CN115812249A - 带天线的半导体封装体和带天线的半导体封装体用树脂组合物 - Google Patents

带天线的半导体封装体和带天线的半导体封装体用树脂组合物 Download PDF

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Publication number
CN115812249A
CN115812249A CN202180047205.3A CN202180047205A CN115812249A CN 115812249 A CN115812249 A CN 115812249A CN 202180047205 A CN202180047205 A CN 202180047205A CN 115812249 A CN115812249 A CN 115812249A
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CN
China
Prior art keywords
antenna
semiconductor package
resin composition
styrene
insulating layer
Prior art date
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Pending
Application number
CN202180047205.3A
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English (en)
Chinese (zh)
Inventor
高杉宽史
宇佐美辽
小松史和
寺木慎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of CN115812249A publication Critical patent/CN115812249A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/18—Homopolymers or copolymers or tetrafluoroethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/442—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas

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  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Laminated Bodies (AREA)
  • Organic Insulating Materials (AREA)
CN202180047205.3A 2020-07-03 2021-06-17 带天线的半导体封装体和带天线的半导体封装体用树脂组合物 Pending CN115812249A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-115697 2020-07-03
JP2020115697 2020-07-03
PCT/JP2021/023019 WO2022004409A1 (ja) 2020-07-03 2021-06-17 アンテナ付き半導体パッケージ及びアンテナ付き半導体パッケージ用樹脂組成物

Publications (1)

Publication Number Publication Date
CN115812249A true CN115812249A (zh) 2023-03-17

Family

ID=79316066

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180047205.3A Pending CN115812249A (zh) 2020-07-03 2021-06-17 带天线的半导体封装体和带天线的半导体封装体用树脂组合物

Country Status (6)

Country Link
US (1) US20230299461A1 (https=)
JP (2) JP7630847B2 (https=)
KR (1) KR102912082B1 (https=)
CN (1) CN115812249A (https=)
TW (1) TWI905217B (https=)
WO (1) WO2022004409A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116867811A (zh) * 2021-02-22 2023-10-10 株式会社力森诺科 树脂组合物、固化物、层叠体、透明天线及其制造方法、以及图像显示装置
US12266618B2 (en) * 2022-02-18 2025-04-01 Advanced Semiconductor Engineering, Inc. Semiconductor device and method of manufacturing the same
US12597706B2 (en) 2022-04-08 2026-04-07 Advanced Semiconductor Engineering, Inc. Electronic device antenna package with multiple antennas
WO2024098356A1 (en) * 2022-11-11 2024-05-16 Innoscience (suzhou) Semiconductor Co., Ltd. Nitride-based semiconductor circuit and method for manufacturing thereof

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US20070013581A1 (en) * 2005-03-15 2007-01-18 Fujitsu Limited High-frequency module
JP2007302876A (ja) * 2006-04-13 2007-11-22 Hitachi Chem Co Ltd セミｉｐｎ型複合体の樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
WO2012093590A1 (ja) * 2011-01-07 2012-07-12 株式会社ダイセル 硬化性エポキシ樹脂組成物
JP2016147945A (ja) * 2015-02-11 2016-08-18 ナミックス株式会社 樹脂組成物、絶縁フィルム、および半導体装置
JP2016203426A (ja) * 2015-04-17 2016-12-08 ナミックス株式会社 金属被膜付絶縁体、半導体装置、および金属被膜付絶縁体の製造方法
CN109476923A (zh) * 2016-07-19 2019-03-15 日立化成株式会社 树脂组合物、层叠板及多层印刷线路板

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CN101819648A (zh) * 2004-10-13 2010-09-01 凸版资讯股份有限公司 非接触ic标签及其制造方法和制造装置
JP2006113750A (ja) * 2004-10-13 2006-04-27 Toppan Forms Co Ltd 非接触型データ受送信体
JP2006253953A (ja) * 2005-03-09 2006-09-21 Fujitsu Ltd 通信用高周波モジュールおよびその製造方法
JP4732128B2 (ja) * 2005-11-01 2011-07-27 太陽誘電株式会社 高周波無線モジュール
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JP5731148B2 (ja) * 2010-09-03 2015-06-10 ナミックス株式会社 フィルムアンテナおよびその製造方法、ならびに、それに用いるアンテナ基板用フィルム
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WO2012093590A1 (ja) * 2011-01-07 2012-07-12 株式会社ダイセル 硬化性エポキシ樹脂組成物
JP2016147945A (ja) * 2015-02-11 2016-08-18 ナミックス株式会社 樹脂組成物、絶縁フィルム、および半導体装置
JP2016203426A (ja) * 2015-04-17 2016-12-08 ナミックス株式会社 金属被膜付絶縁体、半導体装置、および金属被膜付絶縁体の製造方法
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Also Published As

Publication number Publication date
TWI905217B (zh) 2025-11-21
JPWO2022004409A1 (https=) 2022-01-06
US20230299461A1 (en) 2023-09-21
TW202220119A (zh) 2022-05-16
JP2025015763A (ja) 2025-01-30
KR20230035029A (ko) 2023-03-10
WO2022004409A1 (ja) 2022-01-06
KR102912082B1 (ko) 2026-01-13
JP7630847B2 (ja) 2025-02-18

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