JPWO2022004409A1 - - Google Patents

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Publication number
JPWO2022004409A1
JPWO2022004409A1 JP2022533847A JP2022533847A JPWO2022004409A1 JP WO2022004409 A1 JPWO2022004409 A1 JP WO2022004409A1 JP 2022533847 A JP2022533847 A JP 2022533847A JP 2022533847 A JP2022533847 A JP 2022533847A JP WO2022004409 A1 JPWO2022004409 A1 JP WO2022004409A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022533847A
Other languages
Japanese (ja)
Other versions
JP7630847B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022004409A1 publication Critical patent/JPWO2022004409A1/ja
Priority to JP2024201389A priority Critical patent/JP2025015763A/ja
Application granted granted Critical
Publication of JP7630847B2 publication Critical patent/JP7630847B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/18—Homopolymers or copolymers or tetrafluoroethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/442—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Laminated Bodies (AREA)
  • Organic Insulating Materials (AREA)
JP2022533847A 2020-07-03 2021-06-17 アンテナ付き半導体パッケージ及びアンテナ付き半導体パッケージ用樹脂組成物 Active JP7630847B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024201389A JP2025015763A (ja) 2020-07-03 2024-11-19 アンテナ付き半導体パッケージ及びアンテナ付き半導体パッケージ用樹脂組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020115697 2020-07-03
JP2020115697 2020-07-03
PCT/JP2021/023019 WO2022004409A1 (ja) 2020-07-03 2021-06-17 アンテナ付き半導体パッケージ及びアンテナ付き半導体パッケージ用樹脂組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024201389A Division JP2025015763A (ja) 2020-07-03 2024-11-19 アンテナ付き半導体パッケージ及びアンテナ付き半導体パッケージ用樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2022004409A1 true JPWO2022004409A1 (https=) 2022-01-06
JP7630847B2 JP7630847B2 (ja) 2025-02-18

Family

ID=79316066

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022533847A Active JP7630847B2 (ja) 2020-07-03 2021-06-17 アンテナ付き半導体パッケージ及びアンテナ付き半導体パッケージ用樹脂組成物
JP2024201389A Pending JP2025015763A (ja) 2020-07-03 2024-11-19 アンテナ付き半導体パッケージ及びアンテナ付き半導体パッケージ用樹脂組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024201389A Pending JP2025015763A (ja) 2020-07-03 2024-11-19 アンテナ付き半導体パッケージ及びアンテナ付き半導体パッケージ用樹脂組成物

Country Status (6)

Country Link
US (1) US20230299461A1 (https=)
JP (2) JP7630847B2 (https=)
KR (1) KR102912082B1 (https=)
CN (1) CN115812249A (https=)
TW (1) TWI905217B (https=)
WO (1) WO2022004409A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116867811A (zh) * 2021-02-22 2023-10-10 株式会社力森诺科 树脂组合物、固化物、层叠体、透明天线及其制造方法、以及图像显示装置
US12266618B2 (en) * 2022-02-18 2025-04-01 Advanced Semiconductor Engineering, Inc. Semiconductor device and method of manufacturing the same
US12597706B2 (en) 2022-04-08 2026-04-07 Advanced Semiconductor Engineering, Inc. Electronic device antenna package with multiple antennas
WO2024098356A1 (en) * 2022-11-11 2024-05-16 Innoscience (suzhou) Semiconductor Co., Ltd. Nitride-based semiconductor circuit and method for manufacturing thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018016489A1 (ja) * 2016-07-19 2018-01-25 日立化成株式会社 樹脂組成物、積層板及び多層プリント配線板

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4394266B2 (ja) * 2000-09-18 2010-01-06 カシオ計算機株式会社 半導体装置および半導体装置の製造方法
CN101819648A (zh) * 2004-10-13 2010-09-01 凸版资讯股份有限公司 非接触ic标签及其制造方法和制造装置
JP2006113750A (ja) * 2004-10-13 2006-04-27 Toppan Forms Co Ltd 非接触型データ受送信体
JP2006253953A (ja) * 2005-03-09 2006-09-21 Fujitsu Ltd 通信用高周波モジュールおよびその製造方法
JP4101814B2 (ja) * 2005-03-15 2008-06-18 富士通株式会社 高周波モジュール
JP4732128B2 (ja) * 2005-11-01 2011-07-27 太陽誘電株式会社 高周波無線モジュール
JP5303852B2 (ja) * 2006-04-13 2013-10-02 日立化成株式会社 セミｉｐｎ型複合体の樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP5435685B2 (ja) * 2007-02-28 2014-03-05 ナミックス株式会社 封止用樹脂フィルム
JP5435699B2 (ja) * 2009-03-06 2014-03-05 ナミックス株式会社 配線基板の製造方法、配線基板および半導体装置
JP5731148B2 (ja) * 2010-09-03 2015-06-10 ナミックス株式会社 フィルムアンテナおよびその製造方法、ならびに、それに用いるアンテナ基板用フィルム
JP5919200B2 (ja) * 2011-01-07 2016-05-18 株式会社ダイセル 硬化性エポキシ樹脂組成物
CN103140089A (zh) * 2011-12-05 2013-06-05 深圳富泰宏精密工业有限公司 壳体的制备方法及由该方法制得的壳体
JP5726787B2 (ja) * 2012-02-28 2015-06-03 株式会社東芝 無線装置、それを備えた情報処理装置および記憶装置
JP6031059B2 (ja) 2014-03-31 2016-11-24 信越化学工業株式会社 半導体装置、積層型半導体装置、封止後積層型半導体装置、及びこれらの製造方法
KR20170122722A (ko) * 2014-12-25 2017-11-06 리켄 테크노스 가부시키가이샤 전지 팩 보호 부재용 열가소성 엘라스토머 조성물
JP6570259B2 (ja) * 2015-02-11 2019-09-04 ナミックス株式会社 樹脂組成物、絶縁フィルム、および半導体装置
JP6682190B2 (ja) * 2015-04-17 2020-04-15 ナミックス株式会社 金属被膜付絶縁体、半導体装置、および金属被膜付絶縁体の製造方法
JP7148146B2 (ja) * 2017-02-22 2022-10-05 ナミックス株式会社 多層配線基板および半導体装置
KR102460870B1 (ko) * 2017-10-20 2022-10-31 삼성전기주식회사 인쇄회로기판
JP7020332B2 (ja) * 2018-07-26 2022-02-16 味の素株式会社 樹脂組成物
KR102426215B1 (ko) * 2018-12-04 2022-07-28 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018016489A1 (ja) * 2016-07-19 2018-01-25 日立化成株式会社 樹脂組成物、積層板及び多層プリント配線板

Also Published As

Publication number Publication date
TWI905217B (zh) 2025-11-21
US20230299461A1 (en) 2023-09-21
TW202220119A (zh) 2022-05-16
CN115812249A (zh) 2023-03-17
JP2025015763A (ja) 2025-01-30
KR20230035029A (ko) 2023-03-10
WO2022004409A1 (ja) 2022-01-06
KR102912082B1 (ko) 2026-01-13
JP7630847B2 (ja) 2025-02-18

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