20250153419A (ko) 에폭시 몰딩 컴파운드 및 이를 적용한 패키징 방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

F11 Ip right granted following substantive examination

Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

U12 Designation fee paid

Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U12-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000