KR102388646B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR102388646B1
KR102388646B1 KR1020207022192A KR20207022192A KR102388646B1 KR 102388646 B1 KR102388646 B1 KR 102388646B1 KR 1020207022192 A KR1020207022192 A KR 1020207022192A KR 20207022192 A KR20207022192 A KR 20207022192A KR 102388646 B1 KR102388646 B1 KR 102388646B1
Authority
KR
South Korea
Prior art keywords
substrate
processing
tank
treatment tank
arrangement direction
Prior art date
Application number
KR1020207022192A
Other languages
English (en)
Korean (ko)
Other versions
KR20200099610A (ko
Inventor
마사유키 오리사카
마사노부 사토
마사히로 기무라
이치로 미츠요시
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Priority to KR1020227011423A priority Critical patent/KR102429858B1/ko
Publication of KR20200099610A publication Critical patent/KR20200099610A/ko
Application granted granted Critical
Publication of KR102388646B1 publication Critical patent/KR102388646B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
KR1020207022192A 2018-03-19 2018-11-22 기판 처리 장치 KR102388646B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227011423A KR102429858B1 (ko) 2018-03-19 2018-11-22 기판 처리 장치

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018051050A JP7002969B2 (ja) 2018-03-19 2018-03-19 基板処理装置
JPJP-P-2018-051050 2018-03-19
PCT/JP2018/043203 WO2019181067A1 (fr) 2018-03-19 2018-11-22 Dispositif de traitement de substrat

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020227011423A Division KR102429858B1 (ko) 2018-03-19 2018-11-22 기판 처리 장치

Publications (2)

Publication Number Publication Date
KR20200099610A KR20200099610A (ko) 2020-08-24
KR102388646B1 true KR102388646B1 (ko) 2022-04-19

Family

ID=67987015

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020207022192A KR102388646B1 (ko) 2018-03-19 2018-11-22 기판 처리 장치
KR1020227011423A KR102429858B1 (ko) 2018-03-19 2018-11-22 기판 처리 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020227011423A KR102429858B1 (ko) 2018-03-19 2018-11-22 기판 처리 장치

Country Status (5)

Country Link
JP (1) JP7002969B2 (fr)
KR (2) KR102388646B1 (fr)
CN (1) CN111886675B (fr)
TW (1) TWI710048B (fr)
WO (1) WO2019181067A1 (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3343033B2 (ja) 1996-06-28 2002-11-11 大日本スクリーン製造株式会社 基板処理装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61125136A (ja) * 1984-11-22 1986-06-12 Hitachi Ltd 処理槽
JPH0310253A (ja) * 1989-06-07 1991-01-17 Fujitsu Ltd フォトマスクの処理方法
JPH0480040U (fr) * 1990-11-26 1992-07-13
JP2970894B2 (ja) * 1993-04-07 1999-11-02 東京エレクトロン株式会社 洗浄装置
JP2912538B2 (ja) * 1993-12-08 1999-06-28 大日本スクリーン製造株式会社 浸漬型基板処理装置
JPH0817782A (ja) * 1994-06-28 1996-01-19 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH08195431A (ja) * 1995-01-12 1996-07-30 Tokyo Electron Ltd 基板保持具及び洗浄装置
JPH10303167A (ja) * 1997-04-28 1998-11-13 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000012497A (ja) * 1998-06-22 2000-01-14 Toho Kasei Kk 被処理体処理装置
JP2000070886A (ja) * 1998-09-03 2000-03-07 Toho Kasei Kk 基板処理装置
JP2002134467A (ja) 2000-10-26 2002-05-10 Daikin Ind Ltd 基板処理装置
JP2007019238A (ja) * 2005-07-07 2007-01-25 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4781253B2 (ja) * 2006-12-22 2011-09-28 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4767204B2 (ja) * 2007-03-26 2011-09-07 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP2009231579A (ja) * 2008-03-24 2009-10-08 Dainippon Screen Mfg Co Ltd 基板処理装置及び基板処理方法
JP5394784B2 (ja) * 2009-03-24 2014-01-22 大日本スクリーン製造株式会社 基板洗浄装置
JP6287750B2 (ja) * 2013-12-27 2018-03-07 東京エレクトロン株式会社 基板液処理装置
JP2017117926A (ja) * 2015-12-24 2017-06-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6617036B2 (ja) 2016-01-18 2019-12-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3343033B2 (ja) 1996-06-28 2002-11-11 大日本スクリーン製造株式会社 基板処理装置

Also Published As

Publication number Publication date
TWI710048B (zh) 2020-11-11
KR20220047406A (ko) 2022-04-15
TW201939647A (zh) 2019-10-01
CN111886675B (zh) 2024-03-26
JP2019165067A (ja) 2019-09-26
WO2019181067A1 (fr) 2019-09-26
KR20200099610A (ko) 2020-08-24
CN111886675A (zh) 2020-11-03
JP7002969B2 (ja) 2022-01-20
KR102429858B1 (ko) 2022-08-04

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