JP7630847B2 - アンテナ付き半導体パッケージ及びアンテナ付き半導体パッケージ用樹脂組成物 - Google Patents

アンテナ付き半導体パッケージ及びアンテナ付き半導体パッケージ用樹脂組成物 Download PDF

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JP7630847B2
JP7630847B2 JP2022533847A JP2022533847A JP7630847B2 JP 7630847 B2 JP7630847 B2 JP 7630847B2 JP 2022533847 A JP2022533847 A JP 2022533847A JP 2022533847 A JP2022533847 A JP 2022533847A JP 7630847 B2 JP7630847 B2 JP 7630847B2
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antenna
semiconductor package
styrene
resin composition
compound
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JPWO2022004409A1 (https=
Inventor
寛史 高杉
遼 宇佐美
史和 小松
慎 寺木
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Namics Corp
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Namics Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/18—Homopolymers or copolymers or tetrafluoroethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/442—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas

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  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Laminated Bodies (AREA)
  • Organic Insulating Materials (AREA)
JP2022533847A 2020-07-03 2021-06-17 アンテナ付き半導体パッケージ及びアンテナ付き半導体パッケージ用樹脂組成物 Active JP7630847B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024201389A JP2025015763A (ja) 2020-07-03 2024-11-19 アンテナ付き半導体パッケージ及びアンテナ付き半導体パッケージ用樹脂組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020115697 2020-07-03
JP2020115697 2020-07-03
PCT/JP2021/023019 WO2022004409A1 (ja) 2020-07-03 2021-06-17 アンテナ付き半導体パッケージ及びアンテナ付き半導体パッケージ用樹脂組成物

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JP2024201389A Division JP2025015763A (ja) 2020-07-03 2024-11-19 アンテナ付き半導体パッケージ及びアンテナ付き半導体パッケージ用樹脂組成物

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JPWO2022004409A1 JPWO2022004409A1 (https=) 2022-01-06
JP7630847B2 true JP7630847B2 (ja) 2025-02-18

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JP2024201389A Pending JP2025015763A (ja) 2020-07-03 2024-11-19 アンテナ付き半導体パッケージ及びアンテナ付き半導体パッケージ用樹脂組成物

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US (1) US20230299461A1 (https=)
JP (2) JP7630847B2 (https=)
KR (1) KR102912082B1 (https=)
CN (1) CN115812249A (https=)
TW (1) TWI905217B (https=)
WO (1) WO2022004409A1 (https=)

Families Citing this family (4)

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Publication number Priority date Publication date Assignee Title
CN116867811A (zh) * 2021-02-22 2023-10-10 株式会社力森诺科 树脂组合物、固化物、层叠体、透明天线及其制造方法、以及图像显示装置
US12266618B2 (en) * 2022-02-18 2025-04-01 Advanced Semiconductor Engineering, Inc. Semiconductor device and method of manufacturing the same
US12597706B2 (en) 2022-04-08 2026-04-07 Advanced Semiconductor Engineering, Inc. Electronic device antenna package with multiple antennas
WO2024098356A1 (en) * 2022-11-11 2024-05-16 Innoscience (suzhou) Semiconductor Co., Ltd. Nitride-based semiconductor circuit and method for manufacturing thereof

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WO2018016489A1 (ja) 2016-07-19 2018-01-25 日立化成株式会社 樹脂組成物、積層板及び多層プリント配線板

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JP2006113750A (ja) * 2004-10-13 2006-04-27 Toppan Forms Co Ltd 非接触型データ受送信体
JP2006253953A (ja) * 2005-03-09 2006-09-21 Fujitsu Ltd 通信用高周波モジュールおよびその製造方法
JP4101814B2 (ja) * 2005-03-15 2008-06-18 富士通株式会社 高周波モジュール
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JP5435685B2 (ja) * 2007-02-28 2014-03-05 ナミックス株式会社 封止用樹脂フィルム
JP5435699B2 (ja) * 2009-03-06 2014-03-05 ナミックス株式会社 配線基板の製造方法、配線基板および半導体装置
JP5731148B2 (ja) * 2010-09-03 2015-06-10 ナミックス株式会社 フィルムアンテナおよびその製造方法、ならびに、それに用いるアンテナ基板用フィルム
JP5919200B2 (ja) * 2011-01-07 2016-05-18 株式会社ダイセル 硬化性エポキシ樹脂組成物
CN103140089A (zh) * 2011-12-05 2013-06-05 深圳富泰宏精密工业有限公司 壳体的制备方法及由该方法制得的壳体
JP5726787B2 (ja) * 2012-02-28 2015-06-03 株式会社東芝 無線装置、それを備えた情報処理装置および記憶装置
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Publication number Publication date
TWI905217B (zh) 2025-11-21
JPWO2022004409A1 (https=) 2022-01-06
US20230299461A1 (en) 2023-09-21
TW202220119A (zh) 2022-05-16
CN115812249A (zh) 2023-03-17
JP2025015763A (ja) 2025-01-30
KR20230035029A (ko) 2023-03-10
WO2022004409A1 (ja) 2022-01-06
KR102912082B1 (ko) 2026-01-13

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