KR102356740B1 - 스위치 소자 및 기억 장치 - Google Patents
스위치 소자 및 기억 장치 Download PDFInfo
- Publication number
- KR102356740B1 KR102356740B1 KR1020150003278A KR20150003278A KR102356740B1 KR 102356740 B1 KR102356740 B1 KR 102356740B1 KR 1020150003278 A KR1020150003278 A KR 1020150003278A KR 20150003278 A KR20150003278 A KR 20150003278A KR 102356740 B1 KR102356740 B1 KR 102356740B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- memory
- switch
- switch element
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
-
- H01L27/2427—
-
- H01L27/02—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
- H10B63/24—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes of the Ovonic threshold switching type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/24—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
- H10N70/245—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies the species being metal cations, e.g. programmable metallization cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/841—Electrodes
- H10N70/8416—Electrodes adapted for supplying ionic species
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8822—Sulfides, e.g. CuS
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8825—Selenides, e.g. GeSe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/883—Oxides or nitrides
- H10N70/8833—Binary metal oxides, e.g. TaOx
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/24—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
Landscapes
- Semiconductor Memories (AREA)
- Mram Or Spin Memory Techniques (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2014-007265 | 2014-01-17 | ||
| JP2014007265A JP6151650B2 (ja) | 2014-01-17 | 2014-01-17 | 記憶装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150086182A KR20150086182A (ko) | 2015-07-27 |
| KR102356740B1 true KR102356740B1 (ko) | 2022-01-28 |
Family
ID=53545587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150003278A Expired - Fee Related KR102356740B1 (ko) | 2014-01-17 | 2015-01-09 | 스위치 소자 및 기억 장치 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US9543512B2 (enExample) |
| JP (1) | JP6151650B2 (enExample) |
| KR (1) | KR102356740B1 (enExample) |
| TW (1) | TWI661535B (enExample) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8884261B2 (en) | 2010-08-23 | 2014-11-11 | Crossbar, Inc. | Device switching using layered device structure |
| US9685608B2 (en) | 2012-04-13 | 2017-06-20 | Crossbar, Inc. | Reduced diffusion in metal electrode for two-terminal memory |
| US9741765B1 (en) | 2012-08-14 | 2017-08-22 | Crossbar, Inc. | Monolithically integrated resistive memory using integrated-circuit foundry compatible processes |
| JP6151650B2 (ja) * | 2014-01-17 | 2017-06-21 | ソニーセミコンダクタソリューションズ株式会社 | 記憶装置 |
| US10290801B2 (en) * | 2014-02-07 | 2019-05-14 | Crossbar, Inc. | Scalable silicon based resistive memory device |
| US9716225B2 (en) | 2014-09-03 | 2017-07-25 | Micron Technology, Inc. | Memory cells including dielectric materials, memory devices including the memory cells, and methods of forming same |
| EP3262651B1 (en) * | 2015-08-07 | 2021-07-21 | Hewlett Packard Enterprise Development LP | Crossbar arrays for calculating matrix multiplication |
| CN105514136A (zh) * | 2016-01-26 | 2016-04-20 | 上海新储集成电路有限公司 | 三维阻变存储器的制备方法 |
| JP6567441B2 (ja) * | 2016-02-09 | 2019-08-28 | 株式会社東芝 | 超格子メモリ及びクロスポイント型メモリ装置 |
| US9741764B1 (en) | 2016-02-22 | 2017-08-22 | Samsung Electronics Co., Ltd. | Memory device including ovonic threshold switch adjusting threshold voltage thereof |
| KR101854023B1 (ko) * | 2016-02-23 | 2018-05-02 | 연세대학교 산학협력단 | 비선형 스위치 소자, 이의 제조 방법 및 이를 포함하는 비휘발성 메모리 소자 |
| KR102453349B1 (ko) | 2016-02-25 | 2022-10-07 | 삼성전자주식회사 | 가변 저항 메모리 장치 및 이의 제조 방법 |
| KR102578481B1 (ko) * | 2016-03-15 | 2023-09-14 | 삼성전자주식회사 | 반도체 메모리 소자 및 이의 제조방법 |
| KR102495000B1 (ko) * | 2016-03-18 | 2023-02-02 | 삼성전자주식회사 | 반도체 소자 및 이의 제조방법 |
| KR102483704B1 (ko) * | 2016-03-30 | 2023-01-02 | 삼성전자주식회사 | 가변 저항 메모리 장치 및 그 제조 방법 |
| KR101889600B1 (ko) * | 2016-03-31 | 2018-08-17 | 연세대학교 산학협력단 | 비휘발성 메모리 소자 및 이의 제조 방법 |
| JP2017224688A (ja) * | 2016-06-14 | 2017-12-21 | ソニー株式会社 | 回路素子、記憶装置、電子機器、回路素子への情報の書き込み方法、および回路素子からの情報の読み出し方法 |
| KR102530067B1 (ko) * | 2016-07-28 | 2023-05-08 | 삼성전자주식회사 | 가변 저항 메모리 소자 및 그 제조 방법 |
| KR102584288B1 (ko) | 2016-08-03 | 2023-09-27 | 삼성전자주식회사 | 비휘발성 메모리 장치 |
| US11348973B2 (en) * | 2016-09-23 | 2022-05-31 | Intel Corporation | Threshold switching selector based memory |
| US11183633B2 (en) | 2016-10-04 | 2021-11-23 | Sony Semiconductor Solutions Corporation | Switch device, storage apparatus, and memory system |
| US10658588B2 (en) * | 2017-04-06 | 2020-05-19 | Sony Corporation | Memory cell switch device |
| US10861902B2 (en) | 2017-06-13 | 2020-12-08 | Samsung Electronics Co., Ltd. | Semiconductor device having magnetic tunnel junction pattern |
| KR102366798B1 (ko) | 2017-06-13 | 2022-02-25 | 삼성전자주식회사 | 반도체 소자 |
| US10672833B2 (en) | 2017-07-26 | 2020-06-02 | Micron Technology, Inc. | Semiconductor devices including a passive material between memory cells and conductive access lines, and related electronic devices |
| KR102465179B1 (ko) | 2018-01-18 | 2022-11-08 | 에스케이하이닉스 주식회사 | 선택 소자, 이의 제조 방법 및 이를 포함하는 비휘발성 메모리 소자 |
| US11024372B2 (en) | 2018-08-13 | 2021-06-01 | Micron Technology, Inc. | Segregation-based memory |
| KR102630031B1 (ko) * | 2018-10-05 | 2024-01-30 | 삼성전자주식회사 | 가변 저항 메모리 장치 |
| KR20200041031A (ko) | 2018-10-11 | 2020-04-21 | 삼성전자주식회사 | 가변 저항 메모리 소자 |
| KR102130219B1 (ko) * | 2018-10-30 | 2020-07-03 | 연세대학교 산학협력단 | 비선형 스위치 소자, 이의 제조 방법 및 이를 포함하는 비휘발성 메모리 소자 |
| JP2021103749A (ja) | 2019-12-25 | 2021-07-15 | キオクシア株式会社 | 抵抗変化素子 |
| US11271155B2 (en) * | 2020-03-10 | 2022-03-08 | International Business Machines Corporation | Suppressing oxidation of silicon germanium selenium arsenide material |
| CN111584710B (zh) * | 2020-04-10 | 2023-09-26 | 中国科学院上海微系统与信息技术研究所 | 一种ots材料、选通器单元及其制备方法 |
| JP2022051104A (ja) | 2020-09-18 | 2022-03-31 | キオクシア株式会社 | スイッチング素子 |
| US11271040B1 (en) * | 2020-10-21 | 2022-03-08 | Western Digital Technologies, Inc. | Memory device containing selector with current focusing layer and methods of making the same |
| JP2022139933A (ja) | 2021-03-12 | 2022-09-26 | キオクシア株式会社 | 磁気記憶装置及び磁気記憶装置の製造方法 |
| KR102855972B1 (ko) * | 2021-10-27 | 2025-09-04 | 고쿠리츠켄큐카이하츠호진 상교기쥬츠 소고켄큐쇼 | 비정질 재료 및 크로스포인트형 메모리 |
| CN114242748A (zh) * | 2021-12-20 | 2022-03-25 | 厦门半导体工业技术研发有限公司 | 一种存储单元组及其制造方法 |
| CN114420838A (zh) * | 2021-12-30 | 2022-04-29 | 长江先进存储产业创新中心有限责任公司 | 相变存储器及其制造方法 |
| JP2023137900A (ja) * | 2022-03-18 | 2023-09-29 | キオクシア株式会社 | スイッチング素子及び記憶装置 |
| CN115696011B (zh) * | 2022-10-27 | 2024-05-14 | 华中科技大学 | 一种基于相变材料的电可控彩色滤光阵列及人工视觉系统 |
| WO2024219141A1 (ja) * | 2023-04-20 | 2024-10-24 | 国立大学法人東北大学 | 抵抗変化材料、スイッチ素子用材料、スイッチ層、スイッチ素子及び記憶装置 |
| WO2024219142A1 (ja) * | 2023-04-20 | 2024-10-24 | 国立大学法人東北大学 | 抵抗変化材料、スイッチ素子用材料、スイッチ層、スイッチ素子及び記憶装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009545095A (ja) * | 2006-07-27 | 2009-12-17 | エッセティマイクロエレクトロニクス ソシエタ ア レスポンサビリタ リミタータ | 相変化メモリデバイス |
| JP2010531062A (ja) * | 2007-06-22 | 2010-09-16 | オヴォニクス,インコーポレイテッド | 改善動作特性を有する多層カルコゲナイド及び関連デバイス |
| JP2012019042A (ja) * | 2010-07-07 | 2012-01-26 | Sony Corp | 記憶素子および記憶装置 |
| WO2013039496A1 (en) * | 2011-09-14 | 2013-03-21 | Intel Corporation | Electrodes for resistance change memory devices |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6806526B2 (en) * | 2001-08-13 | 2004-10-19 | Advanced Micro Devices, Inc. | Memory device |
| US7687830B2 (en) * | 2004-09-17 | 2010-03-30 | Ovonyx, Inc. | Phase change memory with ovonic threshold switch |
| US7646630B2 (en) * | 2004-11-08 | 2010-01-12 | Ovonyx, Inc. | Programmable matrix array with chalcogenide material |
| US7414883B2 (en) * | 2006-04-20 | 2008-08-19 | Intel Corporation | Programming a normally single phase chalcogenide material for use as a memory or FPLA |
| US20100165716A1 (en) | 2008-12-30 | 2010-07-01 | Stmicroelectronics S.R.L. | Nonvolatile memory with ovonic threshold switches |
| US7983065B2 (en) * | 2009-04-08 | 2011-07-19 | Sandisk 3D Llc | Three-dimensional array of re-programmable non-volatile memory elements having vertical bit lines |
| JP5420436B2 (ja) * | 2010-01-15 | 2014-02-19 | 株式会社日立製作所 | 不揮発性記憶装置およびその製造方法 |
| JP6151650B2 (ja) * | 2014-01-17 | 2017-06-21 | ソニーセミコンダクタソリューションズ株式会社 | 記憶装置 |
| US9716225B2 (en) * | 2014-09-03 | 2017-07-25 | Micron Technology, Inc. | Memory cells including dielectric materials, memory devices including the memory cells, and methods of forming same |
-
2014
- 2014-01-17 JP JP2014007265A patent/JP6151650B2/ja not_active Expired - Fee Related
- 2014-12-22 TW TW103144866A patent/TWI661535B/zh not_active IP Right Cessation
-
2015
- 2015-01-06 US US14/590,014 patent/US9543512B2/en not_active Expired - Fee Related
- 2015-01-09 KR KR1020150003278A patent/KR102356740B1/ko not_active Expired - Fee Related
-
2016
- 2016-12-14 US US15/379,209 patent/US20170098683A1/en not_active Abandoned
- 2016-12-14 US US15/379,390 patent/US20170098684A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009545095A (ja) * | 2006-07-27 | 2009-12-17 | エッセティマイクロエレクトロニクス ソシエタ ア レスポンサビリタ リミタータ | 相変化メモリデバイス |
| JP2010531062A (ja) * | 2007-06-22 | 2010-09-16 | オヴォニクス,インコーポレイテッド | 改善動作特性を有する多層カルコゲナイド及び関連デバイス |
| JP2012019042A (ja) * | 2010-07-07 | 2012-01-26 | Sony Corp | 記憶素子および記憶装置 |
| WO2013039496A1 (en) * | 2011-09-14 | 2013-03-21 | Intel Corporation | Electrodes for resistance change memory devices |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150086182A (ko) | 2015-07-27 |
| TW201535680A (zh) | 2015-09-16 |
| JP6151650B2 (ja) | 2017-06-21 |
| US20170098683A1 (en) | 2017-04-06 |
| JP2015135917A (ja) | 2015-07-27 |
| US20150207066A1 (en) | 2015-07-23 |
| US9543512B2 (en) | 2017-01-10 |
| TWI661535B (zh) | 2019-06-01 |
| US20170098684A1 (en) | 2017-04-06 |
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