TWI905217B - 天線半導體封裝及天線半導體封裝用樹脂組合物 - Google Patents

天線半導體封裝及天線半導體封裝用樹脂組合物

Info

Publication number
TWI905217B
TWI905217B TW110123749A TW110123749A TWI905217B TW I905217 B TWI905217 B TW I905217B TW 110123749 A TW110123749 A TW 110123749A TW 110123749 A TW110123749 A TW 110123749A TW I905217 B TWI905217 B TW I905217B
Authority
TW
Taiwan
Prior art keywords
antenna
resin composition
styrene
semiconductor package
semiconductor device
Prior art date
Application number
TW110123749A
Other languages
English (en)
Chinese (zh)
Other versions
TW202220119A (zh
Inventor
高杉寛史
宇佐美遼
小松史和
寺木慎
Original Assignee
日商納美仕有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW202220119A publication Critical patent/TW202220119A/zh
Application granted granted Critical
Publication of TWI905217B publication Critical patent/TWI905217B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/18—Homopolymers or copolymers or tetrafluoroethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/442—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Laminated Bodies (AREA)
  • Organic Insulating Materials (AREA)
TW110123749A 2020-07-03 2021-06-29 天線半導體封裝及天線半導體封裝用樹脂組合物 TWI905217B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-115697 2020-07-03
JP2020115697 2020-07-03

Publications (2)

Publication Number Publication Date
TW202220119A TW202220119A (zh) 2022-05-16
TWI905217B true TWI905217B (zh) 2025-11-21

Family

ID=79316066

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110123749A TWI905217B (zh) 2020-07-03 2021-06-29 天線半導體封裝及天線半導體封裝用樹脂組合物

Country Status (6)

Country Link
US (1) US20230299461A1 (https=)
JP (2) JP7630847B2 (https=)
KR (1) KR102912082B1 (https=)
CN (1) CN115812249A (https=)
TW (1) TWI905217B (https=)
WO (1) WO2022004409A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116867811A (zh) * 2021-02-22 2023-10-10 株式会社力森诺科 树脂组合物、固化物、层叠体、透明天线及其制造方法、以及图像显示装置
US12266618B2 (en) * 2022-02-18 2025-04-01 Advanced Semiconductor Engineering, Inc. Semiconductor device and method of manufacturing the same
US12597706B2 (en) 2022-04-08 2026-04-07 Advanced Semiconductor Engineering, Inc. Electronic device antenna package with multiple antennas
WO2024098356A1 (en) * 2022-11-11 2024-05-16 Innoscience (suzhou) Semiconductor Co., Ltd. Nitride-based semiconductor circuit and method for manufacturing thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060202312A1 (en) * 2005-03-09 2006-09-14 Fujitsu Limited Radio-frequency module for communication and method of manufacturing the same
CN101010684A (zh) * 2004-10-13 2007-08-01 凸版资讯股份有限公司 非接触ic标签及其制造方法和制造装置
US20080042266A1 (en) * 2004-10-13 2008-02-21 Toppan Forms Co., Ltd. Noncontact Ic Label and Method and Apparatus for Manufacturing the Same
TW201325371A (zh) * 2011-12-05 2013-06-16 Fih Hong Kong Ltd 殼體的製備方法及由該方法製得的殼體
TW201829584A (zh) * 2016-07-19 2018-08-16 日立化成股份有限公司 樹脂組成物、積層板及多層印刷配線板

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4394266B2 (ja) * 2000-09-18 2010-01-06 カシオ計算機株式会社 半導体装置および半導体装置の製造方法
JP4101814B2 (ja) * 2005-03-15 2008-06-18 富士通株式会社 高周波モジュール
JP4732128B2 (ja) * 2005-11-01 2011-07-27 太陽誘電株式会社 高周波無線モジュール
JP5303852B2 (ja) * 2006-04-13 2013-10-02 日立化成株式会社 セミｉｐｎ型複合体の樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP5435685B2 (ja) * 2007-02-28 2014-03-05 ナミックス株式会社 封止用樹脂フィルム
JP5435699B2 (ja) * 2009-03-06 2014-03-05 ナミックス株式会社 配線基板の製造方法、配線基板および半導体装置
JP5731148B2 (ja) * 2010-09-03 2015-06-10 ナミックス株式会社 フィルムアンテナおよびその製造方法、ならびに、それに用いるアンテナ基板用フィルム
JP5919200B2 (ja) * 2011-01-07 2016-05-18 株式会社ダイセル 硬化性エポキシ樹脂組成物
JP5726787B2 (ja) * 2012-02-28 2015-06-03 株式会社東芝 無線装置、それを備えた情報処理装置および記憶装置
JP6031059B2 (ja) 2014-03-31 2016-11-24 信越化学工業株式会社 半導体装置、積層型半導体装置、封止後積層型半導体装置、及びこれらの製造方法
KR20170122722A (ko) * 2014-12-25 2017-11-06 리켄 테크노스 가부시키가이샤 전지 팩 보호 부재용 열가소성 엘라스토머 조성물
JP6570259B2 (ja) * 2015-02-11 2019-09-04 ナミックス株式会社 樹脂組成物、絶縁フィルム、および半導体装置
JP6682190B2 (ja) * 2015-04-17 2020-04-15 ナミックス株式会社 金属被膜付絶縁体、半導体装置、および金属被膜付絶縁体の製造方法
JP7148146B2 (ja) * 2017-02-22 2022-10-05 ナミックス株式会社 多層配線基板および半導体装置
KR102460870B1 (ko) * 2017-10-20 2022-10-31 삼성전기주식회사 인쇄회로기판
JP7020332B2 (ja) * 2018-07-26 2022-02-16 味の素株式会社 樹脂組成物
KR102426215B1 (ko) * 2018-12-04 2022-07-28 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101010684A (zh) * 2004-10-13 2007-08-01 凸版资讯股份有限公司 非接触ic标签及其制造方法和制造装置
US20080042266A1 (en) * 2004-10-13 2008-02-21 Toppan Forms Co., Ltd. Noncontact Ic Label and Method and Apparatus for Manufacturing the Same
US20060202312A1 (en) * 2005-03-09 2006-09-14 Fujitsu Limited Radio-frequency module for communication and method of manufacturing the same
TW201325371A (zh) * 2011-12-05 2013-06-16 Fih Hong Kong Ltd 殼體的製備方法及由該方法製得的殼體
TW201829584A (zh) * 2016-07-19 2018-08-16 日立化成股份有限公司 樹脂組成物、積層板及多層印刷配線板

Also Published As

Publication number Publication date
JPWO2022004409A1 (https=) 2022-01-06
US20230299461A1 (en) 2023-09-21
TW202220119A (zh) 2022-05-16
CN115812249A (zh) 2023-03-17
JP2025015763A (ja) 2025-01-30
KR20230035029A (ko) 2023-03-10
WO2022004409A1 (ja) 2022-01-06
KR102912082B1 (ko) 2026-01-13
JP7630847B2 (ja) 2025-02-18

Similar Documents

Publication Publication Date Title
TWI905217B (zh) 天線半導體封裝及天線半導體封裝用樹脂組合物
JP7378494B2 (ja) 共重合体及びこれを含む積層体
CN105051111B (zh) 树脂组合物以及采用其得到的粘接膜、覆盖膜、层间粘接剂
KR102323672B1 (ko) 수지 조성물 및 이를 사용한 절연 필름 및 반도체 장치
JP7428815B2 (ja) 組成物及びその硬化体
CN107113968B (zh) 挠性印刷布线板用树脂膜、带有树脂的金属箔、覆盖膜、粘结片和挠性印刷布线板
TWI910362B (zh) 樹脂組成物及其製造方法以及接著薄膜及層間接著用黏合片
JP2022085610A (ja) 組成物及びその硬化物
WO2023090351A1 (ja) 樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板及び半導体パッケージ
JP7569954B1 (ja) 熱硬化性接着剤組成物、熱硬化性接着シート及びプリント配線板
JP7513467B2 (ja) グラフト変性ポリメチルペンテン組成物、成形品、及び銅張積層板
JP2023013224A (ja) アンテナモジュール用積層板の製造方法、アンテナ装置の製造方法、アンテナモジュールの製造方法及び通信装置の製造方法
TW202607107A (zh) 熱硬化性接著劑組合物、熱硬化性接著片及印刷佈線板
TW202423200A (zh) 電路基板之製造方法
Moon et al. Adhesion and RF properties of electrically conductive adhesives
CN117777663A (zh) 一种树脂组合物及其应用
TW201718748A (zh) 樹脂組合物及應用該樹脂組合物的膠片及電路板